Electronic component for an electronic carrier substrate
Disclosed are an electronic component, an assembly of an electronic component and an electronic carrier substrate, and a method of connecting the electronic component to the carrier substrate. The carrier substrate has a first coefficient of thermal expansion (CTE), and the electronic component has a second CTE. The assembly further comprises a conductive material on the carrier substrate for connecting the electronic component to the carrier substrate, and the electrical component is connected to the carrier substrate by heating and then cooling this conductive material. The electronic component includes an expansion joint to allow the electronic component to expand and contract relative to the carrier substrate during the heating and cooling of the conductive material.
1. A method of connecting an electronic component to an electronic carrier substrate, said component having an expansion joint and a first coefficient of thermal expansion (CTE), and the carrier substrate having a second CTE, the method comprising the steps of:
depositing an electronically conductive material on the carrier substrate; placing said electronic component on the conductive material; and
heating and then cooling the conductive material to connect the electronic component to the carrier substrate; and
wherein during the heating and cooling, the expansion joint of the component enables said component to expand and contract relative to the carrier substrate; and
said electronic component includes first and second separate sections, and the expansion joint connects said first and second sections together and allows said first and second sections to slide along the substrate, and relative to each other and relative to the expansion joint, during said heating and cooling of the conductive material.
2. A method according to claim 1 , wherein:
the carrier substrate has a substantially planar surface; and
said expansion joint enables said first and second sections to move relative to each other in a direction parallel to said planar surface when said at least one component is connected to the carrier substrate.
3. A method according to claim 1 , wherein at least one of said separate sections is slidably connected to the expansion joint.
4. A method according to claim 1 , wherein said first and second sections are slidably connected to the expansion joint.
5. A method according to claim 1 , wherein:
said at least one component is a DIMM connector; and
said conductive material is a solder.
6. A method according to claim 5 , wherein:
the heating and then cooling step includes the step of using reflow and cooling processes to connect the DIMM connector to the carrier substrate by means of the solder; and
the expansion joint holds a true position of the connector solder tail leads while allowing the connector to expand during the reflow and cooling processes to reduce the effect of CTE differential.
7. The method according to claim 2 , wherein said heating and then cooling includes heating the electrically conductive material above the melting temperature of said electrically conductive material.
8. The method according to claim 7 , wherein
the electronic component is a DIMM connector; and
the electronically conductive material is a solder.