IP Library Granted Patent US 9,184,472
Granted Patent B2
US 9,184,472 · App. 12/832,024 · Granted Nov 10, 2015

Battery pack and method of manufacturing battery pack with interconnected half contact pads

Inventor: Seongpyo Hong (Yongin-si, KR)
Assignee: Samsung SDI Co., Ltd.
H01M10/425H01M2/1055H01M2/204Y10T29/53135
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Quick Facts
Patent No.
US 9,184,472
App. No.
12/832,024
Granted
Nov 10, 2015
Kind
B2
Abstract

A method of manufacturing a battery pack of a plurality of bare cells is disclosed. The method comprises: preparing a protective circuit module comprising N pads, wherein each pad comprises a first half pad and a second half pad, N is a natural number greater than 1, the plurality of bare cells comprises M tabs, and M is a natural number equal to N; connecting first through M th tabs to the first half pads of first through N th pads, respectively; and electrically connecting the first half pads to the second half pads in a sequential order of potential.

Claims (14)

1. A battery pack comprising:

a plurality of bare cells; and

a protective circuit module defining a first surface electrically connected to the bare cells,

wherein the protective circuit module includes N pads, wherein each pad comprises a first half pad and a second half pad positioned adjacent to each other on the first surface of the protective circuit module so that the first half pad and the second half pad are co-planar and are spaced apart from each other so that a portion of the first surface of the protective circuit module is interposed between the first and second half pads which defines a gap, N is a natural number that is greater than 1, and the first half pad is electrically connected to the second half pad wherein the first and second half pads are formed of copper and each define a zig-zag edge that is separated by the surface of the protective circuit module so that the location of the gap between the first and second half pads is displaced across the width of the pad; and

a plurality of leads plates that interconnect the plurality of cells to the plurality of first half pads; and

a plurality of connectors made of solder that interconnect the plurality of first half pads to the adjacent plurality of second half pads so as to extend between the zig-zag edges wherein the plurality of connectors are deposited onto the portion of the first surface of the protective circuit module that is interposed between the first and second half pads.

2. The battery pack as claimed in claim 1 , wherein first through N th pads are disposed on an upper surface of the protective circuit module.

3. The battery pack as claimed in claim 1 , wherein the first half pads of the first through N th pads are electrically connected to second half pads of the first through N th tabs, respectively.

4. The battery pack as claimed in claim 3 , wherein the first through N th tabs are electrically connected to lead plates configured to connect the bare cells.

5. The battery pack as claimed in claim 1 , wherein the first half pad is electrically insulated from a conductive metal pattern in the protective circuit module.

6. The battery pack as claimed in claim 1 , wherein the second half pad is electrically connected to a conductive metal pattern in the protective circuit module.

7. The battery pack as claimed in claim 3 , wherein the first half pads are connected to the first through M th tabs through one of a resistance welding operation and a laser welding operation.

8. The battery pack as claimed in claim 1 , wherein the first half pad is connected to the second half pad through a soldering operation.

9. The battery pack as claimed in claim 1 , wherein each first half pad is connected to each second half pads by one of the plurality of connectors.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2010
From: HONG, SEONGPYO
To: SAMSUNG SDI CO., LTD.
Reel/Frame 024653/0091 →
Priority Claims (1)
KR 10-2009-0068946 · Jul 28, 2009 · national
Continuity (1)
Related Publication 20110027622A1 · Feb 3, 2011