IP Library › Granted Patent US 7,898,177
Granted Patent B2
US 7,898,177 · App. 12/832,066 · Granted Mar 1, 2011

Light emitting apparatus

Assignee: Nichia Corporation
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Quick Facts
Patent No.
US 7,898,177
App. No.
12/832,066
Granted
Mar 1, 2011
Kind
B2
Abstract

A light emitting apparatus includes a light emitting device mounted on a base. First and second leads are electrically connected to the light emitting device. A first resin molding member formed of thermosetting resin covers at least partially the base and the first and second leads so that the first resin molding member is formed integrally with the base and the first and second leads. A second resin molding member formed of thermosetting resin is in contact with at least a part of the first resin molding member and covers the light emitting device. A recessed portion is formed in the first resin molding member on a light emitting device mount surface side of the base to open upward and to have a side surface. A protection device is mounted on the first lead or the second lead. The protection device is covered by the first resin molding member.

Claims (26)

1. A light emitting apparatus comprising:

a light emitting device;

a base that is provided with the light emitting device mounted thereon;

a first lead and a second lead that are electrically connected to the light emitting device;

a first resin molding member that is formed of resin that covers at least partially the base and the first lead and the second lead so that the first resin molding member is formed integrally with the base and the first lead and the second lead; and

a second resin molding member that is in contact with at least a part of the first resin molding member and covers the light emitting device,

wherein the first and second resin molding members are formed of a thermosetting resin material,

wherein a recessed portion is formed in the first resin molding member on a light emitting device mount surface side of the base to open upward and to have a side surface, and

wherein a protection device is mounted on the first lead or the second lead, and the protection device is covered by the first resin molding member.

2. The light emitting apparatus according to claim 1 , wherein the light emitting device includes first and second electrodes, wherein

the first lead includes

a first inner lead portion that includes a connection part that is exposed in the bottom surface area of the recessed portion and is electrically connected to the first electrode of the light emitting device, and a first lead embedded part that is covered by the first resin molding member, and

a first outer lead portion that extends from the first inner lead portion outward of the first resin molding member and is exposed externally of the first resin molding member, wherein

the second lead includes

a second inner lead portion that includes a connection part that is exposed in the bottom surface area of the recessed portion and is electrically connected to the second electrode of the light emitting device, and a second lead embedded part that is covered by the first resin molding member, and

a second outer lead portion that extends from the second inner lead portion outward of the first resin molding member and is exposed externally of the first resin molding member.

3. The light emitting apparatus according to claim 1 , wherein the base is at least partially exposed in the bottom surface area of the recessed portion in the first resin molding member, wherein the light emitting device is mounted in the exposed part of the base.

4. The light emitting apparatus according to claim 2 , wherein the base and the connection parts of the first and second leads are spaced away and are insulated from each other.

5. The light emitting apparatus according to claim 1 , wherein the base is at least partially exposed from the first resin molding member on a back surface of the base opposite to the mount surface on which the light emitting device is mounted.

6. The light emitting apparatus according to claim 5 , wherein the first and second leads are at least partially exposed from the first resin molding member on back surfaces of the first and second leads opposite to mount surfaces of the first and second leads that are electrically connected to the light emitting device.

7. The light emitting apparatus according to claim 6 , wherein at least two of the exposed portions of the back surfaces of the base and the first and second leads are arranged coplanar with each other.

8. The light emitting apparatus according to claim 6 , wherein a thermally conductive heat dissipation member is at least partially coupled onto the exposed portions of the back surfaces of the base and the first and second leads.

9. The light emitting apparatus according to claim 1 , wherein the first resin molding member is formed by transfer molding.

10. The light emitting apparatus according to claim 1 , wherein the first resin molding member is formed of at least one material selected from the group consisting of epoxy resin, denatured epoxy resin, silicone resin, denatured silicone resin, acrylate resin, urethane resin, and polyimide resin.

11. The light emitting apparatus according to claim 1 , wherein the first resin molding member contains at least one material selected from the group consisting of filler, diffusion material, pigment, fluorescent material, reflexive material, light shielding material, ultraviolet absorption material, antioxidant material, and mold release agent.

12. The light emitting apparatus according to claim 1 , wherein the second resin molding member contains at least one material selected from the group consisting of filler, diffusion material, pigment, fluorescent material, reflexive material, ultraviolet absorption material, and antioxidant material.

Priority Claims (1)
JP 2007-146176 · May 31, 2007 · national
Continuity (2)
Continuation 12129986 · May 30, 2008
Related Publication 20100264449A1 · Oct 21, 2010