Metal-oxide semiconductor transistor
View Patent ↗A method for fabricating a metal-oxide semiconductor (MOS) transistor is disclosed. The method includes the steps of: providing a semiconductor substrate; forming a silicon layer on the semiconductor substrate; performing a first photo-etching process on the silicon layer for forming a gate pattern; forming an epitaxial layer in the semiconductor substrate adjacent to two sides of the gate pattern; and performing a second photo-etching process on the gate pattern to form a slot in the gate pattern while using the gate pattern to physically separate the gate pattern into two gates.
1. A metal-oxide semiconductor (MOS) transistor, comprising:
a semiconductor substrate including a shallow trench isolation;
a first photo-etched layer comprising a gate disposed on the semiconductor substrate,
wherein the gate comprises four sidewalls, and two of the four sidewalls opposite to each other comprise a spacer thereon while the other two sidewalls opposite to each other comprise no said spacer, wherein the gate is of a rectangular shape and has a second photo-etched slot directly formed on one sidewall of the gate and exposing the shallow trench isolation, of which no spacer is disposed thereon;
a recess in the semiconductor substrate adjacent two sides of the spacers; and
an epitaxial layer disposed in the recess in the semiconductor substrate adjacent to two sides of the spacer; and
wherein the second photo-etched slot is formed without a line end bridge.
2. The MOS transistor of claim 1 , wherein the spacer comprises a first spacer and a second spacer.
3. The MOS transistor of claim 2 , wherein each of the first spacer and the second spacer comprises silicon oxide and silicon nitride.
4. The MOS transistor of claim 1 , wherein the epitaxial layer comprises silicon germanium or silicon carbide.
5. The MOS transistor of claim 1 , wherein the slot is not on top of an active region.