Insulation paper with high thermal conductivity materials
The present invention provides for a high thermal conductivity (HTC) paper that comprises a host matrix, such as mica, and HTC materials intercalated into the host matrix. The HTC materials are comprised of at least one of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers.
1. A structurally stable mica paper comprising:
a host matrix comprising mica flakes defining an electrical insulation layer; and
high thermal conductivity materials intercalated within interstices of the host matrix comprising mica flakes;
wherein the high thermal conductivity materials comprise nanofiller particles, nanofiller particles with diamond like coatings, or combinations thereof, the high thermal conductivity materials comprising an aspect ratio of from 3-100;
wherein the high thermal conductivity materials are disposed within the host matrix in the form of filamentary or dendritic structures so as to achieve a structurally stable discrete two phase composite; and
wherein the structurally stable mica paper is free from resin.
2. The paper of claim 1 , wherein the high thermal conductivity materials comprise 0.1-65% by volume of the paper.
3. The paper of claim 2 , wherein the high thermal conductivity materials comprise 1-25% by volume of the paper.
4. The paper of claim 1 , wherein the resistivity of the paper is about 10 12 - 10 16 Ohm cm.
5. The paper of claim 1 , wherein the high thermal conductivity materials are comprised of nanofillers.
6. The paper of claim 1 , wherein the high thermal conductivity materials are comprised of nanofillers with diamond like coatings.
7. The paper of claim 1 , wherein the paper is combined into an electrical insulation tape.
8. The paper of claim 1 , wherein the high thermal conductivity materials have an aspect ratio of from 10-50.
9. The paper of claim 1 , wherein the at least one of nanofillers and nanofillers with diamond like coatings have a dimension of from 1-1000 nm.
10. The paper of claim 1 , wherein the high thermal conductivity materials are disposed within the host matrix in the form of dendritic structures.
11. The paper of claim 1 , wherein the high thermal conductivity materials comprise at least one of silica, alumina, magnesium oxide, silicon carbide, boron nitride, aluminum nitride, zinc oxide, or a diamond material.
12. A high thermal conductivity composite material comprising:
a mixture comprising mica flakelets as a host matrix and high thermal conductivity materials;
wherein the high thermal conductivity materials comprise nanofiller particles, nanofiller particles with diamond like coatings, or combinations thereof;
wherein the high thermal conductivity materials comprise an aspect ratio of from 3-100;
wherein the high thermal conductivity materials are disposed within the host matrix in the form of filamentary or dendritic structures so as to achieve a structurally stable discrete two phase composite; and
wherein the high thermal conductivity composite material is free from resin.
13. The high thermal conductivity composite material of claim 12 , wherein the composite material is in the form of a dry solid mixture.
14. The high thermal conductivity composite material of claim 12 , wherein the composite material is in the form of a slurry.
15. The high thermal conductivity composite material of claim 12 , wherein the composite material is in the form of a structurally stable mica paper.
16. The high thermal conductivity composite material of claim 12 , wherein the high thermal conductivity materials comprise at least one of silica, alumina, magnesium oxide, silicon carbide, boron nitride, aluminum nitride, zinc oxide, or a diamond material.