Systems, methods and materials including crystallization of substrates via sub-melt laser anneal, as well as products produced by such processes
Systems, methods, and products of processes consistent with the innovations herein relate to aspects involving crystallization of layers on substrates. In one exemplary implementation, there is provided a method of fabricating a device. Moreover, such method may include placing an amorphous/poly material on a substrate and heating the material via a sub-melt laser anneal process to transform the material into crystalline form.
1. A method of fabricating a device, comprising:
placing an amorphous layer of semiconductor material having a thickness of between 1 μm and 4 μm on a base substrate, wherein the base substrate is glass, plastic or steel;
placing a seed layer on the amorphous layer of semiconductor material; and
heating the seed layer and the amorphous layer of semiconductor material with a pulse laser having a wavelength of about 1.06 μm and a repetition rate above about 10 KHz to partially melt the amorphous layer of semiconductor material and transform the amorphous layer of semiconductor material into crystalline form.
2. The method of claim 1 wherein the seed layer is a crystalline silicon material.
3. The method of claim 1 further comprising coating the base substrate with a coating before placing the seed layer thereon.
4. The method of claim 3 wherein the coating is an anti-reflective coating.
5. The method of claim 1 wherein the seed layer has a thickness of about 50 nm to about 100 microns.
6. The method of claim 5 wherein the thickness of the seed layer is about 300 nm to about 400 nm.
7. The method of claim 5 wherein the thickness of the seed layer is about 350 nm.
8. The method of claim 1 wherein the base substrate is covered by the amorphous layer having a thickness of about 1000 nm.
9. The method of claim 1 wherein the amorphous layer is deposited via a CVD deposition process, or a PECVD process, or via sputtering.
10. The method of claim 1 further comprising applying or covering the crystallized amorphous layer with a second amorphous layer.
11. The method of claim 10 further comprising heating the second amorphous layer to transform it into crystallized form.
12. The method of claim 11 wherein the heating is accomplished via a second laser irradiation.
13. The method of claim 1 wherein, as a result of the heat treatment via laser, the crystallized amorphous layer has an average grain size of greater than or equal to 10 microns.
14. A thin film device comprising:
a substrate; and
an amorphous layer on the substrate, crystallized via use of a seed layer and a heating process performed in accordance with claim 1 ;
wherein, as a result of the heating process and use of seed layer, the amorphous layer is crystallized to an average grain size of greater than or equal to 10 microns.
15. A method of fabricating a device, comprising:
placing an amorphous layer of semiconductor material having a thickness of between 1 μm and 4 μm on a base substrate, wherein the base substrate is glass, plastic or steel;
heating the amorphous layer of semiconductor material with a pulse laser having a wavelength of about 1.06 μm and a repetition rate above about 10 KHz to partially melt the amorphous layer of semiconductor material and transform the amorphous layer of semiconductor material into crystalline form;
wherein, as a result of the pulse laser heating process, the amorphous layer is crystallized to an average grain size of greater than or equal to 10 microns; and
wherein the crystalline form of the amorphous layer of semiconductor material has a thickness of between about 1 micron to about 4 microns.
16. The method of claim 15 further comprising applying or covering the crystallized amorphous layer with a second amorphous layer.
17. The method of claim 15 wherein the amorphous layer of semiconductor material is deposited via a CVD deposition process, or a PECVD process, or via sputtering.