Solution and process for improving the solderability of a metal surface
View Patent ↗The invention is directed to a solution and process for improving the solderability of a metal surface. In one embodiment, the invention is a silver deposit solution comprising an acid, a source of silver ions, and an additive selected from among pyrroles, triazoles, and tetrazoles, as well as derivatives and mixtures of those components. In another embodiment, the silver deposit solution also includes a 6-membered heterocyclic ring compound, wherein three members of the 6-membered heterocyclic ring are nitrogen atoms. Still another embodiment is a process for improving the solderability of a metal surface which involves applying a silver deposit solution as previously described to a metal surface.
1. A process of improving the solderability of a metal surface, comprising the steps of:
a) providing a metal surface; and
b) applying a silver deposit solution comprising an acid; a source of silver ions; a tolytriazole; and, 1,2,3-benzotriazin-4(3H)-one to said metal surface by immersion in a bath, dipping in a bath or spraying.
2. The process of claim 1 , wherein the pH of said silver deposit solution is less than 3.
3. The process of claim 2 , wherein the pH of said silver deposit solution is less than 2.
4. The process of claim 1 , wherein said silver deposit solution is essentially free of a complexing agent that is not 1,2,3-benzotriazin-4(3H)-one, a pyrrole, triazole, tetrazole or mixture of any of the foregoing.
5. The process of claim 3 , wherein said silver deposit solution is essentially free of a complexing agent that is not 1,2,3-benzotriazin-4(3H)-one, a pyrrole, triazole, tetrazole or mixture of any of the foregoing.
6. The process of claim 1 , wherein a complexing agent that is not 1,2,3-benzotriazin-4(3H)-one, a pyrrole, triazole, tetrazole or mixture of any of the foregoing has not been added to said silver deposit solution.
7. The process of claim 1 , wherein said metal surface comprises a copper surface.
8. A process of protecting a copper surface from tarnishing, comprising the steps of:
a) providing a copper surface; and
b) applying a silver deposit solution to said copper surface, said silver deposit solution comprising: an acid; a source of silver ions; a tolytriazole; and, 1,2,3-benzotriazin-4(3H)-one by immersion in a bath, dipping in a bath or spraying.
9. The process of claim 8 , wherein the pH of said silver deposit solution is less than 3.
10. The process of claim 9 , wherein the pH of said silver deposit solution is less than 2.
11. The process of claim 8 , wherein said silver deposit solution is essentially free of a complexing agent that is not benzotriazin-4(3H)-one, a pyrrole, triazole, tetrazole or mixture of any of the foregoing.
12. The process of claim 10 , wherein said silver deposit solution is essentially free of a complexing agent that is not benzotriazin-4(3H)-one a pyrrole, triazole, tetrazole or mixture of any of the foregoing.
13. The process of claim 8 , wherein a complexing agent that is not benzotriazin-4(3H)-one, a pyrrole, triazole, tetrazole or mixture of any of the foregoing has not been added to said silver deposit solution.
14. A process of protecting a copper surface from tarnishing, comprising the steps of:
a) providing a copper surface; and
b) applying a silver deposit solution to said copper surface, said silver deposit solution comprising: nitric acid; silver nitrate; a tolytriazole; and, 1,2,3-benzotriazin-4(3H)-one.
15. The process of claim 14 , wherein the pH of said silver deposit solution is less than 3.
16. The process of claim 15 , wherein the pH of said silver deposit solution is less than 2.
17. The process of claim 14 , wherein said silver deposit solution is essentially free of a complexing agent that is not benzotriazin-4(3H)-one, a pyrrole, triazole, tetrazole or mixture of any of the foregoing.