Patent Assignment
Reel/Frame 054951/0889
Merger
Recorded: 2021-01-19
Pages: 4
Assignor
MACDERMID ENTHONE AMERICA LLC
Executed: 2019-07-15
Assignee
MACDERMID, INCORPORATED
245 FREIGHT STREET, WATERBURY, CONNECTICUT, 06702
Covered Properties
(12)
Electroless Metal-Plating Process
Patent:
6,524,642 →
Application:
09/839,384 →
Method to Improve the Stability of Dispersions of Carbon
Method for Roughening Copper Surfaces for Bonding to Substrates
Composition and Method for Preparing Chemically-Resistant Roughened Copper Surfaces for Bonding to Substrates
Additives to Stop Copper Attack by Alkaline Etching Agents Such as Ammonia and Monoethanol Amine (Mea)
Composition and Method for Preparing Chemically-Resistant Roughened Copper Surfaces for Bonding to Substrates
Composition and Method for Preparing Chemically-Resistant Roughened Copper Surfaces for Bonding to Substrates
Solution and Process for Improving the Solderability of a Metal Surface
Composition and Method for Preparing Chemically-Resistant Roughened Copper Surfaces for Bonding to Substrates
Solution and Process for Improving the Solderability of a Metal Surface
Electroless Nickel Alloy Plating Bath and Process for Depositing Thereof
Electroless Plating Bath Composition and Method of Plating Particulate Matter
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Termination and Release of Security Interest in Patents
Oct 28, 2015
From: PNC BANK
To: OMG ELECTRONIC CHEMICALS, LLC
Reel/Frame 036985/0566 →
Change of Name
Feb 15, 2019
From: OMG ELECTRONIC CHEMICALS, LLC
To: MACDERMID ENTHONE AMERICA LLC
Reel/Frame 048356/0593 →
Change of Name
Jun 14, 2019
From: OMG ELECTRONIC CHEMICALS, LLC
To: MACDERMID ENTHONE AMERICA LLC
Reel/Frame 049477/0148 →