IP Library Granted Patent US 7,767,009
Granted Patent B2
US 7,767,009 · App. 11/226,613 · Granted Aug 3, 2010

Solution and process for improving the solderability of a metal surface

Assignee: OMG Electronic Chemicals, Inc.
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Quick Facts
Patent No.
US 7,767,009
App. No.
11/226,613
Filed
Sep 14, 2005
Granted
Aug 3, 2010
Kind
B2
Art Unit
1792
USPC
106/1.26
Abstract

The invention is directed to a solution and process for improving the solderability of a metal surface. In one embodiment, the invention is a silver deposit solution comprising an acid, a source of silver ions, and an additive selected from among pyrroles, triazoles, and tetrazoles, as well as derivatives and mixtures of those components. In another embodiment, the silver deposit solution also includes a 6-membered heterocyclic ring compound, wherein three members of the 6-membered heterocyclic ring are nitrogen atoms. Still another embodiment is a process for improving the solderability of a metal surface which involves applying a silver deposit solution as previously described to a metal surface.

Claims (26)

1. A silver deposit solution comprising:

an acid;

a source of silver ions;

an additive selected from the group consisting of pyrroles, triazoles, tetrazoles, and mixtures of any of the foregoing; and, 1,2,3-benzotriazin-4(3H)-one.

2. The silver deposit solution of claim 1 wherein said acid is selected from the group consisting of nitric, sulfuric, phosphoric, acetic, formic, sulfamic, hydroxyl-acetic acid, methane sulfonic acid and mixtures thereof.

3. The silver deposit solution of claim 2 , wherein said acid is nitric acid.

4. The silver deposit solution of claim 1 wherein said silver deposit solution has a pH less than 3.

5. The silver deposit solution of claim 1 wherein said silver deposit solution has a pH less than 2.

6. The silver deposit solution of claim 1 wherein said acid is present in said solution between about 0.005% and about 10% by weight.

7. The silver deposit solution of claim 1 wherein said acid is present in said solution between about 1% and about 3% by weight.

8. The silver deposit solution of claim 1 , wherein said source of silver ions is selected from the group consisting of silver nitrate, silver chloride, silver oxide, silver iodide, silver sulfide, silver cyanide, silver hyposulphite, silver sulphate, silver nitrite and mixtures thereof.

9. The silver deposit solution of claim 8 , wherein said source of silver ions is silver nitrate.

10. The silver deposit solution of claim 1 wherein said source of silver ions is present in said solution between about 0.01 and about 10 grams per liter.

11. The silver deposit solution of claim 1 wherein said source of silver ions is present in said solution between about 0.75 and about 2 grams per liter.

12. The silver deposit solution of claim 1 , wherein said additive is selected from the group consisting of pyrroles.

13. The silver deposit solution of claim 12 , wherein said additive is selected from the group consisting of pyrrole, 1-methylpyrrole, 2-ethylpyrrole, 1-methyl-2-pyrroleacetonitrile, indole, 4-nitroindole, and mixtures of any of the foregoing.

14. The silver deposit solution of claim 1 , wherein said additive is selected from the group consisting of triazoles.

15. The silver deposit solution of claim 14 , wherein said additive is selected from the group consisting of benzotriazoles, tolytriazoles, and mixtures of any of the foregoing.

16. The silver deposit solution of claim 1 , wherein said additive is selected from the group consisting of tetrazoles.

17. The silver deposit solution of claim 16 , wherein said additive is selected from the group consisting of 1 H-tetrazole, 5-amimotetrazole monohydrate, 5-phenyl-1 H-tetrazole and mixtures of any of the foregoing.

18. The silver deposit solution of claim 1 , wherein said additive is present in said solution between about 0.05 and about 4 grams per liter.

19. The silver deposit solution of claim 1 , wherein said additive is present in said solution between about 0.3 and about 1.5 grams per liter.

20. The silver deposit solution of claim 1 , wherein said solution is essentially free of a complexing agent that is not benzotriazin-4(3H)-one, a pyrrole, triazole, tetrazole, or mixture of any of the foregoing.

21. The silver deposit solution of claim 1 , wherein said 1,2,3-benzotriazin-4(3H)-one is present in said solution in a ratio of about 1 g/L per 10 g/L of said additive in said solution.

22. The silver deposit solution of claim 1 , wherein said 1,2,3-benzotriazin-4(3H)-one is present in said solution in a ratio of about 1 g/L per 1 g/L of said additive in said solution.

23. The silver deposit solution of claim 1 , further comprising at least one component selected from the group consisting of a surfactant, an oxidizer, a wetting agent, a silver stabilizer, a dye, and a complexing agent.

Assignments (12)
MERGER Recorded Jan 19, 2021
From: MACDERMID ENTHONE AMERICA LLC
To: MACDERMID, INCORPORATED
Reel/Frame 054951/0889 →
CHANGE OF NAME Recorded Jun 14, 2019
From: OMG ELECTRONIC CHEMICALS, LLC
To: MACDERMID ENTHONE AMERICA LLC
Reel/Frame 049477/0148 →
PATENT SECURITY AGREEMENT Recorded Feb 1, 2016
From: OMG ELECTRONIC CHEMICALS, LLC
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 037662/0086 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Oct 28, 2015
From: PNC BANK
To: OMG ELECTRONIC CHEMICALS, LLC
Reel/Frame 036985/0566 →
SECURITY AGREEMENT Recorded Sep 12, 2013
From: OM GROUP, INC.; OMG ELECTRONIC CHEMICALS, LLC; OMG AMERICAS, INC.; EAGLEPICHER TECHNOLOGIES, LLC; EAGLEPICHER MEDICAL POWER, LLC
To: PNC BANK
Reel/Frame 031208/0876 →
RELEASE OF SECURITY INTEREST Recorded Sep 5, 2013
From: BANK OF AMERICA, N.A.
To: OM GROUP, INC.; EAGLEPICHER TECHNOLOGIES, LLC; EAGLEPICHER MEDICAL POWER, LLC; OMG AMERICAS, INC.; OMG ELECTRONIC CHEMICALS, LLC
Reel/Frame 031169/0976 →
SECURITY AGREEMENT Recorded Aug 12, 2011
From: OM GROUP, INC., A DELAWARE CORPORATION; COMPUGRAPHICS U.S.A. INC., A DELAWARE CORPORATION; CYANTEK CORPORATION, A DELAWARE CORPORATION; OMG AMERICAS, INC., A OHIO CORPORATION; OMG ELECTRONIC CHEMICALS, LLC, A DELAWARE LIMITED LIABILITY COMPANY; OMG ENERGY HOLDINGS, INC., A DELAWARE CORPORATION; OMG HARKO HOLDINGS, LLC, A DELAWARE LIMITED LIABILITY COMPANY; EAGLEPICHER MEDICAL POWER, LLC, A DELAWARE LIMITED LIABILITY COMPANY; EAGLEPICHER TECHNOLOGIES, LLC, A DELAWARE LIMITED LIABILITY COMPANY; EPEP HOLDING COMPANY, LLC, A DELAWARE LIMITED LIABILITY COMPANY
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 026740/0353 →
PATENT RELEASE AGREEMENT Recorded Aug 10, 2011
From: PNC BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
To: OM GROUP, INC., A DELAWARE CORPORATION; OMG AMERICAS, INC., A OHIO CORPORATION; OMG ELECTRONIC CHEMICALS, INC., A DELAWARE LIMITED LIABILITY COMPANY; COMPUGRAPHICS U.S.A. INC., A DELAWARE CORPORATION; OMG ENERGY HOLDINGS, INC., A DELAWARE CORPORATION; EAGLEPICHER TECHNOLOGIES, LLC, A DELAWARE LIMITED LIABILITY COMPANY; EPEP HOLDING COMPANY, LLC, A DELAWARE LIMITED LIABILITY COMPANY; EAGLEPICHER MEDICAL POWER, LLC, A DELAWARE LIMITED LIABILITY COMPANY
Reel/Frame 026727/0485 →
CHANGE OF NAME Recorded Aug 11, 2010
From: OMG ELECTRONIC CHEMICALS, INC.
To: OMG ELECTRONIC CHEMICALS, LLC
Reel/Frame 024812/0920 →
SECURITY AGREEMENT Recorded Mar 11, 2010
From: OM GROUP, INC.; OMG AMERICAS, INC.; OMG ELECTRONIC CHEMICALS, INC.; COMPUGRAPHICS U.S.A. INC.; OM HOLDINGS, INC.; OMG ENERGY HOLDINGS, INC.; EAGLEPICHER TECHNOLOGIES, LLC; EPEP HOLDING COMPANY, LLC; EAGLEPICHER MEDICAL POWER, LLC
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 024066/0130 →
MERGER Recorded Jan 14, 2009
From: ELECTROCHEMICALS INC.; OMG FIDELITY, INC.
To: OMG ELECTRONIC CHEMICALS, INC.
Reel/Frame 022105/0121 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2005
From: BERNARDS, ROGER F.
To: ELECTROCHEMICALS, INC.
Reel/Frame 017322/0717 →
Continuity (1)
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