Electroless nickel alloy plating bath and process for depositing thereof
View Patent ↗An aqueous nickel phosphorus tin alloy electroless plating bath and process for depositing a nickel phosphorus tin alloy onto a substrate, particularly an aluminum substrate for memory disk applications, wherein the nickel phosphorus tin alloy deposit provides enhanced thermal stability, as defined by the inhibition of crystallization and suppression of magnetization upon high temperature annealing when compared to typical NiP deposits.
1. An aqueous nickel phosphorus tin alloy electroless plating bath for plating a substrate, the plating bath comprising:
at least one source of nickel ion, wherein the at least one source of nickel ion is provided in a range from about 1-15 g/L;
a hypophosphite salt as a reducing agent, wherein the hypophosphite salt is provided in a range from about 10-50 g/L;
at least one chelating agent, wherein the at least one chelating agent is provided in a range from about 1-65 g/L;
an auxiliary bath stabilizer, wherein the stabilizer is provided in a range≦1 g/L; and
at least one source of stannous ion which comprises tin methane sulfonate, wherein the at least one source of stannous ion is provided in a range from about 0.001 to about 0.1 g/L, wherein the plating bath is maintained at a pH between 4-5.
2. The bath of claim 1 , wherein
the at least one source of nickel ion is selected from the group consisting of nickel sulfate, nickel chloride, and nickel acetate.
3. The bath of claim 1 , wherein
the at least one source of nickel ion is provided in a range from about 3-8 g/L.
4. The bath of claim 1 , wherein
the hypophosphite salt is sodium hypophosphite.
5. The bath of claim 1 , wherein
the hypophosphite salt is provided in a range from about 15-40 g/L.
6. The bath of claim 1 , wherein
the at least one chelating agent may be selected from the group consisting of citric acid, lactic acid, tartaric acid, succinic acid, malic acid, maleic acid, and ethylene diamine tetraacetic acid.
7. The bath of claim 1 , wherein
auxiliary bath stabilizer is lead acetate trihydrate.
8. The bath of claim 1 , wherein
the aqueous nickel phosphorus tin alloy electroless plating bath is free of sulfur-based accelerators and stabilizers.
9. The bath of claim 1 , wherein
the aqueous nickel phosphorus tin alloy electroless plating bath is free of components selected from the group consisting of diboron esters, boro-gluconic acid complexes, and stannate-gluconate complexes.
10. The bath of claim 1 , wherein
the substrate is a material selected from the group consisting of steel, aluminum, thermoplastic polymers, and thermoset polymers.