Method of manufacturing a semiconductor device including optical test pattern above a light shielding film
The semiconductor device of the present invention includes a first insulating film on a substrate having a first region and a second region, a light shielding film formed in the first region and an interconnect film formed in the second region in the first insulating film and a second insulating film having a first concave portion above the light shielding film in the first region and an interconnect hole having a via hole and a second concave portion in the second region in the second insulating film on the first insulating film, wherein an area of the light shielding film is overlapping an area of the first plurality of concave portions.
1. A method of manufacturing a semiconductor device, comprising:
forming a first insulating film on a substrate where a plurality of active regions and a plurality of test regions are formed;
forming a light shielding film in the test regions and an interconnect film in the active regions in the first insulating film;
forming a second insulating film on the first film; and
forming an optical test pattern above the light shielding film in the second insulating film and in the test regions, and an interconnect hole having a via hole and device components in the active regions in the second insulating film,
wherein the light shielding film extends continuously in an area underlying the optical test pattern.
2. The method of manufacturing a semiconductor device according to claim 1 , further comprising:
irradiating light onto the optical test pattern in the second insulating film;
detecting reflected light; and
acquiring a shape of the optical test pattern from the detected reflected light.
3. The method of manufacturing a semiconductor device according to claim 1 , wherein the test regions are included in a scribe region.
4. The method of manufacturing a semiconductor device according to claim 1 , wherein the area of the light shielding film is an area of the circle of 2 μm or more in the radius.
5. The method of manufacturing a semiconductor device according to claim 1 , wherein the device components and the optical test pattern includes trenches being formed at a same etching step.
6. The method of manufacturing a semiconductor device according to claim 1 , wherein the device components and the optical test pattern includes holes being formed at a same etching step.
7. The method of manufacturing a semiconductor device according to claim 1 , wherein the light shielding film and the interconnect film are formed of copper or copper alloy.