Nickel pH adjustment method and apparatus
View Patent ↗An electrolytic cell for adjusting pH and replenishing nickel in a nickel plating solution of a nickel plating bath and a method of using the same is disclosed. The electrolytic cell comprises an inlet for receiving nickel plating solution from the nickel plating bath; a cooled cathode connected to a first bus bar connected to a negative terminal of a power supply; a plurality of nickel anodes capable of creating hydrogen gas on the cooled cathode when current is applied, connected to at least a second bus bar, the at least the second bus bar connected to a positive terminal of the power supply; and an outlet for returning nickel plating solution in the electrolytic cell to the nickel plating bath.
1. An electrolytic cell for adjusting pH and replenishing nickel in a nickel plating solution, the electrolytic cell comprising:
a) an inlet for receiving nickel plating solution from a nickel plating bath;
b) a cooled cathode connected to a first bus bar, said first bus bar connected to a negative terminal of a power supply;
c) a plurality of nickel anodes capable of creating hydrogen gas on the cooled cathode when current is applied, connected to at least a second bus bar, said at least the second bus bar connected to a positive terminal of the power supply; and
d) an outlet for returning nickel plating solution in the electrolytic cell to the nickel plating bath;
wherein the cooled cathode comprises at least one conduit for chilled water, wherein the at least one conduit circulates the chilled water within the cathode to cool the cathode.
2. The electrolytic cell according to claim 1 , wherein the plurality of nickel anodes comprise a plurality of nickel anode baskets.
3. The electrolytic cell according to claim 1 , wherein the cooled cathode comprises titanium.
4. The electrolytic cell according to claim 1 , wherein the nickel plating solution in the electrolytic cell is maintained at a temperature of between about 70° F and about 150° F.
5. The electrolytic cell according to claim 4 , wherein the nickel plating solution in the electrolytic cell is maintained at a temperature of between about 130° F and about 140° F.
6. The electrolytic cell according to claim 1 , wherein the cathode is maintained at a temperature of less than 100° F.
7. The electrolytic cell according to claim 6 , wherein the cathode is maintained at a temperature of less than 90° F.
8. The electrolytic cell according to claim 1 , wherein a current density of greater than about 150 asf is applied to the cathode.
9. The electrolytic cell according to claim 8 , wherein a current density of greater than about 250 asf is applied to the cathode.
10. A method of adjusting the pH and nickel content of a nickel plating solution, the method comprising the steps of: a) diverting a portion of the nickel plating solution from a nickel plating bath to an electrolytic cell, said electrolytic cell comprising a cooled cathode and a plurality of nickel anodes capable of creating hydrogen gas on the cooled cathode when current is applied, wherein the cooled cathode comprises at least one conduit for chilled water, wherein the at least one conduit circulates the chilled water within the cathode to cool the cathode; b) applying current to the nickel anode and the cooled cathode for a period of time to increase the pH of the nickel plating solution in the electrolytic cell, wherein the electrolytic cell replenishes nickel by dissolution of the nickel anode; and c) returning the nickel plating solution in the electrolytic cell to the nickel plating bath.
11. The method according to claim 10 , wherein the nickel plating solution in the electrolytic cell is maintained at a temperature of between about 70° F. and about 150° F.
12. The method according to claim 11 , wherein the nickel plating solution in the electrolytic cell is maintained at a temperature of between about 130° F and about 140° F.
13. The method according to claim 10 , wherein the cathode is maintained at a temperature of less than 100° F.
14. The method according to claim 13 , wherein the cathode is maintained at a temperature of less than 90° F.
15. The method according to claim 13 , wherein the cathode is cooled by circulating chilled water inside the cathode.
16. The method according to claim 15 , wherein the chilled water is at a temperature of less than about 100° F.
17. The method according to claim 10 , wherein a current density of greater than about 150 asf is applied to the cathode.
18. The method according to claim 17 , wherein a current density of greater than about 250 asf is applied to the cathode.
19. The method according to claim 10 , wherein the cathode efficiency for plating nickel in the electrolytic cell is less than 5%.
20. The method according to claim 10 , wherein the electrolytic cell is about 95 to about 100% efficient in dissolving nickel.
21. The method according to claim 10 , wherein the nickel plating solution comprises a semi-bright or bright nickel plating solution.
22. The method according to claim 21 , wherein the nickel plating solution comprises a nickel sulfamate plating solution.
23. An electrolytic cell for adjusting pH and replenishing nickel in a nickel plating solution, the electrolytic cell comprising:
a) an inlet for receiving nickel plating solution from a nickel plating bath;
b) a cooled cathode connected to a first bus bar, said first bus bar connected to a negative terminal of a power supply;
c) a plurality of nickel anodes capable of creating hydrogen gas on the cooled cathode when current is applied, connected to at least a second bus bar, said at least the second bus bar connected to a positive terminal of the power supply; and
d) an outlet for returning nickel plating solution in the electrolytic cell to the nickel plating bath;
wherein chilled water is capable of passing through the length of the first bus bar, wherein the first bus bar and the cathode connected to the first busbar are cooled.