Patent Assignment
Reel/Frame 061956/0643
Assignment of Security Interest in Patent Collateral
Recorded: 2022-11-17
Pages: 51
Assignor
BARCLAYS BANK PLC
Executed: 2022-11-15
Assignee
CITIBANK, N.A.
388 GREENWICH STREET, 7TH FLOOR, NEW YORK, NEW YORK, 10013
Covered Properties
(439)
Printed Circuit Board Manufacture
Electroless Nickel Cobalt Phosphorous Composition and Plating Process
Patent:
6,146,702 →
Application:
08/963,999 →
Ductility Agents for Nickel-Tungsten Alloys
Patent:
6,045,682 →
Application:
09/046,869 →
Tin Plating Electrolyte Compositions
Patent:
6,217,738 →
Application:
09/051,784 →
Flip Chip with Integrated Flux and Underfill
Patent:
6,265,776 →
Application:
09/067,381 →
Electroplating Composition Bath
Patent:
6,576,114 →
Application:
09/069,442 →
Photosensitive Resin Composition Useful in Fabricating Printing Plates
Patent:
6,214,522 →
Application:
09/143,427 →
Fluxing Agents for the Reflowing of Electro-Deposited Tinplate
Patent:
6,409,850 →
Application:
09/147,972 →
Process for Plating Upon a Polymeric Surface
Patent:
6,168,836 →
Application:
09/183,137 →
Stencil Incorporating Electronic Tag
Patent:
6,123,024 →
Application:
09/231,490 →
Method for Enhancing the Solderability of a Surface
Patent:
6,200,451 →
Application:
09/251,641 →
Method for Automatically Forming Ink and Media-Dependent Color Transforms for Diverse Colored Inks and Ink Types, Validating Color Gamut, and Applying Said Inks
Patent:
6,419,340 →
Application:
09/260,925 →
Flip Chip with Integrated Mask and Underfill
Patent:
6,228,678 →
Application:
09/266,166 →
Flip Chip with Integrated Flux and Underfill
Patent:
6,194,788 →
Application:
09/266,232 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,162,503 →
Application:
09/274,641 →
Process for Silver Plating in Printed Circuit Board Manufacture
Patent:
6,319,543 →
Application:
09/282,729 →
Post-Treatment for Copper on Printed Circuit Boards
Patent:
6,294,220 →
Application:
09/345,675 →
Apparatus and Method for the Enhanced Imagewise Exposure of a Photosensitive Material
Patent:
6,262,825 →
Application:
09/382,214 →
Process for Selective Deposition of Osp Coating on Copper, Excluding Deposition on Gold
Patent:
6,524,644 →
Application:
09/383,718 →
Water Soluble Brighteners for Zinc and Zinc Alloy Electrolytes
Patent:
6,238,542 →
Application:
09/394,839 →
Wafer Coating Method for Flip Chips
Patent:
6,323,062 →
Application:
09/395,553 →
Flip Chip Having Integral Mask and Underfill Providing Two-Stage Bump Formation
Patent:
6,228,681 →
Application:
09/395,558 →
Bismuth Coating Protection for Copper
Patent:
6,331,201 →
Application:
09/403,900 →
Uv-Absorbing Support Layers and Flexographic Printing Elements Comprising Same
Composite Relief Image Printing Plates
Patent:
6,312,872 →
Application:
09/417,043 →
Process for Enhancing the Adhesion of Organic Coatings to Metal Surfaces
Patent:
6,206,981 →
Application:
09/421,204 →
Chemical Compounds Made of Intrisically Conductive Polymers and Metals
Patent:
6,632,380 →
Application:
09/463,453 →
Laser imaged printing plates comprising a multi-layer slip film
Patent:
6,367,381 →
Application:
09/507,840 →
Aqueous Developable Photosensitive Polyurethane-Methacrylate
Patent:
6,423,472 →
Application:
09/535,353 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,383,272 →
Application:
09/590,046 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,419,784 →
Application:
09/598,857 →
Method for the manufacture of printed circuit boards with plated resistors
Patent:
6,281,090 →
Application:
09/603,978 →
Photosensitive resin composition useful in fabricating printing plates
Patent:
6,197,459 →
Application:
09/620,884 →
Solvent-Developable Printing Formulations with Improved Processing Characteristics
Patent:
6,551,756 →
Application:
09/624,104 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,554,948 →
Application:
09/643,813 →
Flux Composition and Corresponding Soldering Method
Patent:
6,474,536 →
Application:
09/672,577 →
Method for Enhancing the Solderability of a Surface
Patent:
6,375,822 →
Application:
09/677,904 →
Method for the Manufacture of Printed Circuit Boards
Patent:
6,656,370 →
Application:
09/687,880 →
Method for Enhancing the Solderability of a Surface
Patent:
6,444,109 →
Application:
09/698,370 →
Process for Cleaning Inks from Various Substrates Including Printing Plates
Patent:
6,261,381 →
Application:
09/710,976 →
Electroplating Chemistry for the Cu Filling of Submicron Features of Vlsi/Ulsi Interconnect
Patent:
6,776,893 →
Application:
09/716,975 →
Process for Enhancing the Adhesion of Organic Coatings to Metal Surfaces
Patent:
6,379,750 →
Application:
09/718,910 →
Soldering Flux
Printing Sleeves and Methods for Producing Same
Patent:
6,742,453 →
Application:
09/744,824 →
Method for the Manufacture of Printed Circuit Boards with Plated Resistors
Method for Coating Workpieces
Patent:
6,635,165 →
Application:
09/786,300 →
High Temperature Continuous Electrodialysis of Electroless Plating Solutions
Patent:
6,391,177 →
Application:
09/788,766 →
Composition and Method for Inhibiting Corrosion of Aluminum and Aluminum Alloys Using Mercapto Substituted Silanes
Electroplating Composition and Process
Method for Enhancing the Solderability of a Surface
High Performance, Photoimageable Resin Compositions and Printing Plates Prepared Therefrom
Process for Metallizing a Plastic Surface
Patent:
6,712,948 →
Application:
09/831,008 →
Low-Residue, Low-Solder-Ball Flux
Laser Imaged Printing Plates
Composition and Process for Inhibiting Corrosion of Metallic Substrates
Patent:
6,508,958 →
Application:
09/906,370 →
Laser Imaged Printing Plates
Non-Chrome Passivation Process for Zinc and Zinc Alloys
Patent:
6,524,403 →
Application:
09/938,234 →
Electroless Nickel Plating Solution and Process for Its Use
Patent:
6,500,482 →
Application:
09/945,011 →
Process for Plating Particulate Matter
Paint Stripping Composition and Process Containing Methyl Benzoate and Formic Acid
Patent:
6,417,149 →
Application:
09/949,191 →
Process and Composition for High Speed Plating of Tin and Tin Alloys
Soldering Flux Vehicle Additive and Fine Pitch Printing Method
Magnesium Conversion Coating Composition and Method of Using Same
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Defect Reduction in Electrodeposited Copper for Semiconductor Applications
System for the Electrodialytic Regeneration of an Electroless Bath Electrolyte
Non-Cyanide Copper Plating Process for Zinc and Zinc Alloys
Solderability Enhancement by Silver Immersion Printed Circuit Board Manufacture
Processless Digitally Imaged Printing Plate Using Microspheres
Method of Stripping Silver from a Printed Circuit Board
Printed Circuit Board Manufacture
Process for the Non-Galvanic Tin Plating of Copper or Copper Alloys
Patent:
6,821,323 →
Application:
10/129,998 →
Process for the Extended Use of Electrolytes
Patent:
6,797,141 →
Application:
10/148,090 →
Thermal Interface Material and Heat Sink Configuration
Laser Imaged Printing Plates
Method for the Deposition of a Chromium Alloy
Direct Imaging Process for Forming Resist Pattern on a Surface, and Use Thereof in Fabricating Printing Plates
Releasable Microcapsule and Adhesive Curing System Using the Same
Method for the Manufacture of Printed Circuit Boards with Integral Plated Resistors
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Composition and Process for Inhibiting Corrosion of Metallic Substrates
Zinc and Zinc Alloy Electroplating Additives and Electroplating Methods
Method for Enhancing the Solderability of a Surface
Copper Bath Composition for Electroless and/or Electrolytic Filling of Vias and Trenches for Integrated Circuit Fabrication
Rapid Surface Cooling of Solder Droplets by Flash Evaporation
Method of Fabricating Electronic Interconnect Devices Using Direct Imaging of Dielectric Composite Material
Patent:
6,762,073 →
Application:
10/372,747 →
High Performance, Photoimageable Resin Compositions and Printing Plates Prepared Therefrom
Coating for Silver Plated Circuits
Patent:
6,773,757 →
Application:
10/412,932 →
Method for the Manufacture of Printed Circuit Boards with Plated Resistors
Polytetrafluoroethylene Dispersion for Electroless Nickel Plating Applications
Method for Enhancing the Solderability of a Surface
Thermoplastic Fluxing Underfill Composition and Method
Highly Reflective Substrates for the Digital Processing of Photopolymer Printing Plates
Electrolyte Media for the Deposition of Tin Alloys and Methods for Depositing Tin Alloys
Adhesion Promotion in Printed Circuit Boards
Process and Electrolytes for Deposition of Metal Layers
Protective U.V. Curable Cover Layer for Optical Media
Methods of Cleaning Copper Surfaces in the Manufacture of Printed Circuit Boards
Thermal Interface Material and Solder Preforms
Uv-Absorbing Support Layers and Flexographic Printing Elements Comprising Same
Patent:
39,835 →
Application:
10/752,484 →
Printing Sleeve with an Intergrated Printing Surface
Processless Digitally Imaged Photopolymer Elements Using Microspheres
Process for Preparing a Non-Conductive Substrate for Electroplating
High Performance Water-Based Primer
Apparatus and Method for Thermally Developing Flexographic Printing Sleeves
Underfill Fluxing Curative
Method of Forming a Metal Pattern on a Substrate
Edge Cure Prevention Process
System for Thermal Development of Flexographic Printing Plates
Selective Catalytic Activation of Non-Conductive Substrates
Method of Pre-Exposing Relief Image Printing Plate
Capping of Metal Interconnects in Integrated Circuit Electronic Devices
Method of Applying a Pattern of Particles to a Substrate
Coating Solder Metal Particles with a Charge Director Medium
Apparatus and Method for Thermally Developing Flexographic Printing Elements
Method for Bump Exposing Relief Image Printing Plates
Coated Stencil with Reduced Surface Tension
Silver Plating in Electronics Manufacture
Low Voiding No Flow Fluxing Underfill for Electronic Devices
Integral Plated Resistor and Method for the Manufacture of Printed Circuit Boards Comprising the Same
Controlling the Hardness of Electrodeposited Copper Coatings by Variation of Current Profile
Slip Film Compositions Containing Layered Silicates
Copper Electrodeposition in Microelectronics
Process for Preparing a Non-Conductive Substrate for Electroplating
Compressible Flexographic Printing Plate Construction
Apparatus for the Rapid Development of Photosensitive Printing Elements
Edge Cure Prevention Composition and Process for Using the Same
Method for Thermally Processing Photosensitive Printing Sleeves
Method and Apparatus for Applying Surface Treatments to Photosensitive Printing Elements During Thermal Development
Edge Cure Prevention Process
Solder Preforms for Use in Electronic Assembly
Maintenance of Metallization Baths
Flexo Processor
Preparation of Metallic Particles for Electrokinetic or Electrostatic Deposition
Cobalt and Nickel Electroless Plating in Microelectronic Devices
Method for Treating Laser-Structured Plastic Surfaces
Thermal Development System and Method of Using the Same
Pretreatment of Magnesium Substrates for Electroplating
Microetching Solution
Defectivity and Process Control of Electroless Deposition in Microelectronics Applications
Defectivity and Process Control of Electroless Deposition in Microelectronics Applications
Defectivity and Process Control of Electroless Deposition in Microelectronics Applications
Defectivity and Process Control of Electroless Deposition in Microelectronics Applications
Highly Reflective Substrates for the Digital Processing of Photopolymer Printing Plates
Copper Electrodeposition in Microelectronics
Insoluble Anode
Photopolymer Printing Form with Reduced Processing Time
Developer Solution and Process for Use
Patent:
7,094,523 →
Application:
11/290,118 →
System for Thermal Development of Flexographic Printing Plates
Method of Using Ultrasonics to Plate Silver
Microetching Composition and Method of Using the Same
Method of Creating a Digital Mask for Flexographic Printing Elements in Situ
Method for the Manufacture of Printed Circuit Boards with Plated Resistors
Polyimide Substrate and Method of Manufacturing Printed Wiring Board Using the Same
Process for Electrolytically Plating Copper
Copper Electroplating of Printing Cylinders
Patent:
7,153,408 →
Application:
11/403,628 →
Mask and Method for Electrokinetic Deposition and Patterning Process on Substrates
Method for Supplying a Plating Composition with Deposition Metal Ion During a Plating Operation
Method for Direct Metallization of Non-Conducting Substrates
Application:
11/423,474 →
Publication:
US 2006/0280872
Method for Thermally Processing Photosensitive Printing Sleeves
Particles and Inks and Films Using Them
Tin-Silver Solder Bumping in Electronics Manufacture
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Manufacture of Electroless Cobalt Deposition Compositions for Microelectronics Applications
Method for Etching Non-Conductive Substrate Surfaces
Method for Removing Impurities from a Metal Deposition Process Solution
Organic Solderability Preservative Comprising High Boiling Temperature Alcohol
Thermal Interface Material and Solder Preforms
Solder Alloy
Method of Recycling Electroless Nickel Waste
Metallic Surface Enhancement
Direct Metallization of Electrically Non-Conductive Polyimide Substrate Surfaces
Adhesion Promotion in Printed Circuit Boards
Adhesion Promotion in Printed Circuit Boards
Corrosion Protection of Bronzes
Electrolyte Composition and Method for the Deposition of a Zinc-Nickel Alloy Layer on a Cast Iron Or Steel Substrate
Metal Surface Treatment Composition
Acid Copper Electroplating Bath Composition
Copper Electrodeposition in Microelectronics
Capping of Metal Interconnects in Integrated Circuit Electronic Devices
Solvent Systems for Metals and Inks
Method for Producing a High-Aspect Ratio Conductive Pattern on a Substrate
Materials for Use with Interconnects of Electrical Devices and Related Methods
Method of Pre-Exposing Relief Image Printing Plate
Microetching Composition and Method of Using the Same
Anti-Tarnish Coatings
Defect Reduction in Electrodeposited Copper for Semiconductor Applications
Compressible Flexographic Printing Plate Construction
Solder Alloy
Reducing Joint Embrittlement in Lead-Free Soldering Processes
Flexo Cushion
Method of Electrolytically Dissolving Nickel into Electroless Nickel Plating Solutions
Electrical Contacts
Methods for Producing Electrical Conductors
Acid-resistance promoting composition
Electrolyte and Process for Depositing a Matt Metal Layer
Thermally Stable Subsea Control Hydraulic Fluid Compositions
Methods of Attaching a Die to a Substrate
Electrical Conductors and Methods of Making and Using Them
Method and Apparatus for Thermal Processing of Photosensitive Printing Elements
Copper Metallization of Through Silicon Via
Metallic Particles for Electrokinetic or Electrostatic Deposition
Coated Solder Metal Particles
Electroformed Stencils for Solar Cell Front Side Metallization
Surface Preparation Process for Damascene Copper Deposition
Method for Enhancing the Solderability of a Surface
Patent:
7,631,798 →
Application:
12/244,136 →
Composite Coatings for Whisker Reduction
Process for Plating Chromium from a Trivalent Chromium Plating Bath
Apparatus and Method for Thermally Developing Flexographic Printing Elements
Application:
12/267,642 →
Publication:
US 2010/0119978
Self Assembled Molecules on Immersion Silver Coatings
Method and Device for Coating Substrate Surfaces
Application:
12/278,256 →
Publication:
US 2009/0324804
Method and Composition for Electrodeposition of Copper in Microelectronics with Dipyridyl-Based Levelers
Method of Controlling Surface Roughness of a Flexographic Printing Plate
Application:
12/348,981 →
Publication:
US 2010/0173135
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Means for Attaching a Printing Plate to a Printing Cylinder
Organic Polymer Coating for Protection Against Creep Corrosion
Chromium Alloy Coating with Enhanced Resistance to Corrosion in Calcium Chloride Environments
Method of Creating a Digital Mask for Flexographic Printing Elements in Situ
Process for Improving Adhesion of Polymeric Materials to Metal Surfaces
Deposition of Conductive Polymer and Metallization of Non-Conductive Substrates
Cyanide-Free Electrolyte Composition, and Method for the Deposition of Silver or Silver Alloy Layers on Substrates
Copper Deposition for Filling Features in Manufacture of Microelectronic Devices
Thermally Stable Subsea Control Hydraulic Fluid Compositions
Printing Element with an Integrated Printing Surface
Selective Deposition of Metal on Plastic Substrates
Flux Formulations
Application:
12/497,065 →
Publication:
US 2010/0139952
Surface Treatment of Silicon
Light Induced Electroless Plating
Environmental Subsea Control Hydraulic Fluid Compositions
Mono-Acid Hybrid Conductive Composition and Method
Method of Improving Print Performance in Flexographic Printing Plates
Nickel-Chromium Alloy Stripper for Flexible Wiring Boards
Metallic Surface Enhancement
Immersion Tin Silver Plating in Electronics Manufacture
Galvanic Bath and Process for Depositing Zinc-Based Layers
Carrier Sheet for a Photosensitive Printing Element
Method of Improving Print Performance in Flexographic Printing Plates
Corrosion Protection of Bronzes
Application:
12/665,908 →
Publication:
US 2010/0319572
Chromium-Free Pickle for Plastic Surfaces
Method for Improving Plating on Non-Conductive Substrates
Nano-Oxide Process for Bonding Copper/Copper Alloy and Resin
Electrolytic Deposition of Metal-Based Composite Coatings Comprising Nano-Particles
Method of Producing a Relief Image from a Liquid Photopolymer Resin
Method of Improving Print Performance in Flexographic Printing Plates
Nickel pH Adjustment Method and Apparatus
Method of Producing Polymeric Phenazonium Compounds
Biodegradable Film for Flexographic Printing Plate Manufacture and Method of Using the Same
Application:
12/939,388 →
Publication:
US 2012/0115083
Dark Colored Chromium Based Electrodeposits
Electrolytic Dissolution of Chromium from Chromium Electrodes
Method of Improving Print Performance in Flexographic Printing Plates
Electrolyte and Method for Deposition of Matte Metal Layer
Application:
13/003,398 →
Publication:
US 2011/0233065
Adhesion Promoting Composition for Metal Leadframes
Aluminum Treatment Compositions
Photosensitive Resin Laminate and Thermal Processing of the Same
Hydraulic Fluid Compositions
Cyanide Free Electrolyte Composition for the Galvanic Deposition of a Copper Layer
Photosensitive Resin Laminate and Thermal Processing of the Same
Method for Deposition of Hard Chrome Layers
Application:
13/125,622 →
Publication:
US 2011/0198226
Method for the Post-Treatment of Metal Layers
Particles and Inks and Films Using Them
Slip Film for Relief Image Printing Element
Anti-Tarnish Coatings
Method of Controlling Surface Roughness of a Flexographic Printing Plate
Method for Improving Print Performance of Flexographic Printing Elements
Light Induced Plating of Metals on Silicon Photovoltaic Cells
Laminated Flexographic Printing Sleeves and Methods of Making the Same
Copper Electrodeposition in Microelectronics
Method of Producing Polymeric Phenazonium Compounds
Sintering Materials and Attachment Methods Using Same
Low Etch Process for Direct Metallization
Application:
13/353,428 →
Publication:
US 2013/0186764
Laminating Apparatus and Method of Using the Same
Etching of Plastic Using Acidic Solutions Containing Trivalent Manganese
Method for Enhancing the Solderability of a Surface
Patent:
45,297 →
Application:
13/371,848 →
Integrated Membrane Lamination and UV Exposure System and Method of Using the Same
Method for the Deposition of a Metal Layer Comprising a Beta-Amino Acid
Color Control of Trivalent Chromium Deposits
Coatings Having Enhanced Corrosion Performance and Method of Using the Same
Application:
13/398,242 →
Publication:
US 2013/0216720
Clean Flexographic Printing Plate and Method of Making the Same
Method of Improving Print Performance in Flexographic Printing Plates
Adhesion Promotion in Printed Circuit Boards
Additive for Use in Wash Step of PET Recycling Process
Application:
13/438,149 →
Publication:
US 2013/0261197
Method for Enhancing the Solderabiltiy of a Surface
Patent:
45,842 →
Application:
13/463,087 →
Method for Enhancing the Solderability of a Surface
Patent:
45,881 →
Application:
13/463,110 →
Liquid Platemaking with Laser Engraving
Process for Silver Plating in Printed Circuit Board Manufacture
Patent:
45,279 →
Application:
13/471,203 →
Composition for Removing Scale Deposits
Liquid Platemaking Process
Additives for Producing Copper Electrodeposits Having Low Oxygen Content
Self Assembled Molecules on Immersion Silver Coatings
Composite Coatings for Whisker Reduction
Adhesion Promotion in Printed Circuit Boards
Steel Pre-Paint Treatment Composition
Application:
13/568,277 →
Publication:
US 2014/0041764
Method of Improving Surface Cure in Digital Flexographic Printing Plates
Dark Colored Chromium Based Electrodeposits
Method of Improving Print Performance in Flexographic Printing Plates
Direct Electroless Palladium Plating on Copper
Application:
13/609,705 →
Publication:
US 2014/0072706
Method for Direct Metallization of Non-Conductive Substrates
Corrosion-Protective Wax Composition Containing Polyaniline in a Doped Form and a Liquid Paraffin
Application:
13/638,442 →
Publication:
US 2013/0130056
Loading/Unloading System for Printing Plates
Application:
13/653,916 →
Publication:
US 2014/0101915
Process for Silver Plating in Printed Circuit Board Manufacture
Patent:
45,175 →
Application:
13/655,159 →
Electrolytic Generation of Manganese (III) Ions in Strong Sulfuric Acid Using an Improved Anode
Light Induced Plating of Metals on Silicon Photovoltaic Cells
Copper Filling of Through Silicon Vias
Silver Plating in Electronics Manufacture
Method for Improving Plating on Non-Conductive Substrates
Method and Composition for Electrodeposition of Copper in Microelectronics with Dipyridyl-Based Levelers
High Speed Copper Plating Process
Application:
13/786,728 →
Publication:
US 2014/0256083
Electrolytic Generation of Manganese (III) Ions in Strong Sulfuric Acid
Regeneration of Etch Solutions Containing Trivalent Manganese in Acid Media
Application:
13/870,232 →
Publication:
US 2014/0318983
Composition and Method for the Deposition of Conductive Polymers on Dielectric Substrates
Method of Improving Print Performance in Flexographic Printing Plates
Adhesion Promoting Composition for Metal Leadframes
Electroless Nickel Plating Solution and Method
Apparatus for Thermal Processing of Flexographic Printing Elements
Process for Filling Vias in the Microelectronics
Aqueous Solution and Method for the Formation of a Passivation Layer
Application:
14/001,360 →
Publication:
US 2014/0154525
Photosensitive Resin Laminate and Thermal Processing of the Same
Hydraulic Fluid Compositions
Methods for Attachment and Devices Produced Using the Methods
Environmental Subsea Control Hydraulic Fluid Compositions
Conductive Compositions and Methods of Using Them
Flux Formulations
Method of Controlling Surface Roughness of a Flexographic Printing Plate
Solvent Systems for Metals and Inks
Application:
14/095,559 →
Publication:
US 2014/0186524
Copper Electrodeposition in Microelectronics
Photosensitive Resin Laminate and Thermal Processing of the Same
Thermally Stable Subsea Control Hydraulic Fluid Compositions
Photosensitive Resin Composition
Method of Producing Polymeric Phenazonium Compounds
Method for Creating Surface Texture on Flexographic Printing Elements
Laminating Apparatus and Method of Using the Same
Application:
14/191,529 →
Publication:
US 2014/0174666
Passivation of Micro-Discontinuous Chromium Deposited From a Trivalent Electrolyte
Electroplating of Metals on Conductive Oxide Substrates
Apparatus for Electrochemical Deposition of a Metal
Application:
14/234,080 →
Publication:
US 2014/0158545
High Impact Toughness Solder Alloy
Application:
14/236,432 →
Publication:
US 2014/0219711
Solder Compositions
Application:
14/236,480 →
Publication:
US 2014/0199115
Aqueous Electroless Nickel Plating Bath and Method of Using the Same
High Phosphorus Electroless Nickel
Method of Improving Print Performance in Flexographic Printing Plates
Method for Improving Print Performance in Flexographic Printing Plates
Method and Composition for Electrodeposition of Copper in Microelectronics with Dipyridyl-Based Levelers
Method of Improving Surface Cure in Digital Flexographic Printing Plates
Systems and Methods for Void Reduction in a Solder Joint
Application:
14/347,035 →
Publication:
US 2014/0328039
Process for Electroless Copper Deposition on Laser-Direct Structured Substrates
Solder Preforms and Solder Alloy Assembly Methods
Lead-Free and Antimony-Free Tin Solder Reliable at High Temperatures
Application:
14/434,470 →
Publication:
US 2015/0266137
Sintering Powder
Treatment for Electroplating Racks to Avoid Rack Metallization
Clean Flexographic Printing Plates and Method of Making the Same
Patent:
9,217,928 →
Application:
14/458,659 →
Etching of Plastic Using Acidic Solutions Containing Trivalent Manganese
Flexographic Printing Plate with Improved Cure Efficiency
Beta-Amino Acid Comprising Plating Formulation
Silver Plating in Electronics Manufacture
Method of Making Relief Image Printing Plates
Lead-Free and Antimony-Free Tin Solder Reliable at High Temperatures
Chromium-Free Pickle for Plastic Surfaces
Electrodeposition of Silver with Fluoropolymer Nanoparticles
Application:
14/776,879 →
Publication:
US 2016/0032479
Method of Creating Hybrid Printing Dots in a Flexographic Printing Plate
Carrier Sheet and Method of Using the Same
Solutions of Organic Salts as Pretreatments for Plastic Prior to Etching
Application:
14/831,266 →
Publication:
US 2017/0051410
Electroless Silver Plating Bath and Method of Using the Same
Application:
14/831,403 →
Publication:
US 2017/0051411
Levelers for Copper Deposition in Microelectronics
Treatment of Etch Baths
Application:
14/870,738 →
Publication:
US 2017/0088971
Lead-Free and Antimony-Free Tin Solder Reliable at High Temperatures
Application:
14/878,056 →
Publication:
US 2016/0023309
Aqueous Stripping Composition for Metal Surfaces
Metal Recovery
Dual-Side Reinforcement Flux for Encapsulation
Joining to Aluminum
Composite and Multilayered Silver Films for Joining Electrical and Mechanical Components
Aqueous Electrolyte Composition Having a Reduced Airborne Emission, Method and Use of This Composition
Method and Apparatus for Producing Liquid Flexographic Printing Plates
Apparatus for Thermal Processing of Flexographic Printing Elements
Application:
14/937,267 →
Publication:
US 2017/0129234
Cyanide-Free Electrolyte Composition and Method for the Deposition of Silver or Silver Alloy Layers on Substrates
Method for Creating Surface Texture on Flexographic Printing Elements
Sintering Materials and Attachment Methods Using Same
Lead-Free, Silver-Free Solder Alloys
Application:
15/028,988 →
Publication:
US 2016/0271738
Electrodeposition of Copper
Application:
15/037,267 →
Publication:
US 2016/0281251
Customizable Printing Plates and Method of Making the Same
Method of Improving Light Stability of Flexographic Printing Plates Featuring Flat Top Dots
Method of Improving Surface Cure in Digital Flexographic Printing Plates
Rosin-Free Thermosetting Flux Formulations
Dark Colored Chromium Based Electrodeposits
Application:
15/134,469 →
Publication:
US 2017/0306515
Method of Making Relief Image Printing Elements
Conductive Compositions and Methods of Using Them
Process for Filling Vias in the Microelectronics
Method of Making a Flexographic Printing Plate
Production of Graphene
Application:
15/265,385 →
Publication:
US 2018/0072573
Advanced Solder Alloys For Electronic Interconnects
Application:
15/286,759 →
Publication:
US 2018/0102464
Copper Electrodeposition in Microelectronics
Application:
15/291,340 →
Publication:
US 2017/0029972
Method for Manufacturing Metal Powder
Low Pressure Sintering Powder
Jettable Inks For Solar Cell and Semiconductor Fabrication
Sintering Materials and Attachment Methods Using Same
Engineered Residue Solder Paste Technology
Application:
15/318,829 →
Publication:
US 2017/0135227
Multilayered Metal Nano and Micron Particles
Low Temperature High Reliability Alloy for Solder Hierarchy
Stretchable Interconnects for Flexible Electronic Surfaces
Electrolytic Generation of Manganese (III) Ions in Strong Sulfuric Acid
Flux Formulations
Sealing Anodized Aluminum Using a Low-Temperature Nickel-Free Process
Leveler Compositions for Use in Copper Deposition in Manufacture of Microelectronics
High Impact Solder Toughness Alloy
Application:
15/419,564 →
Publication:
US 2017/0136583
Rf Shield with Selectively Integrated Solder
Application:
15/426,320 →
Publication:
US 2017/0245404
Conductive Patterns and Methods of Using Them
Method of Improving Print Performance in Flexographic Printing Plates
Application:
15/463,341 →
Publication:
US 2018/0029400
Method of Improving Print Performance in Flexographic Printing Plates
Application:
15/463,379 →
Publication:
US 2018/0029350
Method of Producing a Relief Image From a Liquid Photopolymer Resin
Apparatus for Thermal Processing of Flexographic Printing Elements
Method of Improving Light Stability of Flexographic Printing Plates Featuring Flat Top Dots
Method and Apparatus for Producing Liquid Flexographic Printing Plates
Method of Making A Flexographic Printing Plate
Compositions Including a High Molecular Weight Acid Suitable for Conductive Polymer Formation on Dielectric Substrate
Method for Die and Clip Attachment
Electrical Connection Tape
Inhibitor Composition for Racks When Using Chrome Free Etches in a Plating on Plastics Process
Application:
15/551,052 →
Publication:
US 2018/0044813
Engineered Polymer-Based Electronic Materials
Flexographic Printing Plate with Improved Storage Stability
Elimination of H2S in Immersion Tin Plating Solution
Laser Imaged Printing Plates
Application:
15/608,210 →
Publication:
US 2018/0345711
Use of Water Soluble Lanthanide Compounds As Stabilizer In Electrolytes For Electroless Metal Deposition
Application:
15/616,540 →
Publication:
US 2017/0350016
Process for Metalization of Copper Pillars in the Manufacture of Microelectronics
Application:
15/617,482 →
Publication:
US 2018/0355502
Method of Improving Print Performance in Flexographic Printing Plates
Application:
15/638,878 →
Publication:
US 2017/0297358
Cobalt Filling of Interconnects
High Impact Solder Toughness Alloy
Application:
15/644,331 →
Publication:
US 2017/0304955
Electrolytic Generation of Manganese (III) Ions in Strong Sulfuric Acid Using an Improved Anode
Chromium Alloy Coating with Enhanced Resistance to Corrosion in Calcium Chloride Environments
Application:
15/678,771 →
Publication:
US 2017/0342582
Solder Preforms and Solder Alloy Assembly Methods
Application:
15/716,963 →
Publication:
US 2018/0020554
Textured Hardcoat Films
Cobalt Filling of Interconnects in Microelectronics
System and Method for Recovering Catalytic Precious Metal from Aqueous Galvanic Processing Solution
Application:
15/754,224 →
Publication:
US 2018/0245178
Flexible Color Adjustment for Dark Cr(III) Platings
Water Soluble and Air Stable Phosphaadamantanes as Stabilizers for Electroless Metal Deposition
Application:
15/765,637 →
Publication:
US 2019/0085461
Etching of Plastic Using Acidic Solutions Containing Trivalent Manganese
Carbon-Based Direct Plating Process
NEAR NEUTRAL pH PICKLE ON MULTI-METALS
Patent:
10,443,135 →
Application:
15/977,526 →
High Impact Solder Toughness Alloy
Application:
16/003,202 →
Publication:
US 2018/0290244
Selective Plating of Three Dimensional Surfaces to Produce Decorative and Functional Effects
Applications of Engineered Graphene
Application:
62/655,409 →
Method for Enhancing the Solderability of a Surface
Application:
90/012,575 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 11, 2012
From: FERRIER, DONALD; YAKOBSON, ERIC
To: MACDERMID, INCORPORATED
Reel/Frame 029113/0944 →
Release of Security Interest in Patent Collateral at Reel/Frame No. 20004/0487
Jun 26, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: MACDERMID PRINTING SOLUTIONS, LLC (AS SUCCESSOR-IN-INTEREST TO MACDERMID GRAPHIC ARTS, INC.)
Reel/Frame 030687/0628 →
Release of Security Interest in Patent Collateral at Reel/Frame No. 20004/0668
Jun 26, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: MACDERMID, INCORPORATED
Reel/Frame 030694/0705 →
Release of Security Interest in Patent Collateral at Reel/Frame No. 20004/0727
Jun 26, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: NAPP SYSTEMS, INC.
Reel/Frame 030688/0754 →
First Lien Patent Security Agreement
Jul 19, 2013
From: MACDERMID, INCORPORATED
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 030833/0660 →
Second Lien Patent Security Agreement
Jul 19, 2013
From: MACDERMID PRINTING SOLUTIONS, LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS SECOND LIEN COLLATERAL AGENT
Reel/Frame 030831/0757 →
Second Lien Patent Security Agreement
Jul 19, 2013
From: MACDERMID ACUMEN, INC.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS SECOND LIEN COLLATERAL AGENT
Reel/Frame 030831/0675 →
First Lien Patent Security Agreement
Jul 19, 2013
From: MACDERMID PRINTING SOLUTIONS, LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 030831/0606 →
First Lien Patent Security Agreement
Jul 19, 2013
From: MACDERMID ACUMEN, INC.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 030831/0549 →
Second Lien Patent Security Agreement
Jul 19, 2013
From: MACDERMID, INCORPORATED
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS SECOND LIEN COLLATERAL AGENT
Reel/Frame 030834/0014 →
Second Lien Patent Security Agreement
Jul 19, 2013
From: NAPP SYSTEMS INC.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS SECOND LIEN COLLATERAL AGENT
Reel/Frame 030833/0804 →
First Lien Patent Security Agreement
Jul 19, 2013
From: NAPP SYSTEMS INC.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 030833/0700 →
Release of Security Interest in Patent Collateral at Reel/Frame No. 30831/0675
Nov 1, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS SECOND LIEN COLLATERAL AGENT
To: MACDERMID ACUMEN, INC.
Reel/Frame 031537/0094 →
Release of Security Interest in Patent Collateral at Reel/Frame No. 30834/0014
Nov 1, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS SECOND LIEN COLLATERAL AGENT
To: MACDERMID, INCORPORATED
Reel/Frame 031551/0319 →
Release of Security Interest in Patent Collateral at Reel/Frame No. 30833/0804
Nov 1, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS SECOND LIEN COLLATERAL AGENT
To: NAPP SYSTEMS INC.
Reel/Frame 031537/0130 →
Release of Security Interest in Patent Collateral at Reel/Frame No. 30831/0757
Nov 1, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS SECOND LIEN COLLATERAL AGENT
To: MACDERMID PRINTING SOLUTIONS, LLC
Reel/Frame 031537/0113 →
Assignment and Assumption of Security Interests at Reel/Frame Nos. 30831/0549, 30833/0660, 30831/0606, 30833/0700, and 30833/0727
Nov 1, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS FIRST LIEN COLLATERAL AGENT
To: BARCLAYS BANK PLC, AS SUCCESSOR COLLATERAL AGENT
Reel/Frame 031536/0778 →
Change of Name
Mar 17, 2016
From: FRY'S METALS INC.
To: ALPHA METALS, INC.
Reel/Frame 038144/0984 →
Change of Name
Mar 17, 2016
From: ENTHONE-OMI, INC.
To: ENTHONE INC.
Reel/Frame 038129/0512 →
Patent Security Agreement
Apr 15, 2016
From: ALPHA METALS, INC.
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 038439/0590 →
Patent Security Agreement
Apr 15, 2016
From: ENTHONE INC.
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 038439/0777 →
Change of Name
May 30, 2018
From: MACDERMID PRINTING SOLUTIONS, LLC
To: MACDERMID GRAPHICS SOLUTIONS, LLC
Reel/Frame 046268/0600 →
Release of Security Interest
Feb 4, 2019
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: MACDERMID GRAPHICS SOLUTIONS, LLC
Reel/Frame 048232/0638 →
Release of Security Interest
Feb 4, 2019
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: ALPHA ASSEMBLY SOLUTIONS INC. (F/K/A ALPHA METALS, INC.)
Reel/Frame 048232/0849 →
Release of Security Interest
Feb 4, 2019
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: MACDERMID ACUMEN, INC.
Reel/Frame 048232/0405 →