Coated solder metal particles
View Patent ↗A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.
1. Electrostatically or electrokinetically mobile solder metal particles for use in an electrostatic or electrokinetic deposition process, the solder metal particles comprising:
solder metal particle bodies consisting essentially of a metal/alloy selected from the group consisting of Sn, Sn/Pb, Sn/Ag/Cu, Sn/Ag, Cu, Sn/Ag/Bi, Sn/Bi, and Sn/Pb/Bi;
a coating medium on the particle bodies which facilitates attachment thereto of a charge director material, wherein the coating medium is a polymeric material; and
a charge director material on the coating medium wherein the charge director material has a positive or negative charge and thereby renders the solder metal particle bodies electrostatically or electrokinetically mobile.
2. The solder metal particles of claim 1 wherein the coating medium comprises a polymeric material selected from the group consisting of a) styrene acrylic acid copolymer, b) ethylene acrylic acid co-polymers, c) propylene acrylic acid copolymer, and d) mixtures thereof.
3. Electrostatically or electrokinetically mobile solder metal particles for use in an electrostatic or electrokinetic deposition process, the solder metal particles comprising:
solder metal particle bodies consisting essentially of a metal/alloy selected from the group consisting of Sn, Sn/Pb, Sn/Ag/Cu, Sn/Ag, Cu, Sn/Ag/Bi, Sn/Bi, and Sn/Pb/Bi;
a coating medium on the particle bodies which facilitates attachment thereto of a charge director material, wherein the coating medium is selected from the group consisting of a) stearamidopropyl diethanolamine, b) C16-C18 monoalkyl amines, c) hydrogenated tallowalkylamine, d) N-Myristoyl sarcosine, e) N-Stearoyl sarcosine, f) N-(1,3-dimethylbutyl)-N′-phenyl-P-phenylenediamine, g) N,N′-hexane-1,6-diylbis(3-(3,5-di-tert-butyl-4-hydroxphenylpropionamide)), h) amino-based silicone copolyol surfactants, and i) mixtures thereof; and
a charge director material on the coating medium wherein the charge director material has a positive or negative charge and thereby renders the solder metal particle bodies electrostatically or electrokinetically mobile.
4. Electrostatically or electrokinetically mobile solder metal particles for use in an electrostatic or electrokinetic deposition process, the solder metal particles comprising:
solder metal particle bodies consisting essentially of a metal/alloy selected from the group consisting of Sn, Sn/Pb, Sn/Ag/Cu, Sn/Ag, Cu, Sn/Ag/Bi, Sn/Bi, and Sn/Pb/Bi;
a coating medium on the particle bodies which facilitates attachment thereto of a charge director material, wherein the coating medium is selected from the group consisting of amides, polyamides, and polyamide resins; and
a charge director material on the coating medium wherein the charge director material has a positive or negative charge and thereby renders the solder metal particle bodies electrostatically or electrokinetically mobile.
5. Electrostatically or electrokinetically mobile solder metal particles for use in an electrostatic or electrokinetic deposition process, the solder metal particles comprising:
solder metal particle bodies consisting essentially of a metal/alloy selected from the group consisting of Sn, Sn/Pb, Sn/Ag/Cu, Sn/Ag, Cu, Sn/Ag/Bi, Sn/Bi, and Sn/Pb/Bi;
a coating medium on the particle bodies which facilitates attachment thereto of a charge director material, wherein the coating medium is selected from the group consisting of a) N-Laurylethylenediaminetriacetic acid, b) Glyceryl Stearate SE containing potassium and free glycerol, c) Stearamidopropyl diethanolamine, d) Behenic Acid (docosanoic acid), e) a fatty alcohol/phosphate ester/ethoxylate mixture, and f) mixtures thereof; and
a charge director material on the coating medium wherein the charge director material has a positive or negative charge and thereby renders the solder metal particle bodies electrostatically or electrokinetically mobile.
6. Electrostatically or electrokinetically mobile solder metal particles for use in an electrostatic or electrokinetic deposition process, the solder metal particles comprising:
solder metal particle bodies consisting essentially of a metal/alloy selected from the group consisting of Sn, Sn/Pb, Sn/Ag/Cu, Sn/Ag, Cu, Sn/Ag/Bi, Sn/Bi, and Sn/Pb/Bi;
a coating medium on the particle bodies which facilitates attachment thereto of a charge director material, wherein the coating medium is selected from the group consisting of rosins and modified rosins; and
a charge director material on the coating medium wherein the charge director material has a positive or negative charge and thereby renders the solder metal particle bodies electrostatically or electrokinetically mobile.
7. The solder metal particles of claim 1 wherein the coating medium comprises a material selected from the group consisting of gum rosin, hydrogenated rosins, fumaric adducts of rosins, and maleic acid adducts of rosins.
8. Electrostatically or electrokinetically mobile solder metal particles for use in an electrostatic or electrokinetic deposition process, the solder metal particles comprising:
solder metal particle bodies consisting essentially of a metal/alloy selected from the group consisting of Sn, Sn/Pb, Sn/Ag/Cu, Sn/Ag, Cu, Sn/Ag/Bi, Sn/Bi, and Sn/Pb/Bi;
a coating medium on the particle bodies which facilitates attachment thereto of a charge director material, wherein the coating medium is selected from the group consisting of a) tricarboxylic acids, b) amino acids, c) sulfonic acids, d) sulfamic acids, e) phosphinic acids, f) phosphonic acids, and g) mixtures thereof; and
a charge director material on the coating medium wherein the charge director material has a positive or negative charge and thereby renders the solder metal particle bodies electrostatically or electrokinetically mobile.
9. Electrostatically or electrokinetically mobile solder metal particles for use in an electrostatic or electrokinetic deposition process, the solder metal particles comprising:
solder metal particle bodies consisting essentially of a metal/alloy selected from the group consisting of Sn, Sn/Pb, Sn/Ag/Cu, Sn/Ag, Cu, Sn/Ag/Bi, Sn/Bi, and Sn/Pb/Bi;
a coating medium on the particle bodies which facilitates attachment thereto of a charge director material, wherein the coating medium is a mono- or di-carboxylic acid selected from the group consisting of adipic acid, citric acid, ascorbic acid, succinic acid, malic acid, malonic acid, palmitic acid, stearic acid, and mixtures thereof; and
a charge director material on the coating medium wherein the charge director material has a positive or negative charge and thereby renders the solder metal particle bodies electrostatically or electrokinetically mobile.
10. Electrostatically or electrokinetically mobile solder metal particles for use in an electrostatic or electrokinetic deposition process, the solder metal particles comprising:
solder metal particle bodies consisting essentially of a metal/alloy selected from the group consisting of Sn, Sn/Pb, Sn/Ag/Cu, Sn/Ag, Cu, Sn/Ag/Bi, Sn/Bi, and Sn/Pb/Bi;
a coating medium on the particle bodies which facilitates attachment thereto of a charge director material, wherein the coating medium is an aromatic amine or an aliphatic amine selected from the group consisting of a) primary amines, b) secondary amines, c) tertiary amines, and d) mixtures thereof; and
a charge director material on the coating medium wherein the charge director material has a positive or negative charge and thereby renders the solder metal particle bodies electrostatically or electrokinetically mobile.
11. The particles of claim 10 wherein the coating medium comprises a material selected from the group consisting of a) ethyl amine, b) tertiary butyl amine, c) propylamines, d) alkanolamines, e) anisidine, f) N-phenylbenzylamine, g) N-phenyldiethanolamine, h) diphenylguanidine, i) 2-Aminobenzotrifluoride, and j) mixtures thereof.