Patent Assignment
Reel/Frame 038439/0590
Patent Security Agreement
Recorded: 2016-04-15
Pages: 36
Assignor
ALPHA METALS, INC.
Executed: 2016-04-13
Assignee
BARCLAYS BANK PLC, AS COLLATERAL AGENT
745 SEVENTH AVENUE, NEW YORK, NEW YORK, 10019
Covered Properties
(60)
Bismuth Coating Protection for Copper
Patent:
6,090,493 →
Application:
08/704,510 →
Epoxy Based, Voc-Free Soldering Flux
Patent:
5,904,782 →
Application:
08/785,699 →
Process for Silver Plating in Printed Circuit Board Manufacture
Patent:
5,955,141 →
Application:
08/932,392 →
Snap Cure Adhesive Based on Anhydride/Epoxy Resins
Patent:
6,096,808 →
Application:
09/015,164 →
Flip Chip with Integrated Flux and Underfill
Patent:
6,265,776 →
Application:
09/067,381 →
Stencil Incorporating Electronic Tag
Patent:
6,123,024 →
Application:
09/231,490 →
Flip Chip with Integrated Mask and Underfill
Patent:
6,228,678 →
Application:
09/266,166 →
Flip Chip with Integrated Flux and Underfill
Patent:
6,194,788 →
Application:
09/266,232 →
Process for Silver Plating in Printed Circuit Board Manufacture
Patent:
6,319,543 →
Application:
09/282,729 →
Post-Treatment for Copper on Printed Circuit Boards
Patent:
6,294,220 →
Application:
09/345,675 →
Wafer Coating Method for Flip Chips
Patent:
6,323,062 →
Application:
09/395,553 →
Flip Chip Having Integral Mask and Underfill Providing Two-Stage Bump Formation
Patent:
6,228,681 →
Application:
09/395,558 →
Soldering Flux
Low-Residue, Low-Solder-Ball Flux
Soldering Flux Vehicle Additive and Fine Pitch Printing Method
Thermal Interface Material and Heat Sink Configuration
Rapid Surface Cooling of Solder Droplets by Flash Evaporation
Thermoplastic Fluxing Underfill Composition and Method
Thermal Interface Material and Solder Preforms
Underfill Fluxing Curative
Method of Applying a Pattern of Particles to a Substrate
Coating Solder Metal Particles with a Charge Director Medium
Coated Stencil with Reduced Surface Tension
Low Voiding No Flow Fluxing Underfill for Electronic Devices
Solder Preforms for Use in Electronic Assembly
Preparation of Metallic Particles for Electrokinetic or Electrostatic Deposition
Mask and Method for Electrokinetic Deposition and Patterning Process on Substrates
Particles and Inks and Films Using Them
Thermal Interface Material and Solder Preforms
Solder Alloy
Solvent Systems for Metals and Inks
Method for Producing a High-Aspect Ratio Conductive Pattern on a Substrate
Materials for Use with Interconnects of Electrical Devices and Related Methods
Solder Alloy
Reducing Joint Embrittlement in Lead-Free Soldering Processes
Electrical Contacts
Methods for Producing Electrical Conductors
Methods of Attaching a Die to a Substrate
Electrical Conductors and Methods of Making and Using Them
Metallic Particles for Electrokinetic or Electrostatic Deposition
Coated Solder Metal Particles
Electroformed Stencils for Solar Cell Front Side Metallization
Flux Formulations
Application:
12/497,065 →
Publication:
US 2010/0139952
Mono-Acid Hybrid Conductive Composition and Method
Particles and Inks and Films Using Them
Sintering Materials and Attachment Methods Using Same
Process for Silver Plating in Printed Circuit Board Manufacture
Patent:
45,279 →
Application:
13/471,203 →
Process for Silver Plating in Printed Circuit Board Manufacture
Patent:
45,175 →
Application:
13/655,159 →
Methods for Attachment and Devices Produced Using the Methods
Conductive Compositions and Methods of Using Them
Flux Formulations
Solvent Systems for Metals and Inks
Application:
14/095,559 →
Publication:
US 2014/0186524
High Impact Toughness Solder Alloy
Application:
14/236,432 →
Publication:
US 2014/0219711
Solder Compositions
Application:
14/236,480 →
Publication:
US 2014/0199115
Systems and Methods for Void Reduction in a Solder Joint
Application:
14/347,035 →
Publication:
US 2014/0328039
Solder Preforms and Solder Alloy Assembly Methods
Lead-Free and Antimony-Free Tin Solder Reliable at High Temperatures
Application:
14/434,470 →
Publication:
US 2015/0266137
Sintering Powder
Lead-Free and Antimony-Free Tin Solder Reliable at High Temperatures
Lead-Free and Antimony-Free Tin Solder Reliable at High Temperatures
Application:
14/878,056 →
Publication:
US 2016/0023309
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Mar 17, 2016
From: FRY'S METALS INC.
To: ALPHA METALS, INC.
Reel/Frame 038144/0984 →
Release of Security Interest
Feb 4, 2019
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: ALPHA ASSEMBLY SOLUTIONS INC. (F/K/A ALPHA METALS, INC.)
Reel/Frame 048232/0849 →
Security Interest
Feb 5, 2019
From: ALPHA ASSEMBLY SOLUTIONS INC. (F/K/A ALPHA METALS, INC.)
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 048260/0683 →
Change of Name
Feb 19, 2019
From: ALPHA METALS, INC.
To: ALPHA ASSEMBLY SOLUTIONS INC.
Reel/Frame 048373/0054 →
Change of Name
Feb 21, 2019
From: ALPHA METALS, INC.
To: ALPHA ASSEMBLY SOLUTIONS INC.
Reel/Frame 048406/0059 →
Change of Name
Feb 25, 2019
From: ALPHA METALS, INC.
To: ALPHA ASSEMBLY SOLUTIONS INC.
Reel/Frame 048776/0390 →
Assignment of Security Interest in Patent Collateral
Nov 17, 2022
From: BARCLAYS BANK PLC
To: CITIBANK, N.A.
Reel/Frame 061956/0643 →