Reducing joint embrittlement in lead-free soldering processes
View Patent ↗In the manufacture of products such as printed wiring boards or chip scale packaging and ball grid arrays, incorporating one or more elements selected from among Ni, Co, Cr, Mn, Zr, Fe and Si into a lead-free soldering process to reduce joint embrittlement. In varied embodiments this is accomplished by spraying onto a solder sphere or preform surface, by spraying onto a device substrate surface, or by incorporating into the device substrate alloy.
1. A method of forming a solder joint, comprising:
(a) providing a lead-free, tin-containing solder alloy;
(b) providing a printed wiring board substrate or a ball grid array substrate, said substrate being formed from a material comprising copper, and one or more of Ni, Co, Cr, Mn, Zr, Fe and Si and/or alloys thereof, and optionally also zinc;
(c) heating the solder alloy; and
(d) either before, during or after step (c) contacting the solder alloy with the substrate;
wherein said material of the substrate comprises 95 wt % or more Cu and at least one selected from among 0.04 to 5 wt % Zr, 0.04 to 5 wt % Fe, and 0.04 to 5 wt % Si; and
wherein the substrate is formed from one of the following alloy compositions (wt. %): Cu-1Zr, Cu-2.35Fe-0.03P-0.12Zn, Cu-1.5Fe-0.18P-0.8Co-0.6Sn, Cu-0.6Fe-0.2P-0.05Mg, Cu-2.8Al-1.8Si-0.4Co, Cu-3.0Ni-0.65Si-0.15Mg, Cu-3.0Si-1.5Sn-0.1Cr.
2. A method of forming a solder joint, comprising:
(a) providing a lead-free, tin-containing solder alloy , wherein the lead-free, tin-containing solder is essentially free of Ni, Co, Cr, Mn, Zr, Fe and Si;
(b) providing a printed wiring board substrate or a ball grid array substrate, said substrate being formed from a material comprising copper, and one or more of Ni, Co, Cr, Mn, Zr, Fe and Si and/or alloys thereof , and optionally also zinc;
(c) heating the solder alloy; and
(d) either before, during or after step (c) contacting the solder alloy with the substrate:
wherein the lead-free, tin-containing solder is based on a Sn-Cu alloy including Ag.
3. A method of forming a solder joint, comprising:
(a) providing a lead-free, tin-containing solder alloy;
(b) providing a printed wiring board substrate or a ball grid array substrate, said substrate being formed from a material comprising copper, and one or more of Ni, Co, Cr, Mn, Zr, Fe and Si and/or alloys thereof, and optionally also zinc;
(c) heating the solder alloy; and
(d) either before, during or after step (c) contacting the solder alloy with the substrate:
wherein said material of the substrate comprises 95 wt % or more Cu and at least one selected from among 0.04 to 5 wt % Zr, 0.04 to 5 wt % Fe, and 0.04 to 5 wt % Si; and
wherein the lead-free, tin-containing solder is based on a Sn-Cu alloy including Ag.
4. The method of claim 1 wherein the lead-free, tin-containing solder is based on a Sn-Cu alloy including Ag.
5. The method of claim 1 wherein the lead-free, tin-containing solder is essentially free of Ni.
6. The method of claim 3 wherein the lead-free, tin-containing solder is essentially free of Ni.
7. The method of claim 1 wherein the lead-free, tin-containing solder is essentially free of Ni, Co, Cr, Mn, Zr, Fe, and Si.
8. The method of claim 3 wherein the lead-free, tin-containing solder is essentially free of Ni, Co, Cr, Mn, Zr, Fe, and Si.
9. A method of forming a solder joint, comprising:
(a) providing a lead-free, tin-containing solder alloy based on a Sn-Cu alloy including Ag;
(b) providing a printed wiring board substrate or a ball grid array substrate, said substrate being formed from a material comprising copper, and one or more of Ni, Co, Cr, Mn, Zr, Fe and Si and/or alloys thereof, and optionally also zinc;
(c) heating the solder alloy; and
(d) either before, during or after step (c) contacting the solder alloy with the substrate.
10. The method of claim 9 wherein in said material comprising copper and one or more of Ni, Co, Cr, Mn, Zr, Fe and Si and/or alloys thereof, each of said Ni, Co, Cr, Mn, Zr, Fe and Si has a concentration up to 3 wt %.
11. The method of claim 9 wherein the substrate comprises an electrodeposited foil or rolled foil bonded to a glass fiber epoxy laminate.
12. The method of claim 9 wherein said material comprising copper and one or more of Ni, Co, Cr, Mn, Zr, Fe and Si and/or alloys thereof comprises:
95 wt. % or more Cu
at least one of
from 0.04 to 5% Zr
from 0.04 to 5% Fe
from 0.04 to 5% Si
and optionally one or more of
0-0.5 wt. % P
0-0.5 wt. % Mg
0-0.5 wt. % Zn
0-2 wt % Co
0-3 wt % Sn
0-4 wt % Ni
0-0.5 wt % Cr
0-4 wt % Al
and any unavoidable impurities.
13. The method of claim 9 wherein said material comprising copper and one or more of Ni, Co, Cr, Mn, Zr, Fe and Si and/or alloys thereof comprises at least 95 wt % Cu and between about 0.5 and about 2 wt % Zr.
14. The method of claim 9 wherein said material comprising copper and one or more of Ni, Co, Cr, Mn, Zr, Fe and Si and/or alloys thereof comprises at least 95 wt % Cu and between about 0.3 and about 4 wt % Fe.
15. The method of claim 9 wherein said material comprising copper and one or more of Ni, Co, Cr, Mn, Zr, Fe and Si and/or alloys thereof comprises at least 95 wt % Cu and between about 0.3 and about 4 wt % Si.
16. the method of claim 11 wherein the lead-free, tin-containing solder is essentially free of Ni, Co, Cr, Mn, Zr, Fe, and Si.
17. The method of claim 9 wherein the lead-free, Sn-containing solder is Sn-3.0Ag-0.5Cu (wt %).
18. The method of claim 2 wherein the substrate comprises an electrodeposited foil or rolled foil bonded to a glass fiber epoxy laminate.
19. The method of claim 3 wherein the substrate comprises an electrodeposited foil or rolled foil bonded to a glass fiber epoxy laminate.
20. The method of claim 2 wherein the lead-free, Sn-containing solder is Sn-3.0Ag-0.5Cu (wt %).
21. The method of claim 3 wherein the lead-free, Sn-containing solder is Sn-3.0Ag-0.5Cu (wt %).