Patent Assignment
Reel/Frame 038144/0984
Change of Name
Recorded: 2016-03-17
Pages: 4
Assignor
FRY'S METALS INC.
Executed: 2013-03-11
Assignee
ALPHA METALS, INC.
109 CORPORATE BOULEVARD, SOUTH PLAINFIELD, NEW JERSEY, 07080
Covered Properties
(32)
Bismuth Coating Protection for Copper
Patent:
6,090,493 →
Application:
08/704,510 →
Epoxy Based, Voc-Free Soldering Flux
Patent:
5,904,782 →
Application:
08/785,699 →
Process for Silver Plating in Printed Circuit Board Manufacture
Patent:
5,955,141 →
Application:
08/932,392 →
Flip Chip with Integrated Flux and Underfill
Patent:
6,265,776 →
Application:
09/067,381 →
Flip Chip with Integrated Mask and Underfill
Patent:
6,228,678 →
Application:
09/266,166 →
Flip Chip Having Integral Mask and Underfill Providing Two-Stage Bump Formation
Patent:
6,228,681 →
Application:
09/395,558 →
Soldering Flux
Low-Residue, Low-Solder-Ball Flux
Soldering Flux Vehicle Additive and Fine Pitch Printing Method
Thermal Interface Material and Heat Sink Configuration
Rapid Surface Cooling of Solder Droplets by Flash Evaporation
Thermoplastic Fluxing Underfill Composition and Method
Thermal Interface Material and Solder Preforms
Underfill Fluxing Curative
Method of Applying a Pattern of Particles to a Substrate
Coating Solder Metal Particles with a Charge Director Medium
Coated Stencil with Reduced Surface Tension
Low Voiding No Flow Fluxing Underfill for Electronic Devices
Solder Preforms for Use in Electronic Assembly
Preparation of Metallic Particles for Electrokinetic or Electrostatic Deposition
Mask and Method for Electrokinetic Deposition and Patterning Process on Substrates
Particles and Inks and Films Using Them
Thermal Interface Material and Solder Preforms
Solder Alloy
Reducing Joint Embrittlement in Lead-Free Soldering Processes
Methods for Producing Electrical Conductors
Electrical Conductors and Methods of Making and Using Them
Metallic Particles for Electrokinetic or Electrostatic Deposition
Coated Solder Metal Particles
Electroformed Stencils for Solar Cell Front Side Metallization
Process for Silver Plating in Printed Circuit Board Manufacture
Patent:
45,279 →
Application:
13/471,203 →
Process for Silver Plating in Printed Circuit Board Manufacture
Patent:
45,175 →
Application:
13/655,159 →
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement
Apr 15, 2016
From: ALPHA METALS, INC.
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 038439/0590 →
Release of Security Interest
Feb 4, 2019
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: ALPHA ASSEMBLY SOLUTIONS INC. (F/K/A ALPHA METALS, INC.)
Reel/Frame 048232/0849 →
Security Interest
Feb 5, 2019
From: ALPHA ASSEMBLY SOLUTIONS INC. (F/K/A ALPHA METALS, INC.)
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 048260/0683 →
Change of Name
Feb 19, 2019
From: ALPHA METALS, INC.
To: ALPHA ASSEMBLY SOLUTIONS INC.
Reel/Frame 048373/0054 →
Change of Name
Feb 21, 2019
From: ALPHA METALS, INC.
To: ALPHA ASSEMBLY SOLUTIONS INC.
Reel/Frame 048406/0059 →
Change of Name
Feb 25, 2019
From: ALPHA METALS, INC.
To: ALPHA ASSEMBLY SOLUTIONS INC.
Reel/Frame 048776/0390 →
Assignment of Security Interest in Patent Collateral
Nov 17, 2022
From: BARCLAYS BANK PLC
To: CITIBANK, N.A.
Reel/Frame 061956/0643 →