Low voiding no flow fluxing underfill for electronic devices
View Patent ↗A no flow fluxing underfill having a hardener component comprising a phenolic component and an anhydride component in a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1; or between about 0.8:1 and about 1.2:1. An underfill preparation method involving blending an epoxy component and a phenolic component, heating the blend, and cooling the blend, prior to incorporation of an anhydride component.
1. A method of preparing a dispensable underfill composition of the type comprising an epoxy component, an anhydride component, and a phenolic component for use in electronics manufacture, the method comprising the following steps in order:
(1) blending the epoxy component and at least about 80 wt % of the phenolic component to yield an epoxy/phenolic blend;
(2) heating the epoxy/phenolic blend to a temperature greater than a softening temperature of the phenolic component and below a temperature at which the epoxy component and phenolic component polymerize;
(3) cooling the epoxy/phenolic blend; and
(4) blending the anhydride component into the epoxy/phenolic blend to yield the dispensable underfill composition.
2. The method of claim 1 wherein said cooling the epoxy/phenolic blend comprises cooling to a temperature below about 40° C.
3. The method of claim 1 wherein the blending the epoxy component and the at least about 80 wt % of the phenolic component to yield an epoxy/phenolic blend comprises blending the epoxy component and substantially all of the phenolic component.
4. The method of claim 2 wherein the blending the epoxy component and the at least about 80 wt % of the phenolic component to yield an epoxy/phenolic blend comprises blending the epoxy component and substantially all of the phenolic component.
5. The method of claim 1 wherein the blending the anhydride component into the epoxy/phenolic blend to yield the underfill composition comprises blending the anhydride component into the epoxy/phenolic blend in an amount such that the underfill composition has a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1.
6. The method of claim 1 wherein the blending the epoxy component and the blending the anhydride component yield a molar ratio of epoxy component to total hardener of between about 0.6:1 and about 1.4:1, wherein the total hardener is a cumulative of the phenolic component and the anhydride component.
7. The method of claim 2 wherein the blending the anhydride component into the epoxy/phenolic blend to yield the underfill composition comprises blending the anhydride component into the epoxy/phenolic blend in an amount such that the underfill composition has a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1.
8. The method of claim 2 wherein the blending the epoxy component and the blending the anhydride component yield a molar ratio of epoxy component to total hardener of between about 0.6:1 and about 1.4:1, wherein the total hardener is a cumulative of the phenolic component and the anhydride component.
9. The method of claim 3 wherein the blending the anhydride component into the epoxy/phenolic blend to yield the underfill composition comprises blending the anhydride component into the epoxy/phenolic blend in an amount such that the underfill composition has a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1.
10. The method of claim 3 wherein the blending the epoxy component and the blending the anhydride component yield a molar ratio of epoxy component to total hardener of between about 0.6:1 and about 1.4:1, wherein the total hardener is a cumulative of the phenolic component and the anhydride component.
11. The method of claim 1 further comprising blending additives into the epoxy/phenolic blend, wherein the additives are selected from the group consisting of wetting agents, defoaming agents, flow-enhancers, dispersing aids, flame retardants, coupling agents, stress reducing agents, CTE modifiers, and combinations thereof.
12. The method of claim 1 further comprising blending additives into the epoxy/phenolic blend, wherein the additives are selected from the group consisting of wetting agents, defoaming agents, flow-enhancers, dispersing aids, flame retardants, coupling agents, stress reducing agents, CTE modifiers, and combinations thereof, and wherein the blending the additives is performed after the cooling the epoxy/phenolic blend.
13. The method of claim 2 further comprising blending additives into the epoxy/phenolic blend, wherein the additives are selected from the group consisting of wetting agents, defoaming agents, flow-enhancers, dispersing aids, flame retardants, coupling agents, stress reducing agents, CTE modifiers, and combinations thereof.
14. The method of claim 2 further comprising blending additives into the epoxy/phenolic blend, wherein the additives are selected from the group consisting of wetting agents, defoaming agents, flow-enhancers, dispersing aids, flame retardants, coupling agents, stress reducing agents, CTE modifiers, and combinations thereof, and wherein the blending the additives is performed after the cooling the epoxy/phenolic blend.
15. The method of claim 5 further comprising blending additives into the epoxy/phenolic blend, wherein the additives are selected from the group consisting of wetting agents, defoaming agents, flow-enhancers, dispersing aids, flame retardants, coupling agents, stress reducing agents, CTE modifiers, and combinations thereof.
16. The method of claim 6 further comprising blending additives into the epoxy/phenolic blend, wherein the additives are selected from the group consisting of wetting agents, defoaming agents, flow-enhancers, dispersing aids, flame retardants, coupling agents, stress reducing agents, CTE modifiers, and combinations thereof, and wherein the blending the additives is performed after the cooling the epoxy/phenolic blend.
17. The method of claim 1 further comprising blending a latent catalyst into the epoxy/phenolic blend.
18. The method of claim 1 further comprising blending a latent catalyst into the epoxy/phenolic blend, wherein the blending the latent catalyst is performed after the cooling the epoxy/phenolic blend.
19. The method of claim 2 further comprising blending a latent catalyst into the epoxy/phenolic blend.
20. The method of claim 2 further comprising blending a latent catalyst into the epoxy/phenolic blend, wherein the blending the latent catalyst is performed after the cooling the epoxy/phenolic blend.
21. The method of claim 5 further comprising blending a latent catalyst into the epoxy/phenolic blend.
22. The method of claim 5 further comprising blending a latent catalyst into the epoxy/phenolic blend, wherein the blending the latent catalyst is performed after the cooling the epoxy/phenolic blend.
23. The method of claim 6 further comprising blending a latent catalyst into the epoxy/phenolic blend.
24. The method of claim 6 further comprising blending a latent catalyst into the epoxy/phenolic blend, wherein the blending the latent catalyst is performed after the cooling the epoxy/phenolic blend.
25. The method of claim 1 wherein the blending the anhydride component into the epoxy/phenolic blend to yield the underfill composition comprises blending the anhydride component into the epoxy/phenolic blend in an amount such that the underfill composition has a molar ratio of phenolic component to anhydride component of between about 0.8:1 and about 1.2:1.
26. The method of claim 2 wherein the blending the anhydride component into the epoxy/phenolic blend to yield the underfill composition comprises blending the anhydride component into the epoxy/phenolic blend in an amount such that the underfill composition has a molar ratio of phenolic component to anhydride component of between about 0.8:1 and about 1.2:1.
27. The method of claim 6 wherein the blending the anhydride component into the epoxy/phenolic blend to yield the underfill composition comprises blending the anhydride component into the epoxy/phenolic blend in an amount such that the underfill composition has a molar ratio of phenolic component to anhydride component of between about 0.8:1 and about 1.2:1.
28. The method of claim 12 wherein the blending the anhydride component into the epoxy/phenolic blend to yield the underfill composition comprises blending the anhydride component into the epoxy/phenolic blend in an amount such that the underfill composition has a molar ratio of phenolic component to anhydride component of between about 0.8:1 and about 1.2:1.
29. The method of claim 17 wherein the blending the anhydride component into the epoxy/phenolic blend to yield the underfill composition comprises blending the anhydride component into the epoxy/phenolic blend in an amount such that the underfill composition has a molar ratio of phenolic component to anhydride component of between about 0.8:1 and about 1.2:1.
30. The method of claim 18 wherein the blending the anhydride component into the epoxy/phenolic blend to yield the underfill composition comprises blending the anhydride component into the epoxy/phenolic blend in an amount such that the underfill composition has a molar ratio of phenolic component to anhydride component of between about 0.8:1 and about 1.2:1.
31. The method of claim 1 wherein heating the epoxy/phenolic blend to a temperature greater than a softening temperature of the phenolic component comprises heating to a temperature above about 80° C.
32. The method of claim 2 wherein heating the epoxy/phenolic blend to a temperature greater than a softening temperature of the phenolic component comprises heating to a temperature above about 80° C.
33. The method of claim 1 wherein the phenolic component is a semi-solid or liquid phenolic resin.
34. The method of claim 2 wherein the phenolic component is a semi-solid or liquid phenolic resin.
35. The method of claim 5 wherein the phenolic component is a semi-solid or liquid phenolic resin.
36. The method of claim 9 wherein the phenolic component is a semi-solid or liquid phenolic resin.
37. The method of claim 1 wherein the phenolic component is a solid phenolic novolac compound.
38. The method of claim 2 wherein the phenolic component is a solid phenolic novolac compound.
39. The method of claim 5 wherein the phenolic component is a solid phenolic novolac compound.
40. The method of claim 9 wherein the phenolic component is a solid phenolic novolac compound.
41. The method of claim 17 wherein the latent catalyst is selected from the group consisting of polymer-bound catalysts and phosphonium salt-based catalysts.
42. The method of claim 19 wherein the latent catalyst is selected from the group consisting of polymer-bound catalysts and phosphonium salt-based catalysts.
43. The method of claim 21 wherein the latent catalyst is selected from the group consisting of polymer-bound catalysts and phosphonium salt-based catalysts.
44. The method of claim 23 wherein the latent catalyst is selected from the group consisting of polymer-bound catalysts and phosphonium salt-based catalysts.
45. The method of claim 1 wherein the epoxy resin component comprises between about 25 weight percent and about 75 weight percent of the dispensable underfill composition, the anhydride component comprises between about 15 weight percent and about 90 weight percent of the dispensable underfill composition, and the phenolic component comprises between about 5 weight percent and about 60 weight percent of the dispensable underfill composition.
46. The method of claim 2 wherein the epoxy resin component comprises between about 25 weight percent and about 75 weight percent of the dispensable underfill composition, the anhydride component comprises between about 15 weight percent and about 90 weight percent of the dispensable underfill composition, and the phenolic component comprises between about 5 weight percent and about 60 weight percent of the dispensable underfill composition.
47. The method of claim 5 wherein the epoxy resin component comprises between about 25 weight percent and about 75 weight percent of the dispensable underfill composition, the anhydride component comprises between about 15 weight percent and about 90 weight percent of the dispensable underfill composition, and the phenolic component comprises between about 5 weight percent and about 60 weight percent of the dispensable underfill composition.
48. The method of claim 9 wherein the epoxy resin component comprises between about 25 weight percent and about 75 weight percent of the dispensable underfill composition, the anhydride component comprises between about 15 weight percent and about 90 weight percent of the dispensable underfill composition, and the phenolic component comprises between about 5 weight percent and about 60 weight percent of the dispensable underfill composition.