IP Library Assignment 048776/0390
Patent Assignment
Reel/Frame 048776/0390

Change of Name

Recorded: 2019-02-25 Pages: 4
Assignor
ALPHA METALS, INC.
Executed: 2016-09-28
Assignee
ALPHA ASSEMBLY SOLUTIONS INC.
300 ATRIUM DRIVE, 3RD FLOOR, SOMERSET, NEW JERSEY, 08873
Covered Properties (15)
Flip Chip with Integrated Flux and Underfill
Patent: 6,194,788 →
Application: 09/266,232 →
Process for Silver Plating in Printed Circuit Board Manufacture
Patent: 6,319,543 →
Application: 09/282,729 →
Flip Chip Having Integral Mask and Underfill Providing Two-Stage Bump Formation
Patent: 6,228,681 →
Application: 09/395,558 →
Thermoplastic Fluxing Underfill Composition and Method
Patent: 7,166,491 →
Application: 10/458,925 →
Publication: US 2004/0251561
Thermal Interface Material and Solder Preforms
Patent: 7,187,083 →
Application: 10/722,288 →
Publication: US 2004/0200879
Coated Stencil with Reduced Surface Tension
Patent: 7,093,746 →
Application: 10/899,679 →
Publication: US 2004/0261636
Coated Solder Metal Particles
Patent: 7,655,304 →
Application: 12/191,710 →
Publication: US 2008/0299394
Electroformed Stencils for Solar Cell Front Side Metallization
Patent: 7,749,883 →
Application: 12/201,654 →
Publication: US 2009/0081823
Flux Formulations
Application: 12/497,065 →
Publication: US 2010/0139952
Process for Silver Plating in Printed Circuit Board Manufacture
Patent: 45,279 →
Application: 13/471,203 →
Process for Silver Plating in Printed Circuit Board Manufacture
Patent: 45,175 →
Application: 13/655,159 →
Solvent Systems for Metals and Inks
Application: 14/095,559 →
Publication: US 2014/0186524
High Impact Toughness Solder Alloy
Application: 14/236,432 →
Publication: US 2014/0219711
Solder Compositions
Application: 14/236,480 →
Publication: US 2014/0199115
Lead-Free and Antimony-Free Tin Solder Reliable at High Temperatures
Application: 14/434,470 →
Publication: US 2015/0266137
Related Assignments (11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 21, 2014
From: PANDHER, RANJIT; SINGH, BAWA; SARKAR, SIULI; CHEGUDI, SUJATHA
To: ALPHA METALS, INC.
Reel/Frame 032497/0787 →
Assignment of Assignor's Interest Mar 21, 2014
From: DE AVILA RIBAS, MORGANA; LODGE, DOMINIC; PANDHER, RANJIT; SINGH, BAWA
To: ALPHA METALS, INC.
Reel/Frame 032498/0547 →
Assignment of Assignor's Interest Apr 8, 2014
From: KHASELEV, OSCAR; MARCZI, MICHAEL T.; SINGH, BAWA; DESAI, NITIN
To: FRY'S METALS, INC.
Reel/Frame 032628/0304 →
Change of Name Apr 10, 2014
From: FRY'S METALS INC.
To: ALPHA METALS, INC.
Reel/Frame 032651/0696 →
Change of Name Apr 11, 2014
From: FRY'S METALS INC.
To: ALPHA METALS, INC.
Reel/Frame 032670/0493 →
Assignment of Assignor's Interest Jun 9, 2015
From: PANDHER, RANJIT; BHATKAL, RAVI; SINGH, BAWA; RIBAS, MORGANA DE AVILA
To: ALPHA METALS, INC.
Reel/Frame 035866/0570 →
Change of Name Mar 17, 2016
From: FRY'S METALS INC.
To: ALPHA METALS, INC.
Reel/Frame 038144/0984 →
Patent Security Agreement Apr 15, 2016
From: ALPHA METALS, INC.
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 038439/0590 →
Release of Security Interest Feb 4, 2019
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: ALPHA ASSEMBLY SOLUTIONS INC. (F/K/A ALPHA METALS, INC.)
Reel/Frame 048232/0849 →
Security Interest Feb 5, 2019
From: ALPHA ASSEMBLY SOLUTIONS INC. (F/K/A ALPHA METALS, INC.)
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 048260/0683 →
Assignment of Security Interest in Patent Collateral Nov 17, 2022
From: BARCLAYS BANK PLC
To: CITIBANK, N.A.
Reel/Frame 061956/0643 →