Soldering flux vehicle additive and fine pitch printing method
View Patent ↗A lubricant additive which is a branched chain fatty alcohol or fatty acid containing a total of from 8 to 50 carbon atoms with a minimum of 4 carbon atoms being present in the shorter alkyl chain, or an ester thereof. The lubricant additive is especially adapted for inclusion in a non-aqueous flux vehicle that is mixed with a solder alloy powder to make a solder paste used in the manufacture of printed circuit boards.
1. A method of printing a solder paste onto a substrate surface, the method comprising:
(a) placing a stencil over the substrate surface;
(b) printing the solder paste through the stencil, wherein the solder paste comprises a lubricant additive comprising a branched chain fatty acid comprising 8 to 50 carbon atoms with a minimum of 4 carbon atoms being present in the shorter alkyl chain, or ester thereof, wherein the branched chain fatty acid has a branch point at a second carbon position; and
(c) removing the stencil from the substrate surface.
2. A method of printing a solder paste onto a substrate surface, the method comprising:
(a) placing a stencil over the substrate surface;
(b) printing the solder paste through the stencil, wherein the solder paste comprises a branched chain fatty alcohol or fatty acid lubricant additive comprising 8 to 50 carbon atoms with a minimum of 4 carbon atoms being present in the shorter alkyl chain, or ester thereof;
wherein the lubricant additive is selected from the group consisting of 2-butyl-1-octanol, 2-butyl-1-decanol, 2-hexyl-1-octanol, 2-hexyl-1-decanol, 2-hexyl-1-dodecanol, 2-octyl-1-dodecanol, 2-decyl-1-tetradecanol, 2-butyloctanoic acid, 2-butyldecanoic acid, 2-hexyldecanoic acid, 2-hexyldodecanoic acid, 2-octyldodecanoic acid, 2-decyltetradecanoic acid and 2-hexadecyleicosanoic acid; and
(c) removing the stencil from the substrate surface.
3. The method as set forth in claim 1 wherein the solder paste comprises about 75% to about 95% by weight of a solder powder.
4. The method as set forth in claim 1 wherein the solder powder comprises about 85% to about 90% by weight of a solder paste.
5. The method as set forth in claim 3 wherein the solder powder is an alloy composition selected from the group consisting of SnPb alloys, SnPbBi alloys, SnBi alloys, SnPbAg alloys, SnAgCu alloys, SnAgCuBi alloys and SnZnBi alloys.
6. The method as set forth in claim 1 wherein the solder paste comprises about 0.1 to about 2% by weight of the lubricant additive.
7. The method as set forth in claim 1 wherein the solder paste comprises a polar organic solvent that is a polyhydric alcohol selected from the group consisting of ethylene glycol, diethylene glycol, propylene glycol, sorbitol, pentaerythritol and derivatives thereof, tri(propylene glycol) butyl ether, butyl diglyme, dibutyl itaconate, di(propylene glycol) butyl ether, 2-ethyl hexyl diglycol, γ-butyrolactone, hexyl carbitol, N-methyl pyrrolidone, N-ethyl pyrrolidone, terpineol and tetraglyme.
8. A solder paste comprising a solder powder and a non-aqueous vehicle, wherein the non-aqueous vehicle comprises a lubricant additive which is a branched chain fatty acid comprising 8 to 50 carbon atoms with a minimum of 4 carbon atoms being present in the shorter alkyl chain, or an ester thereof, wherein the branched chain fatty acid has a branch point at a second carbon position.
9. A solder paste comprising a solder powder and a non-aqueous vehicle, wherein the non-aqueous vehicle comprises a lubricant additive which is a branched chain fatty alcohol or fatty acid comprising 8 to 50 carbon atoms with a minimum of 4 carbon atoms being present in the shorter alkyl chain, or an ester thereof, wherein the lubricant additive is selected from the group consisting of 2-butyl-1-octanol, 2-butyl-1-decanol, 2-hexyl-1-octanol, 2-hexyl-1-decanol, 2-hexyl-1-dodecanol, 2-octyl-1-dodecanol, 2-decyl-1-tetradecanol, 2-butyloctanoic acid, 2-butyldecanoic acid, 2-hexyldecanoic acid, 2-hexyldodecanoic acid, 2-octyldodecanoic acid, 2-decyltetradecanoic acid and 2-hexadecyleicosanoic acid.
10. The solder paste as set forth in claim 8 wherein the solder powder comprises about 75% to about 95% by weight of a solder paste.
11. The solder paste as set forth in claim 8 wherein the solder powder comprises about 85% to about 90% by weight of a solder paste.
12. The solder paste as set forth in claim 8 wherein the solder powder is an alloy composition selected from the group consisting of SnPb alloys, SnPbBi alloys, SnBi alloys, SnPbAg alloys, SnAgCu alloys, SnAgCuBi alloys and SnZnBi alloys.
13. The solder paste as set forth in claim 8 wherein the lubricant additive comprises about 0.1 to about 2% by weight of the solder paste.
14. The solder paste as set forth in claim 8 wherein the non-aqueous vehicle comprises a polar organic solvent that is polyhydric alcohol selected from the group consisting of ethylene glycol, diethylene glycol, propylene glycol, sorbitol, pentaerythritol and derivatives thereof, tri(propylene glycol) butyl ether, butyl diglyme, dibutyl itaconate, di(propylene glycol) butyl ether, 2-ethyl hexyl diglycol, γ-butyrolactone, hexyl carbitol, N-methyl pyrrolidone, N-ethyl pyrrolidone, terpineol and tetraglyme.