Conductive compositions and methods of using them

1. A semiconductor component, comprising:

a semiconductor chip with a solderable surface to provide one or more vertical interconnection pathways to a substrate with a solderable surface; and

an electrically conductive composition comprising:

a) at least one metal;

b) a solder or solder alloy;

c) a resin; and

d) a mono-acid hybrid comprising an unprotected, single reactive group at a first terminus and substantially non-reactive groups elsewhere such that the mono-acid hybrid is functional as a chain terminator,

wherein the mono-acid hybrid of the conductive composition is a compound having the following formula:

wherein X equals 1 to 9 and R 1 and R 2 are each independently selected from the group consisting of H, C1-C6 alkyl groups, C1-C6 aliphatic groups, C1-C6 alkoxy groups, and C1-C9 aromatic groups, any of which may be substituted with one or more functionalities that are substantially non-reactive to avoid cross-linking with other components of the composition.

2. The semiconductor component of claim 1 , wherein the at least one metal of the conductive composition is selected from the group consisting of copper, silver, silver coated copper, tin coated copper, capped copper, aluminum and combinations thereof.

3. The semiconductor component of claim 1 , wherein the at least one solder or solder alloy of the conductive composition is selected from the group consisting of bismuth, copper, silver, tin, indium, antimony, alloys thereof and combinations thereof.

4. The semiconductor component of claim 1 , wherein the at least one metal of the conductive composition is selected from the group consisting of capped metal particles, coated metal particles, uncapped metal particles, uncoated metal particles, metal powders, metal flakes, metal alloys and combinations thereof.

5. The semiconductor component of claim 1 , wherein the resin of the conductive composition is selected from the group consisting of an epoxidized bisphenol F resin, an epoxidized bisphenol A resin, a cycloaliphatic epoxy resin, a aliphatic epoxy resin, a naphthalenic epoxy resin, an epoxy novalac resin, a dicyclopentadiene epoxy resin, a perfluorinated epoxy resin, an epoxidized silicone resin, a biphenyl epoxy resin, a hydrogenated bisphenol F resin, a hydrogenated bisphenol A resin, a cyclohexyl diglycidyl ether resin, a multifunctional epoxy resin, a phenolic resin, a phenolic novolac resin, a cresolic novalac resin, a polyurethane, a polymide, a maleimide, a bismaleimide, a cyanate ester, a dicyanate ester resin, a benzoxazine, an epoxidized silicon, a polyvinyl alcohol, a polyester, a polyurea, an acrylic, an acrylate, a polyolefin, a dicyclopentadiene, a functionalized polyurethane, polybutadiene, functionalized polybutadiene, carboxyterminated butadiene-acrylonitrile, a siloxane polyimide, a polyamide, a polyacrylate, a polysiloxane, a cyanoacrylate and combinations thereof.

6. The semiconductor component of claim 1 , wherein the conductive composition further comprises an anhydride selected from the group consisting of methyl hexahydrophthalic anhydride, tetrahydrophthalic anhydride, nadic methyl anhydride, alkenyl succinic anhydride and combinations thereof.

7. The semiconductor component of claim 1 , wherein in the conductive composition the at least one metal is present from about 10% to about 60% by weight, the solder is present from about 30% to about 90% by weight, the resin is present from about 1% by weight to about 18% by weight, the mono-acid hybrid is present from about 0.5% by weight to about 10% by weight, wherein the weight percentages are all based on a weight of the composition.

8. The semiconductor component of claim 1 , wherein in the conductive composition the at least one metal is copper, the solder or solder alloy is a combination of SnBi and SnAgCu, the epoxy resin is epoxidized bisphenol F, and the mono-acid hybrid is levulinic acid.

9. The semiconductor component of claim 1 , wherein the conductive composition further comprises at least one additional component that comprises one or more reactive moieties selected from the group consisting of an epoxy group, an amine group, an amide group, an alcohol group, an alkenyl group, a vinyl group, an acid group, an allyl group, an acrylate, a methacrylate, a cyanate ester, a dicyanate ester, a maleimide, a bismaleimide, an anhydride, a benzoxazine and combinations thereof.

10. The semiconductor component of claim 1 , wherein the conductive composition further comprises a latent catalyst selected from the group consisting of triphenylphosphine (TPP), tetraphenylphosphonium tetraphenylborate (TPP-K), and triphenylphosphine-benzoquinone (TPP-BQ), an imidizole, 1-Methylimidazole, 2-Methylimidazole, 2-ethyl-4-methylimidazole, 2-ethyl-4methylimidazoline, 2-benzyl-4-methylimidazole, 2-benzyl-4-methylimidazoline, 2ethylimidazole, 2-phenylimidazole, 2-phenyl-4,5-dihydroxymethyimidazole, 1-(2Cyanoethyl)-2-ethyl-4-methylimidazole, 1-(2-cyanoethyl)-2-phenyl-4,5-di(cyanoethoxymethyl) Imidazole, 1-cyanoethyl-2-methylimidazole, a dicyandiamide, Diamino-6[2′-methylimidazolyl-(1′)]ethyl-striazine 2,4-, isocyanuric, 2Heptadecylimidazole and combinations thereof.

11. The semiconductor component of claim 1 , wherein the conductive composition further comprises a monofunctional diluent selected from the group consisting of a substituted phenyl glycidyl ether, an akylphenyl glycidyl ether or an aliphatic glycidyl ether, in which any of the ethers is one or more of t-butylphenyl glycidyl ether, alkyl C8-C14 glycidyl ether, butyl glycidyl ether, cresyl glycidyl ether, phenyl glycidyl ether, nonylphenyl glycidyl ether, 2-ethylhexyl glycidyl ether and combinations thereof.

12. The semiconductor component of claim 1 , wherein the at least one metal of the conductive composition is capped or coated with one or more materials selected from the group consisting of a thermoplastic resin, a solid thermosetting resin, a self assembly monolayer used as an antioxidant and combinations thereof.

13. The semiconductor component of claim 1 , wherein the antioxidant material is selected from the group consisting of a triazole, a benzotriazole, a benzamidizole, an imidizole, or an organic acid and combinations thereof.