Silver plating in electronics manufacture
View Patent ↗Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.
1. A plating composition for Ag plating a metal surface, the composition comprising a source of Ag ions, water, and a modulating agent, wherein the composition has a pH below about 3 and an ionic content such that the composition has a room temperature conductivity below about 10 mS/cm.
2. The composition of claim 1 wherein the composition has an ionic content such that the composition has a room temperature conductivity below about 5 mS/cm.
3. The composition of claim 1 wherein the modulating agent comprises an alkylene polyamine polyacetic acid compound.
4. The composition of claim 3 wherein the alkylene polyamine polyacetic acid compound is from an alkaline earth/alkali metal-free source of alkylene polyamine polyacetic acid compound.
5. The composition of claim 3 wherein the alkylene polyamine polyacetic acid compound is selected from the group consisting of EDTA, DTPA, and HEDTA.
6. The composition of claim 3 wherein the alkylene polyamine polyacetic acid compound comprises N-(2-hydroxyethyl)ethylenediamine triacetic acid from an alkaline earth/alkali metal-free source of N-(2-hydroxyethyl) ethylenediamine triacetic acid.
7. The composition of claim 1 wherein the concentration of the modulating agent is between about 1 and about 25 g/L.
8. The composition of claim 3 wherein the concentration of the alkylene polyamine polyacetic acid compound is between about 1 and about 25 g/L.
9. The composition of claim 6 wherein the concentration of the N-(2-hydroxyethyl)ethylenediamine triacetic acid is between about 1 and about 25 g/L.
10. The composition of claim 7 wherein the concentration of the source of Ag ions is between about 0.1 and about 1.5 g/L.
11. The composition of claim 8 wherein the composition further comprises an ethylene oxide/propylene oxide block co-polymer additive.
12. The composition of claim 9 wherein the composition further an ethylene oxide/propylene oxide block co-polymer additive.
13. The composition of claim 10 wherein the composition further an ethylene oxide/propylene oxide block co-polymer additive.
14. The composition of claim 13 wherein the ethylene oxide/propylene oxide block co-polymer has a unit ratio of PO:EO of 3:4+/−10% or a unit ratio of PO:EO of 5:3+/−10%.
15. The composition of claim 11 wherein the composition further comprises copper nitrate.
16. The composition of claim 13 wherein the composition further comprises copper nitrate up to a concentration of about 0.3 g/L.
17. A plating composition for Ag plating a metal surface, the composition comprising a source of Ag ions, water, and a modulating agent, wherein the composition has a pH below about 3 and an ionic content such that the composition has a room temperature conductivity below about 25 mS/cm.
18. The composition of claim 17 wherein the modulating agent comprises an alkylene polyamine polyacetic acid compound.
19. The composition of claim 18 wherein the composition comprises one or more of the following features:
the alkylene polyamine polyacetic acid compound is from an alkaline earth/alkali metal-free source of alkylene polyamine polyacetic acid compound;
the alkylene polyamine polyacetic acid compound is selected from the group consisting of EDTA, DTPA, and HEDTA;
the alkylene polyamine polyacetic acid compound comprises N-(2-hydroxyethyl)ethylenediamine triacetic acid;
the alkylene polyamine polyacetic acid compound comprises N-(2-hydroxyethyl) ethylenediamine triacetic acid from an alkaline earth/alkali metal-free source of N-(2-hydroxyethyl)ethylenediamine triacetic acid;
the concentration of the alkylene polyamine polyacetic acid compound is between about 1 and about 25 g/L;
the concentration of the source of Ag ions is between about 0.1 and about 1.5 g/L;
the composition further comprises from about 0.1 to about 5 g/l of a surfactant;
the composition further comprises a surfactant comprising an ethylene oxide/propylene oxide block co-polymer additive;
the composition further comprises copper nitrate; and/or
the composition further comprises copper nitrate up to a concentration of about 0.3 g/L.
20. The composition of claim 17 wherein the composition comprises one or more of the following features:
the concentration of the modulating agent is between about 1 and about 25 g/L;
the concentration of the source of Ag ions is between about 0.1 and about 1.5 g/L;
the composition further comprises from about 0.1 to about 5 g/l of a surfactant;
the composition further comprises a surfactant comprising an ethylene oxide/propylene oxide block co-polymer additive;
the composition further comprises copper nitrate; and/or the composition further comprises copper nitrate up to a concentration of about 0.3 g/L.