Patent Assignment
Reel/Frame 048261/0110
Security Interest
Recorded: 2019-02-05
Pages: 44
Assignor
MACDERMID ENTHONE INC. (F/K/A ENTHONE INC.)
Executed: 2019-01-31
Assignee
BARCLAYS BANK PLC, AS COLLATERAL AGENT
745 SEVENTH AVENUE, 27TH FLOOR, NEW YORK, NEW YORK, 10019
Covered Properties
(117)
Printed Circuit Board Manufacture
Electroless Nickel Cobalt Phosphorous Composition and Plating Process
Patent:
6,146,702 →
Application:
08/963,999 →
Ductility Agents for Nickel-Tungsten Alloys
Patent:
6,045,682 →
Application:
09/046,869 →
Electroplating Composition Bath
Patent:
6,576,114 →
Application:
09/069,442 →
Process for Selective Deposition of Osp Coating on Copper, Excluding Deposition on Gold
Patent:
6,524,644 →
Application:
09/383,718 →
Water Soluble Brighteners for Zinc and Zinc Alloy Electrolytes
Patent:
6,238,542 →
Application:
09/394,839 →
Bismuth Coating Protection for Copper
Patent:
6,331,201 →
Application:
09/403,900 →
Chemical Compounds Made of Intrisically Conductive Polymers and Metals
Patent:
6,632,380 →
Application:
09/463,453 →
Electroplating Chemistry for the Cu Filling of Submicron Features of Vlsi/Ulsi Interconnect
Patent:
6,776,893 →
Application:
09/716,975 →
Method for Coating Workpieces
Patent:
6,635,165 →
Application:
09/786,300 →
Process for Metallizing a Plastic Surface
Patent:
6,712,948 →
Application:
09/831,008 →
Defect Reduction in Electrodeposited Copper for Semiconductor Applications
System for the Electrodialytic Regeneration of an Electroless Bath Electrolyte
Solderability Enhancement by Silver Immersion Printed Circuit Board Manufacture
Printed Circuit Board Manufacture
Process for the Non-Galvanic Tin Plating of Copper or Copper Alloys
Patent:
6,821,323 →
Application:
10/129,998 →
Process for the Extended Use of Electrolytes
Patent:
6,797,141 →
Application:
10/148,090 →
Method for the Deposition of a Chromium Alloy
Copper Bath Composition for Electroless and/or Electrolytic Filling of Vias and Trenches for Integrated Circuit Fabrication
Adhesion Promotion in Printed Circuit Boards
Process and Electrolytes for Deposition of Metal Layers
Capping of Metal Interconnects in Integrated Circuit Electronic Devices
Silver Plating in Electronics Manufacture
Copper Electrodeposition in Microelectronics
Maintenance of Metallization Baths
Cobalt and Nickel Electroless Plating in Microelectronic Devices
Method for Treating Laser-Structured Plastic Surfaces
Defectivity and Process Control of Electroless Deposition in Microelectronics Applications
Defectivity and Process Control of Electroless Deposition in Microelectronics Applications
Defectivity and Process Control of Electroless Deposition in Microelectronics Applications
Defectivity and Process Control of Electroless Deposition in Microelectronics Applications
Copper Electrodeposition in Microelectronics
Insoluble Anode
Method for Supplying a Plating Composition with Deposition Metal Ion During a Plating Operation
Method for Direct Metallization of Non-Conducting Substrates
Application:
11/423,474 →
Publication:
US 2006/0280872
Tin-Silver Solder Bumping in Electronics Manufacture
Manufacture of Electroless Cobalt Deposition Compositions for Microelectronics Applications
Method for Etching Non-Conductive Substrate Surfaces
Method for Removing Impurities from a Metal Deposition Process Solution
Organic Solderability Preservative Comprising High Boiling Temperature Alcohol
Metallic Surface Enhancement
Direct Metallization of Electrically Non-Conductive Polyimide Substrate Surfaces
Adhesion Promotion in Printed Circuit Boards
Adhesion Promotion in Printed Circuit Boards
Corrosion Protection of Bronzes
Electrolyte Composition and Method for the Deposition of a Zinc-Nickel Alloy Layer on a Cast Iron Or Steel Substrate
Copper Electrodeposition in Microelectronics
Capping of Metal Interconnects in Integrated Circuit Electronic Devices
Anti-Tarnish Coatings
Defect Reduction in Electrodeposited Copper for Semiconductor Applications
Electrolyte and Process for Depositing a Matt Metal Layer
Copper Metallization of Through Silicon Via
Surface Preparation Process for Damascene Copper Deposition
Composite Coatings for Whisker Reduction
Self Assembled Molecules on Immersion Silver Coatings
Method and Device for Coating Substrate Surfaces
Application:
12/278,256 →
Publication:
US 2009/0324804
Method and Composition for Electrodeposition of Copper in Microelectronics with Dipyridyl-Based Levelers
Deposition of Conductive Polymer and Metallization of Non-Conductive Substrates
Cyanide-Free Electrolyte Composition, and Method for the Deposition of Silver or Silver Alloy Layers on Substrates
Copper Deposition for Filling Features in Manufacture of Microelectronic Devices
Metallic Surface Enhancement
Immersion Tin Silver Plating in Electronics Manufacture
Galvanic Bath and Process for Depositing Zinc-Based Layers
Corrosion Protection of Bronzes
Application:
12/665,908 →
Publication:
US 2010/0319572
Chromium-Free Pickle for Plastic Surfaces
Electrolytic Deposition of Metal-Based Composite Coatings Comprising Nano-Particles
Electrolyte and Method for Deposition of Matte Metal Layer
Application:
13/003,398 →
Publication:
US 2011/0233065
Cyanide Free Electrolyte Composition for the Galvanic Deposition of a Copper Layer
Method for Deposition of Hard Chrome Layers
Application:
13/125,622 →
Publication:
US 2011/0198226
Method for the Post-Treatment of Metal Layers
Anti-Tarnish Coatings
Copper Electrodeposition in Microelectronics
Method for the Deposition of a Metal Layer Comprising a Beta-Amino Acid
Adhesion Promotion in Printed Circuit Boards
Self Assembled Molecules on Immersion Silver Coatings
Composite Coatings for Whisker Reduction
Adhesion Promotion in Printed Circuit Boards
Method for Direct Metallization of Non-Conductive Substrates
Corrosion-Protective Wax Composition Containing Polyaniline in a Doped Form and a Liquid Paraffin
Application:
13/638,442 →
Publication:
US 2013/0130056
Copper Filling of Through Silicon Vias
Silver Plating in Electronics Manufacture
Method and Composition for Electrodeposition of Copper in Microelectronics with Dipyridyl-Based Levelers
Composition and Method for the Deposition of Conductive Polymers on Dielectric Substrates
Process for Filling Vias in the Microelectronics
Aqueous Solution and Method for the Formation of a Passivation Layer
Application:
14/001,360 →
Publication:
US 2014/0154525
Copper Electrodeposition in Microelectronics
Apparatus for Electrochemical Deposition of a Metal
Application:
14/234,080 →
Publication:
US 2014/0158545
Method and Composition for Electrodeposition of Copper in Microelectronics with Dipyridyl-Based Levelers
Process for Electroless Copper Deposition on Laser-Direct Structured Substrates
Beta-Amino Acid Comprising Plating Formulation
Silver Plating in Electronics Manufacture
Chromium-Free Pickle for Plastic Surfaces
Electrodeposition of Silver with Fluoropolymer Nanoparticles
Application:
14/776,879 →
Publication:
US 2016/0032479
Levelers for Copper Deposition in Microelectronics
Aqueous Stripping Composition for Metal Surfaces
Aqueous Electrolyte Composition Having a Reduced Airborne Emission, Method and Use of This Composition
Cyanide-Free Electrolyte Composition and Method for the Deposition of Silver or Silver Alloy Layers on Substrates
Electrodeposition of Copper
Application:
15/037,267 →
Publication:
US 2016/0281251
Process for Filling Vias in the Microelectronics
Advanced Solder Alloys For Electronic Interconnects
Application:
15/286,759 →
Publication:
US 2018/0102464
Copper Electrodeposition in Microelectronics
Application:
15/291,340 →
Publication:
US 2017/0029972
Leveler Compositions for Use in Copper Deposition in Manufacture of Microelectronics
Compositions Including a High Molecular Weight Acid Suitable for Conductive Polymer Formation on Dielectric Substrate
Inhibitor Composition for Racks When Using Chrome Free Etches in a Plating on Plastics Process
Application:
15/551,052 →
Publication:
US 2018/0044813
Elimination of H2S in Immersion Tin Plating Solution
Use of Water Soluble Lanthanide Compounds As Stabilizer In Electrolytes For Electroless Metal Deposition
Application:
15/616,540 →
Publication:
US 2017/0350016
Process for Metalization of Copper Pillars in the Manufacture of Microelectronics
Application:
15/617,482 →
Publication:
US 2018/0355502
Cobalt Filling of Interconnects
Electrolytic Generation of Manganese (III) Ions in Strong Sulfuric Acid Using an Improved Anode
Textured Hardcoat Films
Cobalt Filling of Interconnects in Microelectronics
System and Method for Recovering Catalytic Precious Metal from Aqueous Galvanic Processing Solution
Application:
15/754,224 →
Publication:
US 2018/0245178
Flexible Color Adjustment for Dark Cr(III) Platings
Water Soluble and Air Stable Phosphaadamantanes as Stabilizers for Electroless Metal Deposition
Application:
15/765,637 →
Publication:
US 2019/0085461
Carbon-Based Direct Plating Process
NEAR NEUTRAL pH PICKLE ON MULTI-METALS
Patent:
10,443,135 →
Application:
15/977,526 →
Selective Plating of Three Dimensional Surfaces to Produce Decorative and Functional Effects
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Mar 17, 2016
From: ENTHONE-OMI, INC.
To: ENTHONE INC.
Reel/Frame 038129/0512 →
Patent Security Agreement
Apr 15, 2016
From: ENTHONE INC.
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 038439/0777 →
Release of Security Interest
Feb 4, 2019
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: MACDERMID ENTHONE INC. (F/K/A ENTHONE INC.)
Reel/Frame 048233/0141 →
Change of Name
Feb 15, 2019
From: ENTHONE INC.
To: MACDERMID ENTHONE INC.
Reel/Frame 048355/0656 →
Change of Name
Feb 25, 2019
From: ENTHONE INC
To: MACDERMID ENTHONE INC.
Reel/Frame 048425/0445 →
Assignment of Security Interest in Patent Collateral
Nov 17, 2022
From: BARCLAYS BANK PLC
To: CITIBANK, N.A.
Reel/Frame 061956/0643 →