Composition and method for the deposition of conductive polymers on dielectric substrates

1. A composition for rendering a non-conductive dielectric surface conductive and effective for subsequent metallization by the formation of electrically conductive polymers on the non-conductive dielectric surface, the composition comprising:

a) at least one polymerizable monomer which is capable of forming a conductive polymer,

b) an emulsifier,

c) a polymeric acid having an average molecular weight of at least about 40,000 Da, and

d) at least one source of metallic ions, the at least one source of metallic ions selected from the group consisting of lithium ions, sodium ions, and combinations thereof,

wherein the lithium ions, sodium ions, or a combination thereof are present at a concentration of between 0.04 mol/L and 0.4 mol/L.

2. The composition according to claim 1 wherein the emulsifier comprises an anionic polyarylphenolalkoxylate or a salt of a polyarylphenolalkoxylate.

3. The composition according to claim 1 , wherein the emulsifier comprises a nonionic surfactant.

4. The composition according to claim 1 , wherein the polymeric acid has an average molecular weight of at least about 50,000 Da.

5. The composition according to claim 4 wherein said polymeric acid comprises polymeric sulfonic acid comprising a poly(vinylaryl)sulfonic acid.

6. The composition according to claim 4 wherein the polymeric acid comprises a polymeric sulfonic acid having a molecular weight of at least 75,000 Da.

7. The composition according to claim 1 , further comprising at least one solvent selected from the group consisting of water, methanol, ethanol, n-propanol, isopropanol, higher alcohols, polyalcohols, dimethyl formamide, methylethylketone, cumene sulfonate, N-methyl pyrrolidone, triglyme, diglyme, alkali metal salts of toluene sulfonates, and ethyl esters of alkali metal salts of toluene sulfonates.

8. The composition as set forth in claim 1 further comprising manganese ions.

9. The composition as set forth in claim 1 wherein the monomer comprises a heterocyclic aromatic molecule having the structure:

wherein: X is O, S, or N; and R1 and R2 are each independently hydrogen, a halogen, a substituted or unsubstituted alky group having from 1 to 8 carbon atoms, a substituted or unsubstituted alkoxy group having 1 to 8 carbon atoms; and

wherein the acid is polystyrene sulfonic acid having a molecular weight of at least 75000 Da.

10. The composition as set forth in claim 9 wherein X is S and said polystyrene sulfonic acid has a molecular weight of at least 100000 Da.

11. The composition according to claim 1 , wherein:

the lithium ions are present in the composition at a concentration between 0.001 mol/L and solubility limit;

the emulsifier is a nonionic surfactant;

the polymeric acid is a polymeric sulfonic acid having a molecular weight of at least 40,000 Da; and

the composition further comprises manganese ions, said manganese ions being present in a concentration up to 0.5 mol/L.

12. The composition according to claim 11 wherein the polymeric acid is a polystyrene sulfonic acid having a molecular weight of at least 75,000 Da.

13. A process for metalizing a surface of a dielectric substrate by electrolytic deposition of a metal, the process comprising:

immersing the substrate into a composition comprising:

i) at least one polymerizable monomer which is capable of forming a conductive polymer,

ii) an emulsifier

iii) a polymeric acid having an average molecular weight of at least about 40,000 Da, and

at least one metallic ion selected from the group consisting of lithium ions, sodium ions, and combinations thereof, wherein the lithium ions, sodium ions, or a combination thereof are present at a concentration of between 0.04 mol/L and 0.4 mol/L;

to form an electrically conductive polymer layer on the surface of the dielectric substrate,

wherein the lithium ions and/or sodium ions are incorporated into the electrically conductive polymer layer to contribute to the conductivity of the polymer layer and reduce the electrical resistance of the layer; and thereafter

electrolytically depositing a metal over said electrically conductive polymer layer.

14. The process according to claim 13 , wherein the emulsifier comprises a nonionic surfactant.

15. The process according to claim 13 , wherein the polymeric acid comprises a polymeric sulfonic acid.

16. The process according to claim 13 , wherein the polymeric acid is a polystyrene sulfonic acid having a molecular weight of at least 75,000 Da.

17. The process according to claim 13 , wherein the composition further comprises manganese ions.

18. The process according to claim 13 , wherein prior to the step of immersing the dielectric substrate into the composition, the dielectric substrate is contacted with an initiator solution containing an oxidant,

wherein the polymerizable monomer in the composition reacts with the oxidant.

19. A composition for rendering a non-conductive dielectric surface conductive and effective for subsequent metallization by the formation of electrically conductive polymers on the non-conductive dielectric surface, the composition comprising:

a) at least one polymerizable monomer which is capable of forming a conductive polymer,

b) 0.1 ml/L to 200 ml/L of an emulsifier, wherein the emulsifier comprises a nonionic surfactant,

c) 0.1 to 50 g/L of a polymeric acid, and

d) 0.04 mol/L to 0.4 mol/L of at least one source of metallic ions, wherein the at least one source of metallic ions is selected from the group consisting of lithium ions, sodium ions and combinations thereof.

20. The composition according to claim 19 wherein the acid comprises a polymeric sulfonic acid having a molecular weight of at least 40,000 Da.

21. The composition according to claim 19 further comprising manganese ions, said manganese ions being present in a concentration up to 0.5 mols/L.

22. The composition according to claim 19 comprising:

the emulsifier is a nonionic surfactant;

the polymeric acid is a polymeric sulfonic acid having a molecular weight of at least 40,000 Da; and

the composition further comprises manganese ions, said manganese ions being present in a concentration up to 0.5 mol/L.

23. The composition according to claim 22 wherein the polymeric acid is a polystyrene sulfonic acid having a molecular weight of at least 75000 Da.