Maintenance of metallization baths

1. A method for the regeneration of an electrolyte bath used for a metallization process without a current in a process vessel comprising:

a) removing at least a partial flow of the electrolyte from the process vessel;

b) regenerating said at least partial flow removed in step (a) said regenerating consisting of dialysis, wherein said dialysis excludes electrodialysis;

c) adding metallization components to the at least partial flow; and

d) returning the at least partial flow to the process vessel;

whereby said dialysis excluding electrodialysis exchanges formate anions and sulfate anions released during the metallization process with hydroxide ions via an anion selective membrane through which said formate anions and sulfate anions pass from the partial flow of removed electrolyte to a counter solution and through which said hydroxide ions pass from said counter solution to the partial flow of removed electrolyte during said regeneration;

whereby as said counter solution comprising a hydroxide ion source and recipient of said formate anions and sulfate anions for the regeneration, a solution is used which is selected from the group consisting of an alkali hydroxide-containing solution and an alkaline earth hydroxide-containing solution.

2. The method according to claim 1 wherein the metallization process is for deposition of at least one metal selected from the group consisting of copper, nickel, a ternary nickel alloy, or gold.

3. The method of claim 1 wherein the dialysis involves exchange of at least one additional ion from the group consisting of hypophosphite ions, phosphite ions, phosphate ions, and chloride ions.

4. The method according to claim 1 wherein the counter solution is conducted in a counter flow with respect to the partial flow of electrolyte.

5. The method according to claim 1 wherein the counter solution is conducted in parallel with respect to the partial flow of electrolyte.

6. The method of claim 1 further comprising regenerating the counter-solution after the dialysis.

7. The method according to claim 6 wherein at least one oxidation agent selected from the group consisting of hydrogen peroxide, peroxide sulfates, or potassium monopersulfate is used in regenerating the counter-solution.

8. The method of claim 1 further comprising precipitating the anions received in the counter-solution as hard to dissolve salts to regenerate the counter-solution after the dialysis.

9. The method of claim 8 wherein at least one substance selected from the group consisting of barium hydroxide and calcium hydroxide is used for said precipitation.

10. The method according to claim 1 wherein the metallization process is for deposition of copper.

11. A method for the regeneration of an electrolyte bath used for a metallization process without a current in a process vessel comprising:

a) removing at least a partial flow of the electrolyte from the process vessel;

b) regenerating said at least partial flow removed in step (a) said regenerating consisting of dialysis, wherein said dialysis excludes electrodialysis, involving exchange of anions selected from the group consisting of sulfate ions, formate ions, hypophosphite ions, phosphite ions, phosphate ions, and chloride ions released during the metallization process for hydroxide ions via an anion selective membrane and a counter solution comprising a hydroxide ion source and recipient of said formate anions and sulfate anions, wherein said counter solution is selected from the group consisting of an alkali hydroxide-containing solution and an alkaline earth hydroxide-containing solution;

c) replenishing to the at least partial flow a metallic source for deposition of a metal selected from the group consisting of copper, nickel, a ternary nickel alloy, and gold;

d) replenishing to the at least partial flow a reducing agent; and

e) returning the at least partial flow to the process vessel.

12. The method of claim 11 further comprising regenerating the counter-solution by oxidation after dialysis.

13. The method of claim 11 further comprising precipitating the anions received in the counter-solution as hard to dissolve salts to regenerate the counter-solution after the dialysis.

14. The method of claim 13 wherein at least one substance selected from the group consisting of barium hydroxide and calcium hydroxide is used for said precipitation.

15. The method according to claim 11 wherein the metallization process is for deposition of copper.

16. A method for the regeneration of an electrolyte bath used for an electroless copper metallization process in a process vessel comprising:

a) removing at least a partial flow of the electrolyte from the process vessel;

b) regenerating said at least partial flow removed in step (a) said regenerating consisting of dialysis, wherein said dialysis excludes electrodialysis, involving exchange of sulfate ions released during the metallization process for hydroxide ions via an anion selective membrane and a counter solution comprising a hydroxide ion source and recipient of said formate anions and sulfate anions, wherein said counter solution is selected from the group consisting of an alkali hydroxide-containing solution and an alkaline earth hydroxide-containing solution;

c) replenishing copper sulfate to the at least partial flow as a metallic source for deposition of a copper;

d) replenishing a reducing agent to the at least partial flow; and

e) returning the at least partial flow to the process vessel.

17. The method of claim 16 wherein the reducing agent comprises formaldehyde.