Patent Assignment
Reel/Frame 048355/0656
Change of Name
Recorded: 2019-02-15
Pages: 5
Assignor
ENTHONE INC.
Executed: 2016-06-27
Assignee
MACDERMID ENTHONE INC.
245 FREIGHT STREET, WATERBURY, CONNECTICUT, 06702
Covered Properties
(79)
Method for Coating Workpieces
Patent:
6,635,165 →
Application:
09/786,300 →
Electroplating Chemistry for the Cu Filling of Submicron Features of Vlsi/Ulsi Interconnect
Patent:
6,776,893 →
Application:
09/716,975 →
Process for Selective Deposition of Osp Coating on Copper, Excluding Deposition on Gold
Patent:
6,524,644 →
Application:
09/383,718 →
Defect Reduction in Electrodeposited Copper for Semiconductor Applications
Defect Reduction in Electrodeposited Copper for Semiconductor Applications
Process for the Non-Galvanic Tin Plating of Copper or Copper Alloys
Patent:
6,821,323 →
Application:
10/129,998 →
Process for the Extended Use of Electrolytes
Patent:
6,797,141 →
Application:
10/148,090 →
Water Soluble Brighteners for Zinc and Zinc Alloy Electrolytes
Patent:
6,238,542 →
Application:
09/394,839 →
Process for Metallizing a Plastic Surface
Patent:
6,712,948 →
Application:
09/831,008 →
Electroplating Composition Bath
Patent:
6,576,114 →
Application:
09/069,442 →
Copper Bath Composition for Electroless and/or Electrolytic Filling of Vias and Trenches for Integrated Circuit Fabrication
System for the Electrodialytic Regeneration of an Electroless Bath Electrolyte
Method for the Deposition of a Chromium Alloy
Capping of Metal Interconnects in Integrated Circuit Electronic Devices
Capping of Metal Interconnects in Integrated Circuit Electronic Devices
Copper Electrodeposition in Microelectronics
Copper Electrodeposition in Microelectronics
Copper Electrodeposition in Microelectronics
Copper Electrodeposition in Microelectronics
Copper Electrodeposition in Microelectronics
Adhesion Promotion in Printed Circuit Boards
Adhesion Promotion in Printed Circuit Boards
Adhesion Promotion in Printed Circuit Boards
Adhesion Promotion in Printed Circuit Boards
Process and Electrolytes for Deposition of Metal Layers
Silver Plating in Electronics Manufacture
Silver Plating in Electronics Manufacture
Solderability Enhancement by Silver Immersion Printed Circuit Board Manufacture
Cobalt and Nickel Electroless Plating in Microelectronic Devices
Maintenance of Metallization Baths
Method for Treating Laser-Structured Plastic Surfaces
Electrolytic Deposition of Metal-Based Composite Coatings Comprising Nano-Particles
Bismuth Coating Protection for Copper
Patent:
6,331,201 →
Application:
09/403,900 →
Defectivity and Process Control of Electroless Deposition in Microelectronics Applications
Defectivity and Process Control of Electroless Deposition in Microelectronics Applications
Metallic Surface Enhancement
Metallic Surface Enhancement
Tin-Silver Solder Bumping in Electronics Manufacture
Composite Coatings for Whisker Reduction
Composite Coatings for Whisker Reduction
Insoluble Anode
Manufacture of Electroless Cobalt Deposition Compositions for Microelectronics Applications
Anti-Tarnish Coatings
Anti-Tarnish Coatings
Deposition of Conductive Polymer and Metallization of Non-Conductive Substrates
Organic Solderability Preservative Comprising High Boiling Temperature Alcohol
Method for Supplying a Plating Composition with Deposition Metal Ion During a Plating Operation
Method for Etching Non-Conductive Substrate Surfaces
Copper Deposition for Filling Features in Manufacture of Microelectronic Devices
Method for Removing Impurities from a Metal Deposition Process Solution
Direct Metallization of Electrically Non-Conductive Polyimide Substrate Surfaces
Electrolyte Composition and Method for the Deposition of a Zinc-Nickel Alloy Layer on a Cast Iron Or Steel Substrate
Self Assembled Molecules on Immersion Silver Coatings
Self Assembled Molecules on Immersion Silver Coatings
Copper Metallization of Through Silicon Via
Cyanide-Free Electrolyte Composition, and Method for the Deposition of Silver or Silver Alloy Layers on Substrates
Cyanide-Free Electrolyte Composition and Method for the Deposition of Silver or Silver Alloy Layers on Substrates
Surface Preparation Process for Damascene Copper Deposition
Method and Composition for Electrodeposition of Copper in Microelectronics with Dipyridyl-Based Levelers
Method and Composition for Electrodeposition of Copper in Microelectronics with Dipyridyl-Based Levelers
Method and Composition for Electrodeposition of Copper in Microelectronics with Dipyridyl-Based Levelers
Electrolyte and Process for Depositing a Matt Metal Layer
Cyanide Free Electrolyte Composition for the Galvanic Deposition of a Copper Layer
Immersion Tin Silver Plating in Electronics Manufacture
Chromium-Free Pickle for Plastic Surfaces
Method for the Post-Treatment of Metal Layers
Galvanic Bath and Process for Depositing Zinc-Based Layers
Method for the Deposition of a Metal Layer Comprising a Beta-Amino Acid
Beta-Amino Acid Comprising Plating Formulation
Process for Filling Vias in the Microelectronics
Method for Direct Metallization of Non-Conductive Substrates
Adhesion Promotion in Printed Circuit Boards
Printed Circuit Board Manufacture
Application:
90/009,933 →
Process for Electroless Copper Deposition on Laser-Direct Structured Substrates
Copper Deposition in Wafer Level Packaging of Integrated Circuits
Application:
62/398,316 →
Copper Electrodeposition in Microelectronics
Application:
62/398,294 →
Copper Plating for Solar Panels
Application:
62/398,307 →
Leveler Compositions for Use in Copper Deposition in Manufacture of Microelectronics
Application:
62/294,643 →
Chemical Compounds Made of Intrisically Conductive Polymers and Metals
Patent:
6,632,380 →
Application:
09/463,453 →
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Mar 17, 2016
From: ENTHONE-OMI, INC.
To: ENTHONE INC.
Reel/Frame 038129/0512 →
Patent Security Agreement
Apr 15, 2016
From: ENTHONE INC.
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 038439/0777 →
Assignment of Assignor's Interest
Oct 12, 2016
From: PANECCASIO, VINCENT, JR.; HURTUBISE, RICHARD; LIN, XUAN; FIGURA, PAUL
To: ENTHONE INC.
Reel/Frame 039997/0309 →
Change of Name
Jul 5, 2018
From: ENTHONE, INC.
To: MACDERMID ENTHONE INC.
Reel/Frame 046492/0046 →
Release of Security Interest
Feb 4, 2019
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: MACDERMID ENTHONE INC. (F/K/A ENTHONE INC.)
Reel/Frame 048233/0141 →
Security Interest
Feb 5, 2019
From: MACDERMID ENTHONE INC. (F/K/A ENTHONE INC.)
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 048261/0110 →
Assignment of Security Interest in Patent Collateral
Nov 17, 2022
From: BARCLAYS BANK PLC
To: CITIBANK, N.A.
Reel/Frame 061956/0643 →