Silver plating in electronics manufacture
View Patent ↗Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.
1. A plating composition for Ag plating a metal surface, the composition comprising a source of Ag ions, water, and a modulating agent comprising an alkylene polyamine polyacetic acid compound, wherein the composition has a pH between 1 and about 3 and an ionic content such that the composition has a room temperature conductivity below about 25 mS/cm.
2. The composition of claim 1 wherein the composition has an ionic content such that the composition has a room temperature conductivity below about 5 mS/cm.
3. The composition of claim 1 wherein the alkylene polyamine polyacetic acid compound is from an alkaline earth/alkali metal-free source of alkylene polyamine polyacetic acid compound.
4. The composition of claim 1 wherein the alkylene polyamine polyacetic acid compound comprises N-(2-hydroxyethyl)ethylenediamine triacetic acid from an alkaline earth/alkali metal-free source of N-(2-hydroxyethyl) ethylenediamine triacetic acid.
5. The composition of claim 1 wherein the composition has an ionic content such that the composition has a room temperature conductivity below about 10 mS/cm.
6. The composition of claim 1 wherein the composition has a pH between 1 and about 2.
7. The composition of claim 1 wherein the composition further comprises an ethylene oxide/propylene oxide block co-polymer additive.
8. The composition of claim 7 wherein the ethylene oxide/propylene oxide block co-polymer has a unit ratio of PO:EO of about 3:4.
9. The composition of claim 7 wherein the ethylene oxide/propylene oxide block co-polymer has a unit ratio of PO:EO of 3:4+/−10%.
10. The composition of claim 7 wherein the ethylene oxide/propylene oxide block co-polymer has a unit ratio of PO:EO of about 5:3.
11. The composition of claim 7 wherein the ethylene oxide/propylene oxide block co-polymer has a unit ratio of PO:EO of 5:3+/−10%.
12. The composition of claim 1 wherein the concentration of the source of Ag ions is between about 0.1 and about 1.5 g/L.
13. The composition of claim 1 wherein the concentration of the modulating agent is between about 1 and about 25 g/L.
14. A composition for Ag plating a metal surface comprising:
a) a source of Ag ions;
b) an amino acid inhibitor of Ag deposition which functions at a pH between about 4 and about 5 to slow Ag deposition rate;
c) water; and
d) a hydantoin derivative, wherein the composition has a pH between about 4 and about 5 and an ionic content such that the composition has a room temperature conductivity below about 25 mS/cm.
15. The composition of claim 14 wherein the hydantoin derivative comprises 5,5-dimethylhydantoin.
16. The composition of claim 14 wherein the concentration of the amino acid inhibitor of Ag deposition is between about 20 and about 40 g/L.
17. The composition of claim 16 wherein the concentration of the source of Ag ions is between about 0.5 and about 1 g/L.
18. A composition for Ag plating a metal surface comprising:
a) a source of Ag ions;
b) an amino acid inhibitor of Ag deposition which functions at a pH between about 4 and about 5 to slow Ag deposition rate; and
c) water, wherein the composition has a pH between about 4 and about 5 and an ionic content such that the composition has a room temperature conductivity below about 25 mS/cm and wherein the concentration of the amino acid inhibitor of Ag deposition is between about 20 and about 40 g/L.
19. The composition of claim 18 wherein the amino acid inhibitor is selected from the group consisting of chiral isomers of and racemic mixtures of alanine.
20. The composition of claim 18 wherein the amino acid inhibitor is DL-alanine.