Beta-amino acid comprising plating formulation

1. A plating formulation comprising a metal ion source for a metal to be deposited, a reducing agent, a complexing agent, an accelerator, and a β-amino acid and/or β-amino acid derivative as stabilizer, wherein the β-amino acid is present within a range of 1 mg/L to 2 g/L.

2. The plating formulation of claim 1 wherein the β-amino acid is present within a range of 100 mg/L to 1 g/L.

3. The plating formulation of claim 1 wherein the β-amino acid is present within a range of 200 mg/L to 400 mg/L.

4. The plating formulation of claim 1 wherein the β-amino acid and/or derivative has a pKa value within a range of 4 to 8.

5. The plating formulation of claim 1 wherein the β-amino acid and/or β-amino acid derivative is selected from the group consisting of 3-aminopropionic acid, 3-aminobutyric acid, 3-amino-4-methylvaleric acid, 2-aminoethanesulfonic acid, and derivatives thereof.

6. The plating formulation of claim 1 wherein the β-amino acid and/or β-amino acid derivative is selected from the group consisting of 3-aminopropionic acid, 3-aminobutyric acid, 3-amino-4-methylvaleric acid, and combinations thereof.

7. The plating formulation of claim 1 wherein the reducing agent is a compound of the group consisting of sodium hypophosphite, formaldehyde, dimethyl aminoborane, amino borane, and other organic boranes.

8. The plating formulation of claim 1 wherein the plating formulation comprises as a complexing agent a compound of the group consisting of 2-hydroxy propionic acid, propanedioic acid (malonic acid), EDTA and amino acetic acid.

9. The plating formulation of claim 1 wherein the plating formulation as an accelerator comprises a compound of the group consisting of saccharine, hydantoin, rhodanine, carbamide and carbamide derivates.

10. The plating formulation of claim 1 wherein the plating formulation is free of inorganic stabilizers of lead, bismuth, antimony, zinc and/or tin.

11. The plating formulation of claim 1 wherein the plating formulation is free of cyanides, selenium compounds and sulfur compounds comprising sulfur in an oxidation state between −2 and +5.

12. The plating formulation of claim 1 further comprising at least one additional carboxylic acid and/or at least one salt of a carboxylic acid.

13. The plating formulation of claim 12 wherein the carboxylic acid is a compound of the group consisting of acrylic acids, aromatic carboxylic acids, fatty acids, aliphatic carboxylic acids, keto acids, dicarboxylic acids, tricarboxylic acids, straight chained carboxylic acids, heterocyclic carboxylic acids, saturated carboxylic acids, unsaturated carboxylic acids, and α-hydroxy acids.

14. The playing formulation of claim 12 wherein the ratio of the total equivalent β-amino acid concentration to the difference between the total equivalent carboxyl concentration of the formulation and said total equivalent β-amino acid concentration being not greater than about 0.028.

15. The plating formulation of claim 1 wherein the ratio of the total equivalent β-amino acid concentration to the molar concentration of said reducing agent being no greater than about 0.07 equivalents/mole.

16. The plating formulation of claim 1 , the plating formulation comprising:

13.03

g/L

nickel sulfate;

1.925

mg/L

potassium iodite;

17.27

g/L

lactic acid;

5.94

g/L

malic acid;

40.2

g/L

sodium hypophosphite;

9.81

g/L

sodium hydroxide;

0.35

g/L

β-alanine;

wherein the pH is in a range of pH 4 to pH 7.

17. The plating formulation of claim 1 , wherein the metal ion source comprises a metal selected from the group consisting of nickel, copper, cobalt, boron, gold, and combinations thereof.

18. A plating formulation for deposition of a metal layer on a substrate, the formulation comprising:

a metal ion source for the metal to be deposited;

a β-amino acid and/or β-amino acid derivative as stabilizer, wherein the β-amino acid and/or β-amino acid derivative has a pKa value within the range of 4 to 8;

a reducing agent, wherein the reducing agent is a compound of the group consisting of sodium hypophosphite, formaldehyde, dimethyl aminoborane, amino borane, and other organic boranes;

a complexing agent, wherein the complexing agent comprises a compound of the group consisting of 2-hydroxy propionic acid, propanedioic acid (malonic acid), EDTA and amino acetic acid; and

an accelerator, wherein the accelerator comprises a compound of the group consisting of saccharine, hydantoin, rhodanine, carbamide and carbamide derivates;

wherein the formulation is free of inorganic stabilizers of lead, bismuth, antimony, zinc and/or tin.

19. The plating formulation of claim 18 , wherein:

the metal ion source comprises a metal selected from the group consisting of nickel, copper, cobalt, boron, gold, and combinations thereof;

the reducing agent is sodium hypophosphite in a concentration between 5 and 100 g/L;

the complexing agent comprises a compound of the group consisting of 2-hydroxy propionic acid, propanedioic acid (malonic acid), EDTA and amino acetic acid; and

the accelerator comprises a compound of the group consisting of saccharine, hydantoin, rhodanine, carbamide and carbamide derivates; wherein

the formulation is free of cyanides, selenium compounds and sulfur compounds comprising sulfur in an oxidation state between −2 and +5; and

the ratio of the total equivalent β-amino acid concentration to the molar concentration of said reducing agent is no greater than about 0.07 equivalents/mole.

20. The plating formulation of claim 18 , wherein the ratio of the total equivalent β-amino acid concentration to the difference between the total equivalent carboxyl concentration of the formulation and said total equivalent β-amino acid concentration being not greater than about 0.028.