Electrical connection tape
View Patent ↗A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape.
1. A thermal managing electrical connection tape comprising:
a carrier film; and
a composition including solder powder disposed in a solder flux, the composition being applied to the carrier film,
wherein the composition contains between about 50 wt. % and about 70 wt. % soldering flux and between about 30 wt. % and about 50 wt. % solder powder.
2. The thermal managing electrical connection tape of claim 1 , wherein the composition includes filler materials that increase reliability at high pressures.
3. The thermal managing electrical connection tape of claim 2 , wherein the filler material includes glass frit.
4. The thermal managing electrical connection tape of claim 1 , wherein the composition further includes additives for process temperature and residue evaluations.
5. The thermal managing electrical connection tape of claim 4 , wherein the additives include at least one of Leuco, Leuco-like, and liquid crystal thermochromic dyes.
6. The thermal managing electrical connection tape of claim 1 , wherein the composition is patterned with epoxy and/or acrylic.
7. The thermal managing electrical connection tape of claim 1 , wherein the composition includes at least one of epoxy and acrylic.
8. The thermal managing electrical connection tape of claim 1 , wherein the composition includes a suction cup-shaped morphology.