Granted Patent B2

US 8,518,281 · App. 12/156,613 · Granted Aug 27, 2013

Abstract

Claims (15)

1. A process for preparing metal surfaces, comprising copper or a copper alloy, for subsequent lamination and improving acid resistance, said process comprising the steps of:

(a) contacting the metal surface with an adhesion promoting composition under conditions effective to provide a roughened metal surface that has improved acid resistance, said composition comprising:

i) an oxidizer;

ii) an acid;

iii) a corrosion inhibitor comprising a five-membered heterocyclic compound;

iv) a phosphorous compound selected from the group consisting of thiophosphates, phosphorous sulfides, and diethyl diphosphate ammonium salt;

(b) bonding a polymeric material to the metal surface.

2. The method according to claim 1 , wherein the metal surface is a copper clad laminate.

3. The method according to claim 1 , wherein the five-membered heterocyclic compound is selected from the group consisting of triazoles, tetrazoles, imidazoles, benzimidazoles, derivatives thereof, and combinations of one or more of the foregoing.

4. The method according to claim 1 , wherein the phosphorous compound is selected from the group consisting of phosphorus pentasulfide, diethyl diphosphate ammonium salt, diethyl dithio phosphate, and 2,4-bis-(4-methoxyphenyl)-1,3,2,4-dithiodiphosphetane-2,4-disulfide.

5. The method according to claim 4 , wherein the phosphorous compound comprises phosphorus pentasulfide.

6. The method according to claim 5 , wherein the phosphorus pentasulfide has a concentration of between about 1 and 1000 ppm.

7. The method according to claim 6 , wherein the phosphorus pentasulfide has a concentration of between about 20 and 100 ppm.

8. The method according to claim 7 , wherein the phosphorus pentasulfide has a concentration of between about 20 and about 40 ppm.

9. The method according to claim 1 , wherein the composition comprises a source of halide ions.

Assignments (8)