Patent Assignment
Reel/Frame 048260/0828
Security Interest
Recorded: 2019-02-05
Pages: 44
Assignor
MACDERMID ACUMEN, INC.
Executed: 2019-01-31
Assignee
BARCLAYS BANK PLC, AS COLLATERAL AGENT
745 SEVENTH AVENUE, 27TH FLOOR, NEW YORK, NEW YORK, 10019
Covered Properties
(116)
Tin Plating Electrolyte Compositions
Patent:
6,217,738 →
Application:
09/051,784 →
Photosensitive Resin Composition Useful in Fabricating Printing Plates
Patent:
6,214,522 →
Application:
09/143,427 →
Fluxing Agents for the Reflowing of Electro-Deposited Tinplate
Patent:
6,409,850 →
Application:
09/147,972 →
Process for Plating Upon a Polymeric Surface
Patent:
6,168,836 →
Application:
09/183,137 →
Method for Automatically Forming Ink and Media-Dependent Color Transforms for Diverse Colored Inks and Ink Types, Validating Color Gamut, and Applying Said Inks
Patent:
6,419,340 →
Application:
09/260,925 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,162,503 →
Application:
09/274,641 →
Process for Enhancing the Adhesion of Organic Coatings to Metal Surfaces
Patent:
6,206,981 →
Application:
09/421,204 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,383,272 →
Application:
09/590,046 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,419,784 →
Application:
09/598,857 →
Method for the manufacture of printed circuit boards with plated resistors
Patent:
6,281,090 →
Application:
09/603,978 →
Photosensitive resin composition useful in fabricating printing plates
Patent:
6,197,459 →
Application:
09/620,884 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,554,948 →
Application:
09/643,813 →
Flux Composition and Corresponding Soldering Method
Patent:
6,474,536 →
Application:
09/672,577 →
Method for Enhancing the Solderability of a Surface
Patent:
6,375,822 →
Application:
09/677,904 →
Method for the Manufacture of Printed Circuit Boards
Patent:
6,656,370 →
Application:
09/687,880 →
Process for Cleaning Inks from Various Substrates Including Printing Plates
Patent:
6,261,381 →
Application:
09/710,976 →
Process for Enhancing the Adhesion of Organic Coatings to Metal Surfaces
Patent:
6,379,750 →
Application:
09/718,910 →
Method for the Manufacture of Printed Circuit Boards with Plated Resistors
High Temperature Continuous Electrodialysis of Electroless Plating Solutions
Patent:
6,391,177 →
Application:
09/788,766 →
Composition and Method for Inhibiting Corrosion of Aluminum and Aluminum Alloys Using Mercapto Substituted Silanes
Electroplating Composition and Process
Composition and Process for Inhibiting Corrosion of Metallic Substrates
Patent:
6,508,958 →
Application:
09/906,370 →
Non-Chrome Passivation Process for Zinc and Zinc Alloys
Patent:
6,524,403 →
Application:
09/938,234 →
Electroless Nickel Plating Solution and Process for Its Use
Patent:
6,500,482 →
Application:
09/945,011 →
Process for Plating Particulate Matter
Paint Stripping Composition and Process Containing Methyl Benzoate and Formic Acid
Patent:
6,417,149 →
Application:
09/949,191 →
Process and Composition for High Speed Plating of Tin and Tin Alloys
Magnesium Conversion Coating Composition and Method of Using Same
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Non-Cyanide Copper Plating Process for Zinc and Zinc Alloys
Method of Stripping Silver from a Printed Circuit Board
Direct Imaging Process for Forming Resist Pattern on a Surface, and Use Thereof in Fabricating Printing Plates
Method for the Manufacture of Printed Circuit Boards with Integral Plated Resistors
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Composition and Process for Inhibiting Corrosion of Metallic Substrates
Zinc and Zinc Alloy Electroplating Additives and Electroplating Methods
Method of Fabricating Electronic Interconnect Devices Using Direct Imaging of Dielectric Composite Material
Patent:
6,762,073 →
Application:
10/372,747 →
Coating for Silver Plated Circuits
Patent:
6,773,757 →
Application:
10/412,932 →
Method for the Manufacture of Printed Circuit Boards with Plated Resistors
Polytetrafluoroethylene Dispersion for Electroless Nickel Plating Applications
Electrolyte Media for the Deposition of Tin Alloys and Methods for Depositing Tin Alloys
Protective U.V. Curable Cover Layer for Optical Media
Methods of Cleaning Copper Surfaces in the Manufacture of Printed Circuit Boards
Process for Preparing a Non-Conductive Substrate for Electroplating
Method of Forming a Metal Pattern on a Substrate
Selective Catalytic Activation of Non-Conductive Substrates
Integral Plated Resistor and Method for the Manufacture of Printed Circuit Boards Comprising the Same
Controlling the Hardness of Electrodeposited Copper Coatings by Variation of Current Profile
Process for Preparing a Non-Conductive Substrate for Electroplating
Pretreatment of Magnesium Substrates for Electroplating
Microetching Solution
Developer Solution and Process for Use
Patent:
7,094,523 →
Application:
11/290,118 →
Method of Using Ultrasonics to Plate Silver
Microetching Composition and Method of Using the Same
Method for the Manufacture of Printed Circuit Boards with Plated Resistors
Polyimide Substrate and Method of Manufacturing Printed Wiring Board Using the Same
Process for Electrolytically Plating Copper
Copper Electroplating of Printing Cylinders
Patent:
7,153,408 →
Application:
11/403,628 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Method of Recycling Electroless Nickel Waste
Metal Surface Treatment Composition
Acid Copper Electroplating Bath Composition
Microetching Composition and Method of Using the Same
Method of Electrolytically Dissolving Nickel into Electroless Nickel Plating Solutions
Acid-resistance promoting composition
Method for Enhancing the Solderability of a Surface
Patent:
7,631,798 →
Application:
12/244,136 →
Process for Plating Chromium from a Trivalent Chromium Plating Bath
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Organic Polymer Coating for Protection Against Creep Corrosion
Chromium Alloy Coating with Enhanced Resistance to Corrosion in Calcium Chloride Environments
Process for Improving Adhesion of Polymeric Materials to Metal Surfaces
Selective Deposition of Metal on Plastic Substrates
Surface Treatment of Silicon
Light Induced Electroless Plating
Nickel-Chromium Alloy Stripper for Flexible Wiring Boards
Method for Improving Plating on Non-Conductive Substrates
Nano-Oxide Process for Bonding Copper/Copper Alloy and Resin
Method of Producing Polymeric Phenazonium Compounds
Dark Colored Chromium Based Electrodeposits
Electrolytic Dissolution of Chromium from Chromium Electrodes
Adhesion Promoting Composition for Metal Leadframes
Aluminum Treatment Compositions
Light Induced Plating of Metals on Silicon Photovoltaic Cells
Method of Producing Polymeric Phenazonium Compounds
Low Etch Process for Direct Metallization
Application:
13/353,428 →
Publication:
US 2013/0186764
Etching of Plastic Using Acidic Solutions Containing Trivalent Manganese
Color Control of Trivalent Chromium Deposits
Coatings Having Enhanced Corrosion Performance and Method of Using the Same
Application:
13/398,242 →
Publication:
US 2013/0216720
Additive for Use in Wash Step of PET Recycling Process
Application:
13/438,149 →
Publication:
US 2013/0261197
Additives for Producing Copper Electrodeposits Having Low Oxygen Content
Steel Pre-Paint Treatment Composition
Application:
13/568,277 →
Publication:
US 2014/0041764
Dark Colored Chromium Based Electrodeposits
Direct Electroless Palladium Plating on Copper
Application:
13/609,705 →
Publication:
US 2014/0072706
Electrolytic Generation of Manganese (III) Ions in Strong Sulfuric Acid Using an Improved Anode
Light Induced Plating of Metals on Silicon Photovoltaic Cells
Method for Improving Plating on Non-Conductive Substrates
High Speed Copper Plating Process
Application:
13/786,728 →
Publication:
US 2014/0256083
Electrolytic Generation of Manganese (III) Ions in Strong Sulfuric Acid
Regeneration of Etch Solutions Containing Trivalent Manganese in Acid Media
Application:
13/870,232 →
Publication:
US 2014/0318983
Adhesion Promoting Composition for Metal Leadframes
Electroless Nickel Plating Solution and Method
Method of Producing Polymeric Phenazonium Compounds
Passivation of Micro-Discontinuous Chromium Deposited From a Trivalent Electrolyte
Electroplating of Metals on Conductive Oxide Substrates
Aqueous Electroless Nickel Plating Bath and Method of Using the Same
High Phosphorus Electroless Nickel
Treatment for Electroplating Racks to Avoid Rack Metallization
Etching of Plastic Using Acidic Solutions Containing Trivalent Manganese
Solutions of Organic Salts as Pretreatments for Plastic Prior to Etching
Application:
14/831,266 →
Publication:
US 2017/0051410
Electroless Silver Plating Bath and Method of Using the Same
Application:
14/831,403 →
Publication:
US 2017/0051411
Treatment of Etch Baths
Application:
14/870,738 →
Publication:
US 2017/0088971
Dark Colored Chromium Based Electrodeposits
Application:
15/134,469 →
Publication:
US 2017/0306515
Electrolytic Generation of Manganese (III) Ions in Strong Sulfuric Acid
Sealing Anodized Aluminum Using a Low-Temperature Nickel-Free Process
Chromium Alloy Coating with Enhanced Resistance to Corrosion in Calcium Chloride Environments
Application:
15/678,771 →
Publication:
US 2017/0342582
Etching of Plastic Using Acidic Solutions Containing Trivalent Manganese
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest in Patent Collateral at Reel/Frame No. 20004/0668
Jun 26, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: MACDERMID, INCORPORATED
Reel/Frame 030694/0705 →
First Lien Patent Security Agreement
Jul 19, 2013
From: MACDERMID ACUMEN, INC.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 030831/0549 →
Second Lien Patent Security Agreement
Jul 19, 2013
From: MACDERMID ACUMEN, INC.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS SECOND LIEN COLLATERAL AGENT
Reel/Frame 030831/0675 →
Release of Security Interest in Patent Collateral at Reel/Frame No. 30831/0675
Nov 1, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS SECOND LIEN COLLATERAL AGENT
To: MACDERMID ACUMEN, INC.
Reel/Frame 031537/0094 →
Assignment and Assumption of Security Interests at Reel/Frame Nos. 30831/0549, 30833/0660, 30831/0606, 30833/0700, and 30833/0727
Nov 1, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS FIRST LIEN COLLATERAL AGENT
To: BARCLAYS BANK PLC, AS SUCCESSOR COLLATERAL AGENT
Reel/Frame 031536/0778 →
Release of Security Interest
Feb 4, 2019
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: MACDERMID ACUMEN, INC.
Reel/Frame 048232/0405 →
Assignment of Security Interest in Patent Collateral
Nov 17, 2022
From: BARCLAYS BANK PLC
To: CITIBANK, N.A.
Reel/Frame 061956/0643 →