Process for preparing a non-conductive substrate for electroplating
View Patent ↗A process for preparing a non-conductive substrate for electroplating is proposed. The proposed process comprises contacting the substrate, after desmear, with a combined neutralization/sacrificial coating solution followed by treatment with a carbon dispersion solution. The combined neutralization/sacrificial coating solution neutralizes permanganate residues from the desmear step and applies a sacrificial coating to metallic surfaces on the substrate. The sacrificial coating allows for easy and reliable removal of unwanted carbon residues from the metallic surfaces prior to electroplating.
1. A process for plating objects comprised of metallic areas and non-conductive areas, said process comprising the steps of:
a. contacting the objects comprised of metallic areas and non-conductive areas to be plated with, in order:
1) alkaline desmear solution comprising permanganate ions;
2) a neutralizer/sacrificial coating solution comprising (i) acid, (ii) hydrogen peroxide, and (iii) corrosion inhibitor selected from the group consisting of alkyl imidazoles, alkyltriazoles, aromatic imidazoles, aromatic triazoles and combinations of the foregoing compounds, wherein the neutralizer/sacrificial coating solution neutralizes the non-conductive areas to be plated and applies a sacrificial coating to the metallic areas;
3) conditioner solution comprising a material selected from the group consisting of surfactants and water soluble polymers;
4) aqueous dispersion of carbon particles consisting essentially of (i) a surfactant or a water soluble polymer, (ii) carbon particles, and (iii) a liquid dispersing medium;
b. drying the objects comprised of metallic areas and non-conductive areas;
c. contacting the objects comprised of metallic areas and non-conductive areas with a microetchant solution; and thereafter
d. contacting the objects comprised of metallic areas and non-conductive areas with a copper electroplating solution with an electrical potential applied.
2. A process according to claim 1 , wherein the objects comprised of metallic areas and non-conductive areas are printed circuit boards.
3. A process according to claim 1 , wherein the metallic areas comprise copper and wherein the non-conductive areas comprise a resinous or polymeric material.
4. A process according to claim 1 , wherein the neutralizer/sacrificial coating solution further comprises a surfactant.
5. A process according to claim 4 , wherein the conditioner solution has an alkaline pH.
6. A process according to claim 1 , wherein the surfactant or water soluble polymer in the aqueous dispersion of carbon particles is a surfactant.