Patent Assignment
Reel/Frame 020004/0668
Security Agreement
Recorded: 2007-10-24
Received: 2007-10-24
Pages: 55
Assignor
MACDERMID, INCORPORATED
Executed: 2007-04-12
Assignee
CREDIT SUISSE, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
ELEVEN MADISON AVENUE, NEW YORK, NY, 10010, UNITED STATES
Covered Properties
(53)
Second surface metallization
Application:
11/657,833 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Application:
11/503,780 →
Process for increasing the adhesion of a metal surface to a polymer
Application:
11/479,692 →
Copper Electroplating of Printing Cylinders
Application:
11/403,628 →
Process for creating a pattern on a copper surface
Application:
11/398,080 →
Process for Electrolytically Plating Copper
Application:
11/398,048 →
Polyimide Substrate and Method of Manufacturing Printed Wiring Board Using the Same
Application:
11/386,631 →
Precoat composition for organic solderability preservative
Application:
11/386,901 →
Method for the Manufacture of Printed Circuit Boards with Plated Resistors
Application:
11/348,941 →
Microetching Composition and Method of Using the Same
Application:
11/316,010 →
Method of Using Ultrasonics to Plate Silver
Application:
11/300,254 →
Developer Solution and Process for Use
Application:
11/290,118 →
Microetching Solution
Application:
11/209,471 →
Pretreatment of Magnesium Substrates for Electroplating
Application:
11/205,516 →
Selective catalytic activation of non-conductive substrates
Application:
11/049,828 →
Process for Preparing a Non-Conductive Substrate for Electroplating
Application:
10/964,212 →
Melamine-formaldehyde post-dip composition for improving adhesion of metal to polymer
Application:
10/956,912 →
Controlling the Hardness of Electrodeposited Copper Coatings by Variation of Current Profile
Application:
10/943,113 →
Integral Plated Resistor and Method for the Manufacture of Printed Circuit Boards Comprising the Same
Application:
10/925,589 →
Pulse reverse electrolysis of acidic copper electroplating solutions
Application:
10/876,795 →
Selective Catalytic Activation of Non-Conductive Substrates
Application:
10/837,109 →
Method of Forming a Metal Pattern on a Substrate
Application:
10/820,236 →
Process for Preparing a Non-Conductive Substrate for Electroplating
Application:
10/798,522 →
Method for Enhancing the Solderability of a Surface
Application:
10/456,329 →
Zinc and Zinc Alloy Electroplating Additives and Electroplating Methods
Application:
10/333,484 →
Polytetrafluoroethylene Dispersion for Electroless Nickel Plating Applications
Application:
10/431,251 →
Method for the Manufacture of Printed Circuit Boards with Plated Resistors
Application:
10/419,651 →
Coating for Silver Plated Circuits
Application:
10/412,932 →
Method of Fabricating Electronic Interconnect Devices Using Direct Imaging of Dielectric Composite Material
Application:
10/372,747 →
Method for Enhancing the Solderability of a Surface
Application:
10/341,859 →
Composition and Process for Inhibiting Corrosion of Metallic Substrates
Application:
10/328,197 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Application:
10/304,514 →
Method for the Manufacture of Printed Circuit Boards with Integral Plated Resistors
Application:
10/271,817 →
Betting Bystander Method and Apparatus
Application:
10/261,145 →
Direct Imaging Process for Forming Resist Pattern on a Surface, and Use Thereof in Fabricating Printing Plates
Application:
10/190,873 →
Methods for Providing a Jackpot Component in a Casino Game in Which an Initial Set of Cards and Additional Cards Are Dealt
Application:
10/163,195 →
Method of Stripping Silver from a Printed Circuit Board
Application:
10/106,522 →
Non-Cyanide Copper Plating Process for Zinc and Zinc Alloys
Application:
10/096,411 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Application:
10/090,048 →
Magnesium Conversion Coating Composition and Method of Using Same
Application:
10/076,897 →
Methods for Providing a Jackpot Component in a Casino Game in Which an Initial Set of Cards Are Dealt
Application:
09/997,613 →
Process and Composition for High Speed Plating of Tin and Tin Alloys
Application:
09/965,743 →
Paint Stripping Composition and Process Containing Methyl Benzoate and Formic Acid
Application:
09/949,191 →
Process for Plating Particulate Matter
Application:
09/946,404 →
Electroless Nickel Plating Solution and Process for Its Use
Application:
09/945,011 →
Non-Chrome Passivation Process for Zinc and Zinc Alloys
Application:
09/938,234 →
Composition and Process for Inhibiting Corrosion of Metallic Substrates
Application:
09/906,370 →
Maximum Bet Table Game Method and Apparatus
Application:
09/848,640 →
Method for Enhancing the Solderability of a Surface
Application:
09/821,205 →
Electroplating Composition and Process
Application:
09/803,631 →
Composition and Method for Inhibiting Corrosion of Aluminum and Aluminum Alloys Using Mercapto Substituted Silanes
Application:
09/802,087 →
High Temperature Continuous Electrodialysis of Electroless Plating Solutions
Application:
09/788,766 →
Method for the Manufacture of Printed Circuit Boards with Plated Resistors
Application:
09/784,242 →