Process for creating a pattern on a copper surface
A process for printing inks or organic resists using a droplet discharge printing mechanism onto a copper or copper alloy surface with increased resolution is described. The increased resolution is achieved by first preferably microetching the surface and then treating the copper surface with an organic substance which is capable of lowering the surface energy of the copper surface or capable of making the copper surface more hydrophobic prior to printing thereon. The process is useful in the manufacture of electronic circuits.
1 . A process for printing upon a surface comprising copper, said process comprising:
a. contacting the surface with an aqueous solution comprising an organic substance selected from the group consisting of fatty acids, resinous acids and mixtures or the foregoing, wherein the aqueous solution increases hydrophobicity of the surface, and then
b. printing an ink or an organic resist onto the surface using an ink jet printing mechanism.
2 . A process according to claim 1 wherein the organic substance comprises tall oil.
3 . A process according to claim 1 wherein the ink or organic resist comprises a photosensitive organic resist.
4 . A process according to claim 3 wherein the organic resist has a viscosity from 5 to 15 centipoise.
5 . A process according to any one of claims 1 , 2 , 3 , or 4 wherein the surface is contacted with a microetchant before being contacted with the aqueous solution.
6 . A process according to any one of claims 1 , 2 , 3 or 4 wherein the ink jet printing mechanism comprises a print bead mounted on a movable carriage and wherein the print head is selected from the group consisting of piezo print heads, thermal jet print heads, and continuous droplet discharge print heads.
7 . A process according to claim 6 wherein a source of actinic radiation is also mounted on the removable carriage.
8 . A process according to any one of claims 3 or 4 wherein the organic substance comprises tall oil.