Patent Assignment
Reel/Frame 030694/0705
Release of Security Interest in Patent Collateral at Reel/Frame No. 20004/0668
Recorded: 2013-06-26
Pages: 53
Assignor
CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Executed: 2013-06-07
Assignee
MACDERMID, INCORPORATED
245 FREIGHT STREET, WATERBURY, CONNECTICUT, 06702
Covered Properties
(93)
Process for Preparing Photosensitive Resin Composition
Patent:
5,565,302 →
Application:
08/426,369 →
Unsaturated Epoxy Ester with Quaternary Ammonium and Phosphate Groups
Patent:
5,512,607 →
Application:
08/469,308 →
Photosensitive Resin Composition
Patent:
5,681,684 →
Application:
08/531,026 →
Liquid Photoimagable Resist Which Is Resistant to Blocking
Patent:
6,342,332 →
Application:
08/562,316 →
Method for Enhancing the Solderability of a Surface
Patent:
5,733,599 →
Application:
08/621,098 →
Composition and Process for Cleaning Inks Form Various Surfaces Including Printing Plates
Patent:
5,814,163 →
Application:
08/711,052 →
Process for the Manufacture of Printed Circuit Boards
Patent:
6,044,550 →
Application:
08/717,770 →
Process for the Manufacture of Printed Circuit Boards
Patent:
6,023,842 →
Application:
08/718,897 →
Process for the Manufacture of Printed Circuit Boards
Patent:
5,747,098 →
Application:
08/719,000 →
Method of Making a Printed Circuit Board
Patent:
5,758,412 →
Application:
08/730,572 →
Photopolymer Useful in Fabricating Printing Plates Which Are Resistant to Polar Solvent Based Ink
Patent:
5,861,234 →
Application:
08/790,492 →
Photodefinable Dielectric Composition Useful in the Manufacture of Printed Circuits
Patent:
5,763,140 →
Application:
08/798,156 →
Process for Preparing a Non-Conductive Substrate for Electroplating
Patent:
5,759,378 →
Application:
08/805,636 →
A Process for Cleaning Inks from Various Surfaces Including Printing Plates
Patent:
5,792,278 →
Application:
08/823,806 →
Stable, Ionomeric Photoresist Emulsion and Process of Preparation and Use Thereof
Patent:
5,981,147 →
Application:
08/835,873 →
Composition and Method for Selective Plating
Patent:
5,843,517 →
Application:
08/846,635 →
Waterborne Photoresist Emulsions and Methods of Preparation Thereof
Patent:
5,869,220 →
Application:
08/870,899 →
Process for the Manufacture of Printed Circuit Boards
Patent:
5,869,126 →
Application:
08/870,998 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Patent:
5,869,130 →
Application:
08/873,992 →
Method for the Manufacture of Printed Circuit Boards
Patent:
6,120,639 →
Application:
08/972,213 →
Method for Enhancing the Solderability of a Surface
Patent:
5,935,640 →
Application:
08/982,980 →
Process for Plating
Patent:
5,922,414 →
Application:
08/987,682 →
Tin Plating Electrolyte Compositions
Patent:
6,217,738 →
Application:
09/051,784 →
Tin Plating Electrolyte Compositions
Patent:
6,030,516 →
Application:
09/051,833 →
Photosensitive Resin Composition Useful in Fabricating Printing Plates
Patent:
6,214,522 →
Application:
09/143,427 →
Process for Treating Metal Surfaces
Patent:
6,020,029 →
Application:
09/143,898 →
Fluxing Agents for the Reflowing of Electro-Deposited Tinplate
Patent:
6,409,850 →
Application:
09/147,972 →
Process for Plating Upon a Polymeric Surface
Patent:
6,168,836 →
Application:
09/183,137 →
Process for Improving the Adhension of Polymeric Materials to Metal Surfaces
Patent:
6,146,701 →
Application:
09/229,019 →
Method for Enhancing the Solderability of a Surface
Patent:
6,200,451 →
Application:
09/251,641 →
Process for Preparing a Nonconductive Substrate for Electroplating
Patent:
37,765 →
Application:
09/255,491 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,162,503 →
Application:
09/274,641 →
Process for Enhancing the Adhesion of Organic Coatings to Metal Surfaces
Patent:
6,206,981 →
Application:
09/421,204 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,383,272 →
Application:
09/590,046 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,419,784 →
Application:
09/598,857 →
Method for the manufacture of printed circuit boards with plated resistors
Patent:
6,281,090 →
Application:
09/603,978 →
Photosensitive resin composition useful in fabricating printing plates
Patent:
6,197,459 →
Application:
09/620,884 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,554,948 →
Application:
09/643,813 →
Flux Composition and Corresponding Soldering Method
Patent:
6,474,536 →
Application:
09/672,577 →
Method for Enhancing the Solderability of a Surface
Patent:
6,375,822 →
Application:
09/677,904 →
Method for the Manufacture of Printed Circuit Boards
Patent:
6,656,370 →
Application:
09/687,880 →
Method for Enhancing the Solderability of a Surface
Patent:
6,444,109 →
Application:
09/698,370 →
Process for Cleaning Inks from Various Substrates Including Printing Plates
Patent:
6,261,381 →
Application:
09/710,976 →
Process for Enhancing the Adhesion of Organic Coatings to Metal Surfaces
Patent:
6,379,750 →
Application:
09/718,910 →
Method for the Manufacture of Printed Circuit Boards with Plated Resistors
High Temperature Continuous Electrodialysis of Electroless Plating Solutions
Patent:
6,391,177 →
Application:
09/788,766 →
Composition and Method for Inhibiting Corrosion of Aluminum and Aluminum Alloys Using Mercapto Substituted Silanes
Electroplating Composition and Process
Method for Enhancing the Solderability of a Surface
Composition and Process for Inhibiting Corrosion of Metallic Substrates
Patent:
6,508,958 →
Application:
09/906,370 →
Non-Chrome Passivation Process for Zinc and Zinc Alloys
Patent:
6,524,403 →
Application:
09/938,234 →
Electroless Nickel Plating Solution and Process for Its Use
Patent:
6,500,482 →
Application:
09/945,011 →
Process for Plating Particulate Matter
Paint Stripping Composition and Process Containing Methyl Benzoate and Formic Acid
Patent:
6,417,149 →
Application:
09/949,191 →
Process and Composition for High Speed Plating of Tin and Tin Alloys
Magnesium Conversion Coating Composition and Method of Using Same
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Non-Cyanide Copper Plating Process for Zinc and Zinc Alloys
Method of Stripping Silver from a Printed Circuit Board
Direct Imaging Process for Forming Resist Pattern on a Surface, and Use Thereof in Fabricating Printing Plates
Method for the Manufacture of Printed Circuit Boards with Integral Plated Resistors
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Composition and Process for Inhibiting Corrosion of Metallic Substrates
Zinc and Zinc Alloy Electroplating Additives and Electroplating Methods
Method for Enhancing the Solderability of a Surface
Method of Fabricating Electronic Interconnect Devices Using Direct Imaging of Dielectric Composite Material
Patent:
6,762,073 →
Application:
10/372,747 →
Coating for Silver Plated Circuits
Patent:
6,773,757 →
Application:
10/412,932 →
Method for the Manufacture of Printed Circuit Boards with Plated Resistors
Polytetrafluoroethylene Dispersion for Electroless Nickel Plating Applications
Method for Enhancing the Solderability of a Surface
Process for Preparing a Non-Conductive Substrate for Electroplating
Method of Forming a Metal Pattern on a Substrate
Selective Catalytic Activation of Non-Conductive Substrates
Pulse reverse electrolysis of acidic copper electroplating solutions
Application:
10/876,795 →
Publication:
US 2005/0284766
Integral Plated Resistor and Method for the Manufacture of Printed Circuit Boards Comprising the Same
Controlling the Hardness of Electrodeposited Copper Coatings by Variation of Current Profile
Melamine-formaldehyde post-dip composition for improving adhesion of metal to polymer
Application:
10/956,912 →
Publication:
US 2006/0065365
Process for Preparing a Non-Conductive Substrate for Electroplating
Selective catalytic activation of non-conductive substrates
Application:
11/049,828 →
Publication:
US 2005/0241951
Pretreatment of Magnesium Substrates for Electroplating
Microetching Solution
Developer Solution and Process for Use
Patent:
7,094,523 →
Application:
11/290,118 →
Method of Using Ultrasonics to Plate Silver
Microetching Composition and Method of Using the Same
Method for the Manufacture of Printed Circuit Boards with Plated Resistors
Polyimide Substrate and Method of Manufacturing Printed Wiring Board Using the Same
Precoat composition for organic solderability preservative
Application:
11/386,901 →
Publication:
US 2007/0221503
Process for Electrolytically Plating Copper
Process for creating a pattern on a copper surface
Application:
11/398,080 →
Publication:
US 2007/0237899
Copper Electroplating of Printing Cylinders
Patent:
7,153,408 →
Application:
11/403,628 →
Process for increasing the adhesion of a metal surface to a polymer
Application:
11/479,692 →
Publication:
US 2008/0000552
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Second surface metallization
Application:
11/657,833 →
Publication:
US 2008/0175986
Related Assignments
(12)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest in Patent Collateral at Reel/Frame No. 20004/0936
Jun 27, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: MACDERMID ACUMEN, INC.
Reel/Frame 030704/0316 →
First Lien Patent Security Agreement
Jul 19, 2013
From: MACDERMID ACUMEN, INC.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 030831/0549 →
Second Lien Patent Security Agreement
Jul 19, 2013
From: MACDERMID, INCORPORATED
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS SECOND LIEN COLLATERAL AGENT
Reel/Frame 030834/0014 →
First Lien Patent Security Agreement
Jul 19, 2013
From: MACDERMID, INCORPORATED
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 030833/0660 →
Second Lien Patent Security Agreement
Jul 19, 2013
From: MACDERMID ACUMEN, INC.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS SECOND LIEN COLLATERAL AGENT
Reel/Frame 030831/0675 →
Release of Security Interest in Patent Collateral at Reel/Frame No. 30834/0014
Nov 1, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS SECOND LIEN COLLATERAL AGENT
To: MACDERMID, INCORPORATED
Reel/Frame 031551/0319 →
Assignment and Assumption of Security Interests at Reel/Frame Nos. 30831/0549, 30833/0660, 30831/0606, 30833/0700, and 30833/0727
Nov 1, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS FIRST LIEN COLLATERAL AGENT
To: BARCLAYS BANK PLC, AS SUCCESSOR COLLATERAL AGENT
Reel/Frame 031536/0778 →
Release of Security Interest in Patent Collateral at Reel/Frame No. 30831/0675
Nov 1, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS SECOND LIEN COLLATERAL AGENT
To: MACDERMID ACUMEN, INC.
Reel/Frame 031537/0094 →
Release of Security Interest
Feb 4, 2019
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: MACDERMID, INCORPORATED
Reel/Frame 048227/0676 →
Release of Security Interest
Feb 4, 2019
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: MACDERMID ACUMEN, INC.
Reel/Frame 048232/0405 →
Security Interest
Feb 5, 2019
From: MACDERMID ACUMEN, INC.
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 048260/0828 →
Assignment of Security Interest in Patent Collateral
Nov 17, 2022
From: BARCLAYS BANK PLC
To: CITIBANK, N.A.
Reel/Frame 061956/0643 →