Patent Assignment
Reel/Frame 048232/0405
Release of Security Interest
Recorded: 2019-02-04
Pages: 20
Assignor
BARCLAYS BANK PLC, AS COLLATERAL AGENT
Executed: 2019-01-31
Assignee
MACDERMID ACUMEN, INC.
5210 PHILLIP LEE DR SW, ATLANTA, GEORGIA, 30336
Covered Properties
(157)
Method for Forming a Patterned Mask
Patent:
5,290,608 →
Application:
08/097,138 →
Process for Preparing Plastic Surfaces to Be Plated
Patent:
5,332,465 →
Application:
08/117,993 →
Tilting Bucket Assembly for Photopolymer Platemaking
Patent:
5,348,605 →
Application:
08/120,839 →
Composition and Process for Treatment of Metallic Surfaces
Patent:
5,376,189 →
Application:
08/148,551 →
Composition and Process for Treatment of Metallic Surfaces
Patent:
5,362,334 →
Application:
08/173,908 →
Process for Cleaning and Defluxing Parts, Specifically Electronic Circuit Assemblies
Patent:
5,431,739 →
Application:
08/255,249 →
Process for Imaging of Liquid Photopolymer Printing Plates
Patent:
5,776,661 →
Application:
08/295,326 →
Process for the Activation of Nickel - Phosphorous Surfaces
Patent:
5,431,959 →
Application:
08/296,697 →
Method for the Manufacture of Printed Circuit Boards
Patent:
5,474,798 →
Application:
08/296,706 →
Composition and Method for Selective Plating
Patent:
5,468,515 →
Application:
08/324,114 →
Process for Preparing a Non-Conductive Substrate for Electroplating
Patent:
5,536,386 →
Application:
08/386,755 →
Composition and Method for Selective Plating
Patent:
5,518,760 →
Application:
08/409,673 →
Photodefinable Dielectric Composition Useful in the Manufacture of Printed Circuits
Patent:
5,545,510 →
Application:
08/412,286 →
Process for Selectively Depositing a Nickel-Boron Coating Over a Metallurgy Pattern on a Dielectric Substrate
Patent:
5,565,235 →
Application:
08/413,496 →
Process for Preparing Photosensitive Resin Composition
Patent:
5,565,302 →
Application:
08/426,369 →
Unsaturated Epoxy Ester with Quaternary Ammonium and Phosphate Groups
Patent:
5,512,607 →
Application:
08/469,308 →
Proces for Plating Metals Onto Various Substrates in an Adherent Fashion
Patent:
5,547,559 →
Application:
08/499,835 →
Polyalkylene Glycol Bis-Phenyl-a-Sulfopropyl Diether Compound and Their Salts, and Process for Their Use
Patent:
5,525,207 →
Application:
08/509,027 →
Method for the Manufacture of Printed Circuit Boards
Patent:
5,620,612 →
Application:
08/518,025 →
Method for Regenerating Tin or Tin Alloy Electroplating Bath
Patent:
5,510,014 →
Application:
08/522,972 →
Photosensitive Resin Composition
Patent:
5,681,684 →
Application:
08/531,026 →
Photopolymer Plate Having a Peelable Substrate
Patent:
5,753,414 →
Application:
08/537,567 →
Direct Imaging Process for Forming Resist Pattern on a Surface and Use Thereof in Fabricating Printing Plates
Patent:
5,641,608 →
Application:
08/546,790 →
Process for Preparing a Non-Conductive Substrate for Electroplating
Patent:
5,632,927 →
Application:
08/603,606 →
Photodefinable Dielectric Composition Useful in the Manufacture of Printed Circuits
Patent:
5,654,126 →
Application:
08/617,496 →
Tack-Free Photopolymer Printing Plate
Patent:
5,733,948 →
Application:
08/680,159 →
Process for Preparing a Non-Conductive Substrate for Electroplating
Patent:
5,674,372 →
Application:
08/710,977 →
Composition and Process for Cleaning Inks Form Various Surfaces Including Printing Plates
Patent:
5,814,163 →
Application:
08/711,052 →
Soft Relief Photopolymer Printing Plates for Flexographic Printing
Patent:
5,688,633 →
Application:
08/711,476 →
Process for the Manufacture of Printed Circuit Boards
Patent:
6,044,550 →
Application:
08/717,770 →
Process for the Manufacture of Printed Circuit Boards
Patent:
6,023,842 →
Application:
08/718,897 →
Process for the Manufacture of Printed Circuit Boards
Patent:
5,747,098 →
Application:
08/719,000 →
Process for Creating Ciruitry on the Surface of a Photoimageable Dielectric
Patent:
5,648,200 →
Application:
08/726,546 →
Method for the Manufacture of Printed Circuit Boards
Patent:
5,693,364 →
Application:
08/739,949 →
Assembly and Method Fofr Reclaiming Imcompatible Resins from Printing Plates
Patent:
5,699,739 →
Application:
08/741,700 →
Photopolymer Useful in Fabricating Printing Plates Which Are Resistant to Polar Solvent Based Ink
Patent:
5,861,234 →
Application:
08/790,492 →
Photodefinable Dielectric Composition Useful in the Manufacture of Printed Circuits
Patent:
5,763,140 →
Application:
08/798,156 →
Process for Preparing a Non-Conductive Substrate for Electroplating
Patent:
5,759,378 →
Application:
08/805,636 →
Process for the Manufacture of Printed Circuit Boards
Patent:
6,403,146 →
Application:
08/814,901 →
A Process for Cleaning Inks from Various Surfaces Including Printing Plates
Patent:
5,792,278 →
Application:
08/823,806 →
Stable, Ionomeric Photoresist Emulsion and Process of Preparation and Use Thereof
Patent:
5,981,147 →
Application:
08/835,873 →
Composition and Method for Selective Plating
Patent:
5,843,517 →
Application:
08/846,635 →
Waterborne Photoresist Emulsions and Methods of Preparation Thereof
Patent:
5,869,220 →
Application:
08/870,899 →
Process for the Manufacture of Printed Circuit Boards
Patent:
5,869,126 →
Application:
08/870,998 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Patent:
5,869,130 →
Application:
08/873,992 →
Curable, Water-Borne One-Component Coating System Using Thermally Labile Hydrophillic Groups
Patent:
6,045,857 →
Application:
08/878,663 →
Photoresist Developable in Aqueous Base Made from an Acid-Functional Beta-Hydroxy Thiol Resin
Patent:
5,925,719 →
Application:
08/879,089 →
Photocurable Composition Based on Acid Functional Primary Resinous Mercaptans
Patent:
5,919,602 →
Application:
08/879,092 →
Method for the Manufacture of Printed Circuit Boards
Patent:
6,120,639 →
Application:
08/972,213 →
Process for Plating
Patent:
5,922,414 →
Application:
08/987,682 →
Tin Plating Electrolyte Compositions
Patent:
6,217,738 →
Application:
09/051,784 →
Tin Plating Electrolyte Compositions
Patent:
6,030,516 →
Application:
09/051,833 →
Photosensitive Resin Composition Useful in Fabricating Printing Plates
Patent:
6,214,522 →
Application:
09/143,427 →
Process for Treating Metal Surfaces
Patent:
6,020,029 →
Application:
09/143,898 →
Fluxing Agents for the Reflowing of Electro-Deposited Tinplate
Patent:
6,409,850 →
Application:
09/147,972 →
Process for Plating Upon a Polymeric Surface
Patent:
6,168,836 →
Application:
09/183,137 →
Process for Improving the Adhension of Polymeric Materials to Metal Surfaces
Patent:
6,146,701 →
Application:
09/229,019 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,162,503 →
Application:
09/274,641 →
Process for Enhancing the Adhesion of Organic Coatings to Metal Surfaces
Patent:
6,206,981 →
Application:
09/421,204 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,383,272 →
Application:
09/590,046 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,419,784 →
Application:
09/598,857 →
Method for the manufacture of printed circuit boards with plated resistors
Patent:
6,281,090 →
Application:
09/603,978 →
Photosensitive resin composition useful in fabricating printing plates
Patent:
6,197,459 →
Application:
09/620,884 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,554,948 →
Application:
09/643,813 →
Flux Composition and Corresponding Soldering Method
Patent:
6,474,536 →
Application:
09/672,577 →
Method for Enhancing the Solderability of a Surface
Patent:
6,375,822 →
Application:
09/677,904 →
Method for the Manufacture of Printed Circuit Boards
Patent:
6,656,370 →
Application:
09/687,880 →
Process for Cleaning Inks from Various Substrates Including Printing Plates
Patent:
6,261,381 →
Application:
09/710,976 →
Process for Enhancing the Adhesion of Organic Coatings to Metal Surfaces
Patent:
6,379,750 →
Application:
09/718,910 →
Method for the Manufacture of Printed Circuit Boards with Plated Resistors
High Temperature Continuous Electrodialysis of Electroless Plating Solutions
Patent:
6,391,177 →
Application:
09/788,766 →
Composition and Method for Inhibiting Corrosion of Aluminum and Aluminum Alloys Using Mercapto Substituted Silanes
Electroplating Composition and Process
Composition and Process for Inhibiting Corrosion of Metallic Substrates
Patent:
6,508,958 →
Application:
09/906,370 →
Non-Chrome Passivation Process for Zinc and Zinc Alloys
Patent:
6,524,403 →
Application:
09/938,234 →
Electroless Nickel Plating Solution and Process for Its Use
Patent:
6,500,482 →
Application:
09/945,011 →
Process for Plating Particulate Matter
Paint Stripping Composition and Process Containing Methyl Benzoate and Formic Acid
Patent:
6,417,149 →
Application:
09/949,191 →
Process and Composition for High Speed Plating of Tin and Tin Alloys
Magnesium Conversion Coating Composition and Method of Using Same
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Non-Cyanide Copper Plating Process for Zinc and Zinc Alloys
Method of Stripping Silver from a Printed Circuit Board
Direct Imaging Process for Forming Resist Pattern on a Surface, and Use Thereof in Fabricating Printing Plates
Method for the Manufacture of Printed Circuit Boards with Integral Plated Resistors
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Composition and Process for Inhibiting Corrosion of Metallic Substrates
Zinc and Zinc Alloy Electroplating Additives and Electroplating Methods
Method of Fabricating Electronic Interconnect Devices Using Direct Imaging of Dielectric Composite Material
Patent:
6,762,073 →
Application:
10/372,747 →
Coating for Silver Plated Circuits
Patent:
6,773,757 →
Application:
10/412,932 →
Method for the Manufacture of Printed Circuit Boards with Plated Resistors
Polytetrafluoroethylene Dispersion for Electroless Nickel Plating Applications
Electrolyte Media for the Deposition of Tin Alloys and Methods for Depositing Tin Alloys
Protective U.V. Curable Cover Layer for Optical Media
Methods of Cleaning Copper Surfaces in the Manufacture of Printed Circuit Boards
Process for Preparing a Non-Conductive Substrate for Electroplating
Method of Forming a Metal Pattern on a Substrate
Selective Catalytic Activation of Non-Conductive Substrates
Integral Plated Resistor and Method for the Manufacture of Printed Circuit Boards Comprising the Same
Controlling the Hardness of Electrodeposited Copper Coatings by Variation of Current Profile
Process for Preparing a Non-Conductive Substrate for Electroplating
Pretreatment of Magnesium Substrates for Electroplating
Microetching Solution
Developer Solution and Process for Use
Patent:
7,094,523 →
Application:
11/290,118 →
Method of Using Ultrasonics to Plate Silver
Microetching Composition and Method of Using the Same
Method for the Manufacture of Printed Circuit Boards with Plated Resistors
Polyimide Substrate and Method of Manufacturing Printed Wiring Board Using the Same
Process for Electrolytically Plating Copper
Copper Electroplating of Printing Cylinders
Patent:
7,153,408 →
Application:
11/403,628 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Method of Recycling Electroless Nickel Waste
Metal Surface Treatment Composition
Acid Copper Electroplating Bath Composition
Microetching Composition and Method of Using the Same
Method of Electrolytically Dissolving Nickel into Electroless Nickel Plating Solutions
Method for Enhancing the Solderability of a Surface
Patent:
7,631,798 →
Application:
12/244,136 →
Process for Plating Chromium from a Trivalent Chromium Plating Bath
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Organic Polymer Coating for Protection Against Creep Corrosion
Chromium Alloy Coating with Enhanced Resistance to Corrosion in Calcium Chloride Environments
Process for Improving Adhesion of Polymeric Materials to Metal Surfaces
Selective Deposition of Metal on Plastic Substrates
Surface Treatment of Silicon
Light Induced Electroless Plating
Nickel-Chromium Alloy Stripper for Flexible Wiring Boards
Method for Improving Plating on Non-Conductive Substrates
Nano-Oxide Process for Bonding Copper/Copper Alloy and Resin
Method for Treating Metal Surfaces
Application:
12/879,672 →
Publication:
US 2012/0061710
Method of Producing Polymeric Phenazonium Compounds
Dark Colored Chromium Based Electrodeposits
Electrolytic Dissolution of Chromium from Chromium Electrodes
Adhesion Promoting Composition for Metal Leadframes
Aluminum Treatment Compositions
Semi-Bright Nickel Plating Bath and Method of Using Same
Application:
13/043,783 →
Publication:
US 2011/0155582
Light Induced Plating of Metals on Silicon Photovoltaic Cells
Tarnish Inhibiting Composition for Metal Leadframes
Application:
13/213,154 →
Publication:
US 2013/0045391
Electrodeposition of Hard Magnetic Coatings
Application:
13/228,847 →
Publication:
US 2013/0065069
Method for Treating Metal Surfaces
Application:
13/229,210 →
Publication:
US 2012/0061705
Method of Producing Polymeric Phenazonium Compounds
Treatment of Plastic Surfaces After Etching in Nitric Acid Containing Media
Application:
13/248,550 →
Publication:
US 2013/0084395
Method for Treating Metal Surfaces
Application:
13/302,362 →
Publication:
US 2012/0061698
Low Etch Process for Direct Metallization
Application:
13/353,428 →
Publication:
US 2013/0186764
Etching of Plastic Using Acidic Solutions Containing Trivalent Manganese
Color Control of Trivalent Chromium Deposits
Coatings Having Enhanced Corrosion Performance and Method of Using the Same
Application:
13/398,242 →
Publication:
US 2013/0216720
Additive for Use in Wash Step of PET Recycling Process
Application:
13/438,149 →
Publication:
US 2013/0261197
Additives for Producing Copper Electrodeposits Having Low Oxygen Content
Steel Pre-Paint Treatment Composition
Application:
13/568,277 →
Publication:
US 2014/0041764
Dark Colored Chromium Based Electrodeposits
Direct Electroless Palladium Plating on Copper
Application:
13/609,705 →
Publication:
US 2014/0072706
Electrolytic Generation of Manganese (III) Ions in Strong Sulfuric Acid Using an Improved Anode
Light Induced Plating of Metals on Silicon Photovoltaic Cells
Method for Improving Plating on Non-Conductive Substrates
High Speed Copper Plating Process
Application:
13/786,728 →
Publication:
US 2014/0256083
Electrolytic Generation of Manganese (III) Ions in Strong Sulfuric Acid
Regeneration of Etch Solutions Containing Trivalent Manganese in Acid Media
Application:
13/870,232 →
Publication:
US 2014/0318983
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 3, 2011
From: ZOBOLI, ROBERTO; SALSA, SARA; GARZONE, MASSIMO
To: MACDERMID ACUMEN, INC.
Reel/Frame 025892/0988 →
Release of Security Interest in Patent Collateral at Reel/Frame No. 20004/0668
Jun 26, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: MACDERMID, INCORPORATED
Reel/Frame 030694/0705 →
Release of Security Interest in Patent Collateral at Reel/Frame No. 20004/0936
Jun 27, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: MACDERMID ACUMEN, INC.
Reel/Frame 030704/0316 →
First Lien Patent Security Agreement
Jul 19, 2013
From: MACDERMID ACUMEN, INC.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 030831/0549 →
Second Lien Patent Security Agreement
Jul 19, 2013
From: MACDERMID ACUMEN, INC.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS SECOND LIEN COLLATERAL AGENT
Reel/Frame 030831/0675 →
Assignment and Assumption of Security Interests at Reel/Frame Nos. 30831/0549, 30833/0660, 30831/0606, 30833/0700, and 30833/0727
Nov 1, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS FIRST LIEN COLLATERAL AGENT
To: BARCLAYS BANK PLC, AS SUCCESSOR COLLATERAL AGENT
Reel/Frame 031536/0778 →
Release of Security Interest in Patent Collateral at Reel/Frame No. 30831/0675
Nov 1, 2013
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS SECOND LIEN COLLATERAL AGENT
To: MACDERMID ACUMEN, INC.
Reel/Frame 031537/0094 →
Security Interest
Feb 5, 2019
From: MACDERMID ACUMEN, INC.
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 048260/0828 →
Assignment of Security Interest in Patent Collateral
Nov 17, 2022
From: BARCLAYS BANK PLC
To: CITIBANK, N.A.
Reel/Frame 061956/0643 →