Additives for producing copper electrodeposits having low oxygen content
View Patent ↗A copper electroplating bath for producing copper electrodeposits is described. The copper electroplating bath comprises (a) a soluble copper salt, (b) an electrolyte comprising one or more acids, and (c) a grain refining additive comprising an alkyl, aryl or alkylaryl diamine. The copper electroplating bath can be used for producing electroformed copper deposits having low oxygen content.
1. A copper electroplating bath for producing copper electrodeposits, the copper electroplating bath comprising:
a) a soluble copper salt;
b) an electrolyte comprising one or more acids; and
c) a grain refining additive comprising an alkyl diamine, wherein the alkyl diamine has the structure:
R 1 -R 2 —N—R 3 —N—R 4 -R 5 , (1)
wherein R 1 , R 2 , R 4 , and R 5 are hydrogen or C 1 -C 4 alkyl and R 3 is C 10 -C 14 alkyl; and
d) a brightener compound comprising a sulfoalkyl sulfone, wherein the sulfoalkyl sulfone compound is present in the electrolyte at a concentration of between about 1 ppm and about 40 ppm.
2. The copper electroplating bath according to claim 1 , wherein the soluble copper salt is selected from the group consisting of copper sulfate, copper fluoroborate, and copper sulfamate.
3. The copper electroplating bath according to claim 2 , wherein the soluble copper salt comprises copper sulfate.
4. The copper electroplating bath according to claim 1 , wherein the one or more acids are selected from the group consisting of sulfuric acid, fluoroboric acid, phosphoric acid, nitric acid, sulfamic acid and combinations of one or more of the foregoing.
5. The copper electroplating bath according to claim 4 , wherein the one or more acids comprise sulfuric acid.
6. The copper electroplating bath according to claim 1 , wherein the diamine comprises 4,4-diamino-2,2-dimethylbicyclohexylmethane.
7. The copper electroplating bath according to claim 1 , wherein the concentration of the diamine in the electroplating bath is between about 10 ppm and about 10 g/L.
8. The copper electroplating bath according to claim 7 , wherein the concentration of the diamine in the electroplating bath is between about 100 ppm and about 1000 ppm.
9. The copper electroplating bath according to claim 1 , wherein the brightener is selected from the group consisting of n,n-dimethyl-dithiocarbamic acid-(3-sulfopropyl)ester, 3-mercapto-propylsulfonic acid-(3-sulfopropyl)ester, 3-mercapto-propylsulfonic acid (sodium salt), carbonic acid-dithio-o-ethylester-s-ester with 3-mercapto-1-propane sulfonic acid (potassium salt), bissulfopropyl disulfide; 3-(benzthiazolyl-s-thio)propyl sulfonic acid (sodium salt), pyridinium propyl sulfobetaine, 1-sodium-3-mercaptopropane-1-sulfonate, the peroxide oxidation product of a dialkyl amino-thiox-methyl-thioalkanesulfonic acid, and combinations of one or more of the foregoing.
10. The copper electroplating bath according to claim 1 , comprising a leveling agent.
11. The copper electroplating bath according to claim 1 , wherein the diamine has the structure:
R 1 -R 2 —N—R 3 —N—R 4 -R 5 (1)
wherein R 1 , R 2 , R 4 , and R 5 are hydrogen.
12. A method of producing a copper electrofonn having a reduced oxygen content, the method comprising the steps of:
a) electrodepositing copper from an acidic copper electroplating bath onto a mandrel, wherein the acidic copper electroplating bath comprises:
i) a soluble copper salt;
ii) an electrolyte comprising one or more acids; and
iii) a grain refining additive comprising an alkyl diamine, wherein the alkyl diamine has the structure:
R 1 -R 2 —N—R 3 —N—R 4 -R 5 , (1)
wherein R 1 , R 2 , R 4 , and R 5 are hydrogen or C 1 -C 4 alkyl and R 3 is C 10 -C 14 alkyl; and
iv) a brightener compound comprising a sulfoalkyl sulfone, wherein the sulfoalkyl sulfone compound is present in the electrolyte at a concentration of between about 1 ppm and about 40 ppm; and
separating the electrodeposited copper from the mandrel.
13. The method according to claim 12 , wherein the soluble copper salt is selected from the group consisting of copper sulfate, copper fluoroborate and copper sulfamate.
14. The method according to claim 13 , wherein the soluble copper salt comprises copper sulfate.
15. The method according to claim 12 , wherein the one or more acids are selected from the group consisting of sulfuric acid, fluoroboric acid, phosphoric acid, nitric acid, sulfamic acid and combinations of one or more of the foregoing.
16. The method according to 15 , wherein the one or more acids comprise sulfuric acid.
17. The method according to claim 12 , wherein the diamine comprises 4,4-diamino-2,2-dimethylbicyclohexylmethane.
18. The method according to claim 12 , wherein the concentration of the diamine in the electroplating bath is between about 10 ppm and about 10 g/L.
19. The method according to claim 12 , wherein the brightener is selected from the group consisting of n,n-dimethyl-dithiocarbamic acid-(3-sulfopropyl)ester, 3-mercapto-propylsulfonic acid-(3-sulfopropyl)ester, 3-mercapto-propylsulfonic acid (sodium salt), carbonic acid-dithio-o-ethylester-s-ester with 3-mercapto-l-propane sulfonic acid (potassium salt), bissulfopropyl disulfide; 3-(benzthiazolyl-s-thio)propyl sulfonic acid (sodium salt), pyridinium propyl sulfobetaine, 1-sodium-3-mercaptopropane-1-sulfonate, the peroxide oxidation product of a dialkyl amino-thiox-methyl-thioalkanesulfonic acid, and combinations of one or more of the foregoing.
20. The method according to claim 12 , wherein the oxygen content of the deposit is less than about 80 ppm.
21. The method according to claim 20 , wherein the oxygen content of the deposit is less than about 50 ppm.
22. The method according to claim 21 , wherein the oxygen content of the deposit is less than about 10 ppm.
23. The method according to claim 12 , wherein electrodepositing copper is conducted at a current density of between about 10 and about 500 ASF.
24. The method according to claim 12 , wherein the copper electroplating bath is maintained at a temperature of between about room temperature and 150° F.
25. The method according to claim 12 , wherein the copper electroplating bath is agitated during use.
26. The method according to claim 12 , wherein the mandrel is a symmetrical mandrel that rotates in the acidic copper electroplating bath.
27. The method according to claim 26 wherein the mandrel is completely submersed in the acidic copper electroplating bath.
28. The method according to claim 12 , wherein the diamine has the structure:
R 1 -R 2 —N—R 3 —N—R 4 -R 5 , (1)
wherein R 1 , R 2 , R 4 , and R 5 are hydrogen.
29. The method according to claim 12 , wherein oxygen is excluded from the copper electroplating bath by at least one of de-aerating the copper electroplating bath and maintaining an inert gas atmosphere above the copper electroplating bath.