Patent Assignment
Reel/Frame 030704/0316
Release of Security Interest in Patent Collateral at Reel/Frame No. 20004/0936
Recorded: 2013-06-27
Pages: 53
Assignor
CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Executed: 2013-06-07
Assignee
MACDERMID ACUMEN, INC.
245 FREIGHT STREET, WATERBURY, CONNECTICUT, 06702
Covered Properties
(99)
Additive Method for Manufacturing Printed Circuit Boards Using Aqueous Alkaline Developable and Strippable Photoresists
Patent:
4,782,007 →
Application:
07/043,325 →
Process for Preparing the Through Hole Walls of a Printed Wiring Board for Electroplating
Patent:
4,718,993 →
Application:
07/055,562 →
Process for Fabricating Multilayer Circuit Boards
Patent:
4,775,444 →
Application:
07/089,741 →
Mechanically Plated Coatings Containing Lubricant Particles
Patent:
4,868,066 →
Application:
07/109,955 →
Shields for Electromagnetic Radiation
Patent:
4,831,210 →
Application:
07/127,783 →
Copper Etchant Compositions
Patent:
4,784,785 →
Application:
07/139,589 →
Photopolymerizable Composition
Patent:
4,855,212 →
Application:
07/148,324 →
Conversion of Manganese Dioxide to Permanganate
Patent:
4,853,095 →
Application:
07/165,752 →
Process and Machine for Electrostatic Coating
Patent:
4,888,200 →
Application:
07/184,463 →
Aqueous Electroplating Bath and Method for Electroplating Tin and/or Lead and a Defoaming Agent Therefor
Patent:
4,849,059 →
Application:
07/243,692 →
Method for Manufacture of Printed Circuit Boards
Patent:
4,931,148 →
Application:
07/250,991 →
Process for the Electrostatic Lacquering of Printed Circuit Boards
Patent:
4,900,580 →
Application:
07/260,147 →
Solder Mask Resins Having Improved Stability Containing a Multi- Functional Epoxide and a Partial Ester of Styrene-Maleic Anhydride Copolymer
Patent:
5,114,830 →
Application:
07/264,223 →
Mechanical Plating with Oxidation-Prone Metals
Patent:
4,950,504 →
Application:
07/302,108 →
Conversion of Manganate to Permanganate
Patent:
4,911,802 →
Application:
07/329,014 →
Process for Metallizing Non-Conductive Substrates
Patent:
4,976,990 →
Application:
07/331,039 →
G-Tab Having Particular Through Hole
Patent:
5,065,228 →
Application:
07/333,072 →
Composition Containing Alkane Sulfonic Acid and Ferric Nitrate for Nitrate for Stripping Tin or Tin-Lead Alloy from Copper Surfaces, and Method for Stripping Tin or Tin-Lead Alloy
Patent:
4,957,653 →
Application:
07/334,918 →
Process for Preparing the Through Hole Walls of a Printed Wiring Board for Electroplating
Patent:
4,874,477 →
Application:
07/341,614 →
Process for Preparing the Through Hole Walls of a Printed Wiring Board for Electroplating
Patent:
4,897,164 →
Application:
07/342,492 →
Electrolytic Method for the Dissolution of Copper Particles Formed During Electroless Copper Deposition
Patent:
4,938,853 →
Application:
07/350,148 →
Electrolytic Method for Regenerating Tin or Tin-Lead Alloy Stripping Compositions
Patent:
4,944,851 →
Application:
07/361,548 →
Inhibited Composition and Method for Stripping Tin, Lead or Tin-Lead Alloy from from Copper Surfaces
Patent:
4,921,571 →
Application:
07/386,887 →
Process for Casting Tire Tread Impressions Using a Photopolymerizable Composition as the Casting Material
Patent:
4,970,033 →
Application:
07/390,133 →
Apparatus for the Electrostatic Lacquering of Printing Circuit Boards
Patent:
4,947,787 →
Application:
07/392,817 →
Process for Preparation Printed Circuit Through-Holes for Metallization
Patent:
5,032,427 →
Application:
07/431,680 →
Double Truck Printing Registration System for a Rotary Printing Press
Patent:
5,005,477 →
Application:
07/466,014 →
Composition and Method for Improving Adhesion of Coatings to Copper Surfaces
Patent:
5,037,482 →
Application:
07/480,911 →
Electroless Copper Plating Process and Apparatus
Patent:
5,077,099 →
Application:
07/493,296 →
Method for Improving Insulation Resistance of Printed Circuits
Patent:
4,978,422 →
Application:
07/496,337 →
Process for Preparing Nonconductive Substrates
Patent:
5,015,339 →
Application:
07/499,229 →
Method for Producing Chromate Conversion Coatings
Patent:
5,080,733 →
Application:
07/506,699 →
Process for Preparing a Nonconductive Substrate for Electroplating
Patent:
4,964,959 →
Application:
07/507,811 →
Composition for Preparing Printed Circuit Through-Holes for Metallization
Patent:
5,132,038 →
Application:
07/512,067 →
Process for Preparing Nonconductive Substrates
Patent:
5,143,592 →
Application:
07/531,602 →
Aqueous Acidic Tin-Lead Immersion Plating Bath Containing Weak Acid Weak Base
Patent:
5,334,240 →
Application:
07/532,372 →
Pretreatment Compositon and Process for Tin-Lead Immersion Plating
Patent:
5,104,688 →
Application:
07/532,387 →
Process for Preparing Nonconductive Substrates
Patent:
4,994,153 →
Application:
07/545,224 →
Composition and Method for Stripping Tin or Tin-Lead Alloy from Copper Surfaces
Patent:
5,017,267 →
Application:
07/554,126 →
A Liquid Despersion for Enhancing the Electroplating of a Non-Conduc- Tive Surface
Patent:
5,106,537 →
Application:
07/556,053 →
Method for Fabricating Printed Circuits
Patent:
5,235,139 →
Application:
07/581,030 →
Process for Direct Electrolytic Regeneration of Chloride-Based Ammoneacal Copper Etchant Bath
Patent:
5,248,398 →
Application:
07/614,929 →
Process for Preparing Nonconductive Substrates
Patent:
5,110,355 →
Application:
07/663,344 →
Electroless Plating of Nickel Onto Surfaces Such as Copper or Fused Tungston
Patent:
5,147,692 →
Application:
07/689,666 →
Electrostatic Spray Apparatus
Patent:
5,238,709 →
Application:
07/691,659 →
Method for Improving Adhesion to Polymide Surfaces
Patent:
5,213,840 →
Application:
07/713,638 →
Process for Preparing a Nonconductive Substrate for Electroplating
Patent:
5,139,642 →
Application:
07/747,066 →
Liquid Solder Mask Composition
Patent:
5,217,847 →
Application:
07/749,488 →
Process for Fabricating Multilayer Printed Circuits
Patent:
5,289,630 →
Application:
07/783,974 →
Electroplating Composition and Process
Patent:
5,194,140 →
Application:
07/800,144 →
Urethane Polymers for Printing Plate Compositions
Patent:
5,341,799 →
Application:
07/814,986 →
Composition and Method for Improving the Surface Insulation Resistance of a Printed Circuit
Patent:
5,207,867 →
Application:
07/852,791 →
Autodeposition Emulsion and Methods of Using Thereof to Selectively Protect Metallic Surfaces
Patent:
5,232,815 →
Application:
07/871,365 →
Process for Fabricating Multilayer Printed Circuits
Patent:
5,261,154 →
Application:
07/871,852 →
Radiation-Curable Composition Useful for Preparation of Solder Masks
Patent:
5,296,334 →
Application:
07/938,029 →
Process for Printing Using a Photopolymeric Mold Made from Photopolymerizable Composition with Improved Release Properties
Patent:
5,381,735 →
Application:
07/965,197 →
Method for Forming a Patterned Mask
Patent:
5,290,608 →
Application:
08/097,138 →
Process for Selectively Depositing a Nickel-Boron Coating Over a Metallurgy Pattern on a Dielectric Substrate and Products Produced Thereby
Patent:
5,403,650 →
Application:
08/109,010 →
Process for Preparing Plastic Surfaces to Be Plated
Patent:
5,332,465 →
Application:
08/117,993 →
Tilting Bucket Assembly for Photopolymer Platemaking
Patent:
5,348,605 →
Application:
08/120,839 →
Composition and Process for Treatment of Metallic Surfaces
Patent:
5,376,189 →
Application:
08/148,551 →
Composition and Process for Treatment of Metallic Surfaces
Patent:
5,362,334 →
Application:
08/173,908 →
Process for Cleaning and Defluxing Parts, Specifically Electronic Circuit Assemblies
Patent:
5,431,739 →
Application:
08/255,249 →
Photopolymerizable Composition for Use in an Alkaline-Etch Resistant Dry Film Photoresist
Patent:
5,419,998 →
Application:
08/279,986 →
Process for Imaging of Liquid Photopolymer Printing Plates
Patent:
5,776,661 →
Application:
08/295,326 →
Process for the Activation of Nickel - Phosphorous Surfaces
Patent:
5,431,959 →
Application:
08/296,697 →
Method for the Manufacture of Printed Circuit Boards
Patent:
5,474,798 →
Application:
08/296,706 →
Carboxyl-Containing Plasticizers in Dry-Film Photopolymerizable Compositions
Patent:
5,415,972 →
Application:
08/304,612 →
Composition and Method for Selective Plating
Patent:
5,468,515 →
Application:
08/324,114 →
Autodeposition Emulsion and Methods of Using Thereof to Selectively Protect Metallic Surfaces
Patent:
5,508,141 →
Application:
08/348,674 →
Process for Preparing a Non-Conductive Substrate for Electroplating
Patent:
5,536,386 →
Application:
08/386,755 →
Composition and Method for Selective Plating
Patent:
5,518,760 →
Application:
08/409,673 →
Photodefinable Dielectric Composition Useful in the Manufacture of Printed Circuits
Patent:
5,545,510 →
Application:
08/412,286 →
Process for Selectively Depositing a Nickel-Boron Coating Over a Metallurgy Pattern on a Dielectric Substrate
Patent:
5,565,235 →
Application:
08/413,496 →
Proces for Plating Metals Onto Various Substrates in an Adherent Fashion
Patent:
5,547,559 →
Application:
08/499,835 →
Polyalkylene Glycol Bis-Phenyl-a-Sulfopropyl Diether Compound and Their Salts, and Process for Their Use
Patent:
5,525,207 →
Application:
08/509,027 →
Method for the Manufacture of Printed Circuit Boards
Patent:
5,620,612 →
Application:
08/518,025 →
Method for Regenerating Tin or Tin Alloy Electroplating Bath
Patent:
5,510,014 →
Application:
08/522,972 →
Photopolymer Plate Having a Peelable Substrate
Patent:
5,753,414 →
Application:
08/537,567 →
Direct Imaging Process for Forming Resist Pattern on a Surface and Use Thereof in Fabricating Printing Plates
Patent:
5,641,608 →
Application:
08/546,790 →
Process for Preparing a Non-Conductive Substrate for Electroplating
Patent:
5,632,927 →
Application:
08/603,606 →
Photodefinable Dielectric Composition Useful in the Manufacture of Printed Circuits
Patent:
5,654,126 →
Application:
08/617,496 →
Increasing Adhesion of Dry Film Photopolymerizable Compositions
Patent:
5,601,965 →
Application:
08/650,213 →
Tack-Free Photopolymer Printing Plate
Patent:
5,733,948 →
Application:
08/680,159 →
Process for Preparing a Non-Conductive Substrate for Electroplating
Patent:
5,674,372 →
Application:
08/710,977 →
Soft Relief Photopolymer Printing Plates for Flexographic Printing
Patent:
5,688,633 →
Application:
08/711,476 →
Process for Creating Ciruitry on the Surface of a Photoimageable Dielectric
Patent:
5,648,200 →
Application:
08/726,546 →
Method for the Manufacture of Printed Circuit Boards
Patent:
5,693,364 →
Application:
08/739,949 →
Assembly and Method Fofr Reclaiming Imcompatible Resins from Printing Plates
Patent:
5,699,739 →
Application:
08/741,700 →
Photodefinable Dielectric Composition Useful in the Manufacture of Printed Circuits
Patent:
5,763,140 →
Application:
08/798,156 →
Process for the Manufacture of Printed Circuit Boards
Patent:
6,403,146 →
Application:
08/814,901 →
Process for the Manufacture of Printed Circuit Boards
Patent:
5,869,126 →
Application:
08/870,998 →
Curable, Water-Borne One-Component Coating System Using Thermally Labile Hydrophillic Groups
Patent:
6,045,857 →
Application:
08/878,663 →
Photoresist Developable in Aqueous Base Made from an Acid-Functional Beta-Hydroxy Thiol Resin
Patent:
5,925,719 →
Application:
08/879,089 →
Photocurable Composition Based on Acid Functional Primary Resinous Mercaptans
Patent:
5,919,602 →
Application:
08/879,092 →
Direct Imaging Process for Forming Resist Pattern on a Surface, and Use Thereof in Fabricating Printing Plates
Electrolyte Media for the Deposition of Tin Alloys and Methods for Depositing Tin Alloys
Protective U.V. Curable Cover Layer for Optical Media
Methods of Cleaning Copper Surfaces in the Manufacture of Printed Circuit Boards