Method for enhancing the solderability of a surface
View Patent ↗A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with a silver plate prior to soldering, which immersion silver plate is treated with an additive comprising a mercapto substituted or thio substituted silane compound. Preferred post treatments comprise 3-mercapto propyl trimethoxysilane and/or 3-oxtanoylthio-1-propyltriethoxy silane.
1. A process for improving the solderability of a metal surface, said process comprising:
a) contacting the metal surface with a silver plating solution thereby producing a silver plate upon the metal surface; and thereafter
b) treating the silver plated metal surface with a solution comprising a mercapto substituted silane or thio substituted silane.
2. A process according to claim 1 wherein the silver plating solution comprises a material selected from the group consisting of imidazoles, benzimidazoles, imidazole derivatives and benzimidazole derivatives.
3. A process according to claim 1 wherein the silver plating solution also comprises an oxidant.
4. A process according to claim 1 wherein the metal surface comprises copper.
5. A process according to claim 1 wherein the additive is selected from the group consisting of 3-mercapto propyl trimethoxysilane and 3-octanoylthio-1-propyltriethoxy silane.
6. A process according to claim 4 wherein the silver plating solution comprises a material selected from the group consisting of imidazoles, benzimidazoles, imidazole derivatives, and benzimidazole derivatives.
7. A process according to claim 6 wherein the silver plating solution also comprises an oxidant.
8. A process according to claim 7 wherein the additive is selected from the group consisting of 3-mercapto propyl trimethoxysilane and 3-octanoylthio-1-propyltriethoxy silane.
9. A process according to claim 5 wherein the solution comprises a glycol monoether.