Patent Assignment
Reel/Frame 026145/0964
Assignment of Assignor's Interest
Recorded: 2011-04-18
Received: 2011-04-18
Pages: 18
Assignor
MACDERMID, INCORPORATED
Executed: 2011-04-11
Assignee
MACDERMID ACUMEN, INC.
245 FREIGHT STREET, WATERBURY, CT, 06702, UNITED STATES
Covered Properties
(69)
Semi-Bright Nickel Plating Bath and Method of Using Same
Application:
13/043,783 →
Adhesion Promoting Composition for Metal Leadframes
Application:
13/018,668 →
Electrolytic Dissolution of Chromium from Chromium Electrodes
Application:
12/947,059 →
Method of Producing Polymeric Phenazonium Compounds
Application:
12/890,013 →
Method for Treating Metal Surfaces
Application:
12/879,672 →
Nano-Oxide Process for Bonding Copper/Copper Alloy and Resin
Application:
12/697,425 →
Semi-Bright Nickel Plating Bath and Method of Using Same
Application:
12/620,746 →
Nickel-Chromium Alloy Stripper for Flexible Wiring Boards
Application:
12/573,298 →
Light Induced Electroless Plating
Application:
12/549,547 →
Surface Treatment of Silicon
Application:
12/509,619 →
Selective Deposition of Metal on Plastic Substrates
Application:
12/488,158 →
Pulse Reverse Electrolysis of Acidic Copper Electroplating Solutions
Application:
12/469,760 →
Process for Improving Adhesion of Polymeric Materials to Metal Surfaces
Application:
12/436,260 →
Organic Polymer Coating for Protection Against Creep Corrosion
Application:
12/383,650 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Application:
12/350,380 →
Process for Plating Chromium from a Trivalent Chromium Plating Bath
Application:
12/261,352 →
Novel Cyanide-Free Electroplating Process for Zinc and Zinc Alloy Die-Cast Components
Application:
12/244,156 →
Method for Enhancing the Solderability of a Surface
Application:
12/244,136 →
Direct Metallization Process
Application:
12/186,727 →
Method of Applying Catalytic Solution for Use in Electroless Deposition
Application:
12/052,859 →
Process for Preventing Plating on a Portion of a Molded Plastic Part
Application:
12/050,709 →
Method of Creating an Image in a Photoresist Laminate
Application:
12/020,673 →
Composition and method for controlling galvanic corrosion in printed circuit boards
Application:
11/983,982 →
Microetching Composition and Method of Using the Same
Application:
11/893,068 →
Acid Copper Electroplating Bath Composition
Application:
11/821,206 →
Selective catalytic activation of non-conductive substrates
Application:
11/807,795 →
Metal Surface Treatment Composition
Application:
11/796,660 →
Second surface metallization
Application:
11/657,833 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Application:
11/503,780 →
Copper Electroplating of Printing Cylinders
Application:
11/403,628 →
Process for Electrolytically Plating Copper
Application:
11/398,048 →
Polyimide Substrate and Method of Manufacturing Printed Wiring Board Using the Same
Application:
11/386,631 →
Method for the Manufacture of Printed Circuit Boards with Plated Resistors
Application:
11/348,941 →
Microetching Composition and Method of Using the Same
Application:
11/316,010 →
Method of Using Ultrasonics to Plate Silver
Application:
11/300,254 →
Developer Solution and Process for Use
Application:
11/290,118 →
Microetching Solution
Application:
11/209,471 →
Pretreatment of Magnesium Substrates for Electroplating
Application:
11/205,516 →
Process for Preparing a Non-Conductive Substrate for Electroplating
Application:
10/964,212 →
Controlling the Hardness of Electrodeposited Copper Coatings by Variation of Current Profile
Application:
10/943,113 →
Integral Plated Resistor and Method for the Manufacture of Printed Circuit Boards Comprising the Same
Application:
10/925,589 →
Selective Catalytic Activation of Non-Conductive Substrates
Application:
10/837,109 →
Method of Forming a Metal Pattern on a Substrate
Application:
10/820,236 →
Process for Preparing a Non-Conductive Substrate for Electroplating
Application:
10/798,522 →
Method for Enhancing the Solderability of a Surface
Application:
10/456,329 →
Zinc and Zinc Alloy Electroplating Additives and Electroplating Methods
Application:
10/333,484 →
Polytetrafluoroethylene Dispersion for Electroless Nickel Plating Applications
Application:
10/431,251 →
Method for the Manufacture of Printed Circuit Boards with Plated Resistors
Application:
10/419,651 →
Coating for Silver Plated Circuits
Application:
10/412,932 →
Method of Fabricating Electronic Interconnect Devices Using Direct Imaging of Dielectric Composite Material
Application:
10/372,747 →
Method for Enhancing the Solderability of a Surface
Application:
10/341,859 →
Composition and Process for Inhibiting Corrosion of Metallic Substrates
Application:
10/328,197 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Application:
10/304,514 →
Method for the Manufacture of Printed Circuit Boards with Integral Plated Resistors
Application:
10/271,817 →
Method of Stripping Silver from a Printed Circuit Board
Application:
10/106,522 →
Non-Cyanide Copper Plating Process for Zinc and Zinc Alloys
Application:
10/096,411 →
Process for Improving the Adhesion of Polymeric Materials to Metal Surfaces
Application:
10/090,048 →
Magnesium Conversion Coating Composition and Method of Using Same
Application:
10/076,897 →
Process and Composition for High Speed Plating of Tin and Tin Alloys
Application:
09/965,743 →
Paint Stripping Composition and Process Containing Methyl Benzoate and Formic Acid
Application:
09/949,191 →
Process for Plating Particulate Matter
Application:
09/946,404 →
Electroless Nickel Plating Solution and Process for Its Use
Application:
09/945,011 →
Non-Chrome Passivation Process for Zinc and Zinc Alloys
Application:
09/938,234 →
Composition and Process for Inhibiting Corrosion of Metallic Substrates
Application:
09/906,370 →
Method for Enhancing the Solderability of a Surface
Application:
09/821,205 →
Electroplating Composition and Process
Application:
09/803,631 →
Composition and Method for Inhibiting Corrosion of Aluminum and Aluminum Alloys Using Mercapto Substituted Silanes
Application:
09/802,087 →
High Temperature Continuous Electrodialysis of Electroless Plating Solutions
Application:
09/788,766 →
Method for the Manufacture of Printed Circuit Boards with Plated Resistors
Application:
09/784,242 →