Aqueous electroless nickel plating bath and method of using the same

1. A method of producing an electroless nickel phosphorus deposit on a substrate, wherein the electroless nickel phosphorus deposit has a phosphorus content of about 12%, the method comprising the steps of:

contacting the substrate with an electroless nickel phosphorus plating solution comprising:

a) a source of nickel ions;

b) a reducing agent comprising a hypophosphite;

c) a chelation system comprising:

i) one or more dicarboxylic acids; and

ii) one or more alpha hydroxy carboxylic acids; and

d) a brightener comprising bismuth;

for a period of time to provide a nickel phosphorus deposit on the substrate having a phosphorus content of about 12%;

wherein the electroless nickel phosphorous plating solution has a lifetime and produces a nickel phosphorous deposit having a phosphorus content that remains at about 12% throughout the lifetime of the electroless nickel phosphorous plating solution

wherein the electroless nickel phosphorous plating solution deposits the nickel phosphorous deposit on the substrate at rate of at least 0.6 mil/hour.

2. The method according to claim 1 , wherein the brightener comprises about 2 to about 4 mg/L bismuth.

3. The method according to claim 1 , wherein the lifetime of the electroless nickel phosphorous plating solution comprises at least 3 metal turnovers.

4. The method according to claim 3 , wherein the lifetime of the electroless nickel phosphorous plating solution comprises at least 5 metal turnovers.

5. The method according to claim 1 , wherein the electroless nickel phosphorous plating solution comprises:

a) about 30 to about 40 g/L of hypophosphite;

b) about 30 to about 40 g/L of lactic acid;

c) about 3 to about 6 g/L of succinic acid; and

d) about 25 to about 35 g/L of malonic acid.

6. The method according to claim 5 , wherein the electroless nickel phosphorous plating solution comprises:

a) about 33 to about 36 g/L of hyphophosphite;

b) about 33 to about 36 g/L of lactic acid;

c) about 4 to about 5 g/L of succinic acid; and

d) about 28 to about 31 g/L of malonic acid.

7. The method according to claim 1 , wherein the electroless nickel phosphorous plating solution has a pH of about 5.2 to about 6.2.

8. The method according to claim 1 , wherein the electroless nickel phosphorous plating solution comprises a stabilizer, wherein the stabilizer comprises one or more iodine compounds selected from the group consisting of potassium iodate, sodium iodate, and ammonium iodate.

9. The method according to claim 8 , wherein the stabilizer does not comprise the metals cadmium, lead, hexavalent chromium or mercury.

10. The method according to claim 1 , wherein the electroless nickel phosphorous plating solution further comprises a sulfur compound.

11. The method according to claim 10 , wherein the sulfur compound is saccharin.

12. The method according to claim 1 , wherein the electroless nickel phosphorous plating solution deposits the nickel phosphorous deposit on the substrate at a rate of at least 0.9 mil/hour.

13. The method according to claim 1 , wherein the electroless nickel phosphorous deposit is capable of passing a standard nitric acid test, wherein the standard nitric acid test comprises immersing the electroless nickel phosphorous deposit on the substrate in a concentrated nitric acid solution for 30 seconds, wherein the electroless nickel phosphorous deposit on the substrate passes the nitric acid test if no discoloration of the electroless nickel phosphorous deposit is observed.

14. The method according to claim 7 , wherein the electroless nickel phosphorous plating solution has a pH of about 5.6 to about 5.7.