Electroless nickel plating solution and method
View Patent ↗An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value.
1. A process of plating a substrate to provide a bright electroless nickel deposit thereon, the method comprising the steps of:
a) preparing a substrate to accept electroless nickel plating thereon; and
b) plating the substrate with an electroless nickel plating solution, the electroless nickel plating solution comprising;
1) a source of nickel ions;
2) a reducing agent;
3) one or more complexing agents;
4) one or more bath stabilizers, said one or more bath stabilizers comprising a source of bismuth ions; and
5) a brightener selected from the group consisting of alkyl or aryl substituted sulfonamides, alkyl or aryl substituted sulfonic acids, alkyl or aryl substituted sulfosuccinates, and alkyl or aryl substituted sulfonates;
wherein the concentration of the brightener in the electroless nickel plating solution is in the range of about 0.1-3.0 mg/l; and
wherein the deposited electroless nickel layer has a measured gloss unit value above about 120.
2. The process according to claim 1 , wherein the brightener is selected from the group consisting of 2-amino ethane sulfonic acid, toluene sulfonamide, 1-octane sulfonic acid, 2-chloro-hydroxy-propane sulfonic acid, saccharin, sodium diamyl sulfosuccinate, sodium 1,4,-bis(1,3-dimethylbutyl) sulfosuccinate, sulfosuccinic acid, and sodium allyl sulfonate.
3. The process according to claim 2 , wherein the brightener is 2-amino ethane sulfonic acid.
4. The process according to claim 1 , wherein the brightener is substantially the only brightener in the electroless nickel plating solution.
5. The process according to claim 1 , wherein the deposited electroless nickel layer has a measured gloss unit value above about 170.
6. The process according to claim 5 , wherein the deposited electroless nickel layer has a measured gloss unit value above about 200.
7. The process according to claim 1 , wherein the substrate is a metal substrate selected from the group consisting of steel, aluminum, copper, zinc and brass.
8. The process according to claim 7 , wherein the substrate is steel.
9. The process according to claim 1 , wherein the substrate is a non-conductive substrate selected from the group consisting of plastics and ceramics.
10. The process according to claim 1 , wherein the one or more complexing agents are selected from the group consisting of carboxylic acids, polyamines or sulfonic acids, or mixtures thereof.
11. The process according to claim 10 , wherein the concentration of the one or more complexing agents is about 15 to about 75 g/L.
12. The process according to claim 11 , wherein the concentration of the one or more complexing agents is about 20 to about 40 g/L.
13. The process according to claim 1 , wherein the step of preparing a substrate to accept electroless nickel plating thereon involves one or more of the following:
1) cleaning the substrate;
2) activating the substrate; or
3) microetching the substrate.
14. The process according to claim 1 , wherein the concentration of the brightener in the electroless nickel plating solution is in the range of about 0.5-2.0 mg/L.
15. The process according to claim 14 , wherein the concentration of the brightener in the electroless nickel plating solution is about 0.8 mg/L.
16. The process according to claim 1 , wherein the electroless nickel plating solution further comprises 2-aminothiazole.
17. A process of plating a substrate to provide a bright electroless nickel deposit thereon, the method comprising the steps of:
a) preparing a substrate to accept electroless nickel plating thereon; and
b) plating the substrate with an electroless nickel plating solution, the electroless nickel plating solution comprising;
1) a source of nickel ions;
2) a reducing agent;
3) one or more complexing agents, the one or more complexing agents in a concentration of about 15 to about 75 g/L;
4) one or more bath stabilizers, the one or more bath stabilizers comprising a source of bismuth ions;
5) a brightener selected from the group consisting of alkyl or aryl substituted sulfonamides, alkyl or aryl substituted sulfonic acids, alkyl or aryl substituted sulfosuccinates, and alkyl or aryl substituted sulfonates, the sulfonated compound in a concentration of about 0.1-3.0 mg/L; and
6) 2-aminothiazole;
wherein the deposited electroless nickel layer has a measured gloss unit value above about 170.