IP Library › Assignment 048226/0702
Patent Assignment
Reel/Frame 048226/0702

Release of Security Interest

Recorded: 2019-02-04 Pages: 5
Assignor
Assignee
MACDERMID ACUMEN, INC.
5210 PHILLIP LEE DR SW, ATLANTA, GEORGIA, 30336
Covered Properties (2)
Adhesion Promoting Composition for Metal Leadframes
Patent: 9,030,008 →
Application: 13/954,328 →
Publication: US 2013/0312635
Electroless Nickel Plating Solution and Method
Application: 13/961,018 →
Publication: US 2015/0044374
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 30, 2013
From: KAPADIA, NILESH
To: MACDERMID ACUMEN, INC.
Reel/Frame 030906/0867 →
Assignment of Assignor's Interest Aug 7, 2013
From: JANIK, ROBERT; MICYUS, NICOLE J.
To: MACDERMID ACUMEN, INC.
Reel/Frame 030959/0583 →
Patent Security Agreement Nov 1, 2013
From: MACDERMID ACUMEN, INC.
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 031551/0305 →
Security Interest Feb 5, 2019
From: MACDERMID ACUMEN, INC.
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 048260/0828 →
Assignment of Security Interest in Patent Collateral Nov 17, 2022
From: BARCLAYS BANK PLC
To: CITIBANK, N.A.
Reel/Frame 061956/0643 →