Sintering materials and attachment methods using same
Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.
1. A method for attachment, comprising:
applying a film of metal particles to a substrate;
placing a die or a wafer on the film to form an assembly;
applying a pressure of less than 40 MPa to the assembly; and
sintering the assembly at a temperature of 160 to 400° C. for 0.25 seconds to 120 minutes;
wherein the metal particles comprise core shell structured nanoparticles comprising a core material selected from the group consisting of molybdenum, tungsten, aluminum, carbon, boron nitride, boron carbide, and aluminum nitride and a shell material selected from the group consisting of silver, gold, palladium, platinum, nickel, and tin,
wherein the core shell structured nanoparticles consist of 10 to 90 weight percent of the core material and 10 to 90 weight percent of the shell material, and
wherein the core shell structured nanoparticles constitute from 80 to 95 weight percent of the metal film.
2. The method of claim 1 , further comprising forming the die by dicing a wafer.
3. The method of claim 2 , wherein the die comprises a flip chip.
4. The method of claim 1 , further comprising applying a film of metal particles on a back side of the die or wafer.
5. The method of claim 4 , wherein a pressure of 2.0 to 10 MPa is applied.
6. The method of claim 1 , wherein a pressure of 0.5 to 20 MPa is applied.
7. The method of claim 6 , wherein a pressure of 2.0 to 10 MPa is applied.
8. The method of claim 1 , wherein the temperature is 200° C.
9. The method of claim 1 , wherein the substrate has a thickness of between 35 micrometers and 75 micrometers.
10. The method of claim 1 , further comprising post-treating the assembly at a temperature of 300° C. for 5 to 60 minutes.
11. The method of claim 1 , wherein the film comprises the metal particles and from 0.5 to 5 wt % of a binder having a softening point of between 50 and 170° C.
12. The method of claim 11 , wherein the binder is a partially hydrogenated rosin ester.
13. The method of claim 1 ,
wherein the metal particles of the film consist essentially of core shell structured nanoparticles comprising a core material selected from the group consisting of tungsten, boron nitride, boron carbide, and aluminum nitride and a shell material selected from the group consisting of silver, gold, palladium, platinum, nickel, and tin.
14. The method of claim 1 , wherein the core shell structured nanoparticles of the metal film consist of nanoparticles comprising a core material selected from the group consisting of molybdenum, tungsten, aluminum, carbon, boron nitride, boron carbide, and aluminum nitride and a shell material selected from the group consisting of silver, gold, palladium, platinum, nickel, and tin.
15. A method for attachment, comprising:
applying a film of metal particles to a substrate;
placing a die or a wafer on the film to form an assembly;
applying a pressure of less than 40 MPa to the assembly; and
sintering the assembly at a temperature of 160 to 400° C. for 0.25 seconds to 120 minutes;
wherein the metal particles of the film consist of core shell structured nanoparticles comprising a core material selected from the group consisting of molybdenum, tungsten, aluminum, carbon, boron nitride, boron carbide, and aluminum nitride and a shell material selected from the group consisting of silver, gold, palladium, platinum, nickel, and tin,
wherein the core shell structured nanoparticles constitute from about 30 to about 95 weight percent of the metal film, and
wherein the core shell structured nanoparticles consist of 10 to 90 weight percent of the core material and 10 to 90 weight percent of the shell material.
16. The method of claim 15 , wherein the metal particles of the film consist of core shell structured nanoparticles comprising 10 to 90 wt % of a Mo core and 10 to 90 wt % of a Ag shell.
17. The method of claim 15 , wherein the core material is molybdenum.
18. The method of claim 15 , wherein the core material is tungsten.
19. The method of claim 15 , wherein the core material is carbon.
20. The method of claim 15 , wherein the core material is boron nitride.
21. The method of claim 15 , wherein the core material is boron carbide.
22. The method of claim 15 , wherein the core material is aluminum nitride.
23. A method for attachment, comprising:
applying a film of metal particles to a substrate;
placing a die or a wafer on the film to form an assembly;
applying a pressure of less than 40 MPa to the assembly; and
sintering the assembly at a temperature of 160 to 400° C. for 0.25 seconds to 120 minutes;
wherein the metal particles comprise core shell structured nanoparticles comprising a core material and a shell material selected from the group consisting of silver, gold, palladium, platinum, nickel, and tin, wherein the core material is aluminum,
wherein the core shell structured nanoparticles constitute from about 30 to about 95 weight percent of the metal film, and
wherein the core shell structured nanoparticles consist of 10 to 90 weight percent of the core material and 10 to 90 weight percent of the shell material.