Engineered polymer-based electronic materials
A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
1. A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein:
the organic medium comprises:
from 30 to 40 wt. % of an organic solvent having a boiling point of at least 280° C.;
from 5 to 10 wt. % of different functionality epoxy resins;
from 15 to 30 wt. % of solid bifunctional epoxy resins;
from 3 to 10 wt. % of an activator comprising a dicarboxylic acid;
from 2 to 8 wt. % of a catalyst comprising substituted aromatic amine;
from 1 to 5 wt. % of a catalyst comprising a phosphine-based salt;
from 1 to 5 wt. % of a liquid anhydride type hardener;
from 0.1 to 4 wt. % of a liquid type stress modifier; and
from 0.1 to 3 wt. % of an adhesion promoter;
the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and
wherein the composition comprises from 0.03 to 4.0 wt. % of the filler based on the total weight of the composition.
2. The composition of claim 1 comprising 0.04 to 1.0 wt. % of the filler based of the total weight of the composition.
3. The composition of claim 1 , comprising from 0.05 to 0.4 wt. % of the filler based of the total weight of the composition.
4. The composition according to claim 1 , wherein the filler comprises one or more of: graphene, graphene oxide, functionalized graphene and a polyhedral oligomeric silsesquioxane.
5. The composition according to claim 4 , wherein the filler comprises:
a polyhedral oligomeric silsesquioxane; and
one or more of graphene, and functionalized graphene.
6. The composition according to claim 4 , wherein the filler comprises functionalized graphene, the functionalized graphene comprising one or more of an amine group, a silane and/or titanate group, an epoxy group, an ester group and a polyhedral oligomeric silsesquioxane.
7. The composition according to claim 1 , wherein the organic medium comprises:
about 39 wt. % of an organic solvent having a boiling point of at least 280° C.;
about 8 wt. % of different functionality epoxy resins;
about 29 wt. % of solid bifunctional epoxy resins with high molecular weight;
about 9 wt. % of an activator comprising a dicarboxylic acid;
about 3 wt. % of a catalyst comprising substituted aromatic amine;
about 4 wt. % of a catalyst comprising a phosphine-based salt;
about 2 wt. % of a liquid anhydride type hardener;
about 4 wt. % of a liquid type stress modifier; and
about 2 wt. % of an adhesion promoter.
8. The composition according claim 1 ,
wherein the composition is flowable at high temperatures using capillary additives.
9. The composition according to claim 1 ,
wherein a collar height of the composition, when cured, may be varied up to 100% by varying dipping height and/or dipping time.
10. The composition according to claim 1 , wherein the composition further comprises color pigments.
11. The composition according to claim 1 , wherein the composition has a viscosity of from 12 to 20 Pas.
12. The composition according to claim 1 , wherein the filler controls the coefficient of thermal expansion (CTE) of the composition.
13. A method of forming a solder joint, the method comprising:
(i) providing a solder paste between two or more work pieces to be joined, wherein the solder paste comprises:
(a) solder particles; and
(b) the composition according to claim 1 ; and
(ii) heating the solder paste to form a solder joint.
14. The method of forming a solder joint according to claim 13 , wherein the solder joint is at least partially encapsulated with a cured polymer composition.
15. The method of claim 13 , wherein the step of providing the solder paste between two or more work pieces to be joined comprises applying the solder paste to at least one of the work pieces, wherein the paste is in the form of a film, and wherein heating the solder paste comprises hot stamping.
16. The method according to claim 13 , wherein the filler controls the coefficient of thermal expansion (CTE) in the composition.
17. An underfill composition, the composition comprising a filler dispersed in an organic medium, wherein:
the organic medium comprises:
from 30 to 40 wt. % of an organic solvent having a boiling point of at least 280° C.;
from 5 to 10 wt. % of different functionality epoxy resins;
from 15 to 30 wt. % of solid bifunctional epoxy resins;
from 3 to 10 wt. % of an activator comprising a dicarboxylic acid;
from 2 to 8 wt. % of a catalyst comprising substituted aromatic amine;
from 1 to 5 wt. % of a catalyst comprising a phosphine-based salt;
from 1 to 5 wt. % of a liquid anhydride type hardener;
from 0.1 to 4 wt. % of a liquid type stress modifier; and
from 0.1 to 3 wt. % of an adhesion promoter;
the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and
wherein the composition comprises from 0.03 to 4.0 wt. % of the filler based on the total weight of the composition.
18. The underfill of claim 17 , wherein the underfill can be applied in one or more steps, wherein the one or more steps comprise dipping and/or dispensing.