Composite and multilayered silver films for joining electrical and mechanical components
Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.
1. A silver film, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles wherein each layer of sinterable particles comprises a mixture of sinterable silver particles and graphite particles, wherein the multilayer structure does not exhibit degradation after 500 thermal shock cycles between −40° C. and 125° C., wherein the silver film is configured for die attachment by application of heat and pressure to sinter the silver film.
2. The silver film of claim 1 , wherein the reinforcing silver foil layer is configured to support the sinterable silver particles layer and the graphite particles.
3. The silver film of claim 1 , wherein the graphite particles comprise spheres, flakes, fibers, flowers, nanowire, and combinations thereof.
4. The silver film of claim 3 , wherein the size of the graphite particles is between 2 nm and 10 μm.
5. The silver film of claim 3 , wherein at least one layer of sinterable particles further comprises at least one of copper, aluminum, glass, and carbon.
6. The silver film of claim 3 , wherein a concentration of the graphite particles is between 0.1 wt % by weight to 50 wt % by weight.
7. The silver film of claim 1 , wherein the reinforcing silver foil layer is a metalized polymer or a ceramic foil comprising silver cladding.
8. The silver film of claim 1 , wherein the reinforcing silver foil layer is composite or a clad structure with different layers of different metals and alloys.
9. The silver film of claim 8 , wherein the reinforcing metal foil layer is solid, perforated or in the form of mesh.
10. A method of laminating a die for attachment using the silver film of claim 1 , the method comprising applying the silver film to a back of a die.
11. A method of attaching a die to a substrate comprising:
applying the silver film of claim 1 to a die; and
placing the die on a substrate with applied heat and pressure to sinter the film and connect the die to the substrate.
12. The silver film of claim 1 wherein the two layers of sinterable particles are in direct contact with the reinforcing silver foil layer.
13. The silver film of claim 1 wherein the silver film consists of the reinforcing silver foil layer and the two layers of sinterable particles.
14. The silver film of claim 13 wherein the reinforcing silver foil layer is sandwiched between and in direct contact with the two layers of sinterable particles.
15. The silver film of claim 1 wherein the silver film consists of the reinforcing silver foil layer, the two layers of sinterable particles, and a support layer.
16. The silver film of claim 15 wherein the reinforcing silver layer is sandwiched between and in direct contact with the two layers of sinterable particles and the support layer is attached to one of the layers of sinterable particles.