Carrier for aligning electronic components with slidably arranged plates

1. A carrier adapted to receive and align multiple electronic components, the carrier comprising:

receptacles each being adapted to receive an assigned one of the multiple electronic components;

a first plate comprising a plurality of first abutting sections, wherein the first abutting sections form one of boundaries of the respective assigned receptacles;

a second plate comprising a plurality of second abutting sections, wherein the second abutting sections form another of the boundaries of the respective assigned receptacles;

wherein the first plate and the second plate are arranged slidably relative to each other, and

wherein the first plate and the second plate are elastically couple to each other by at least one plate connecting the elastic unit.

2. The carrier according to claim 1 , wherein the first plate is an elastic unit plate comprising a plurality of elastic units, and wherein each of the receptacles has assigned at least one of the plurality of the elastic units.

3. The carrier according to claim 2 , wherein a position and a deformation state of each of the elastic units determines one of the boundaries of the respective assigned receptacles.

4. The carrier according to claim 1 , wherein:

the second plate comprises a first plate abutting section adapted for abutment of the first plate; and

the first plate comprises a second plate abutting section adapted for abutment of the second plate;

wherein the first plate abutting section and the second plate abutting section define a clamping size of the receptacles when the first plate abutting section and the second plate abutting section abut on each other; and

wherein the clamping size of the receptacles is adapted for a clamping of the electronic components in the respective receptacles.

5. The carrier according to claim 1 , wherein the plate connecting elastic element and the plurality of elastic units are adapted to provide a total force for a self-acting transition from an enlarged size of the receptacles in which the electronic components are receivable in the receptacles towards a reduced clamping size of the receptacles in which the electronic components are clamped.

6. The carrier according to claim 1 , further comprising:

handling structures formed at the first plate and at the second plate and adapted for engaging the first plate and the second plate to relatively move the slidably arranged first plate and second plate against a force of the plate connecting elastic element towards an enlarged size of the receptacles.

7. The carrier according to claims 1 , further comprising:

a third plate, wherein the first plate is arranged floatingly between the second plate and the third plate;

wherein the second plate and the third plate are fixedly mounted to each other; and

wherein the first plate is an elastic unit plate and is adapted to allow for a mutual relocation of the multiple first abutting sections relative to the second abutting sections.

8. The carrier according to claims 1 , further comprising:

a third plate, wherein the second plate is arranged floatingly between the first plate and the third plate;

wherein the first plate and the third plate are fixedly mounted to each other; and

wherein the first plate is an elastic unit plate and the second plate is adapted to allow for a mutual relocation of the multiple second abutting sections relative to the first abutting sections.

9. The carrier according to claims 1 , wherein the first abutting sections are adapted to exert first forces and the second abutting sections are adapted to exert second forces on the electronic component, and wherein the first forces and the second forces are at least partially opposed to one another.

10. The carrier according to claim 9 , wherein the first abutting sections and the second abutting sections are adapted so that the first forces are exerted parallel to a main plane of each of the receptacles and the second forces are exerted parallel to the main plane of the receptacles, the main plane of the receptacles is parallel to movement of the elastic unit.

11. The carrier according to claim 9 , wherein the receptacles further comprise base support sections which form support surfaces parallel to a main plane of each of the receptacles and which are adapted for supporting a bottom side of the electronic components when being received in the receptacles, the main plane of the receptacles is parallel to movement of the elastic unit.

12. The carrier according to claims 9 , wherein base support sections are adapted to exert support forces perpendicularly to the first forces and perpendicularly to the second forces.

13. The carrier according to claim 9 , wherein the first abutting sections of the first plate are mounted in the carrier to be flexible and are adapted to perform a movement parallel to a main plane of the receptacles.

14. The carrier according to claim 1 , further comprising:

at least one thickness adjusting plate adapted for adjusting a thickness of the carrier.

15. The carrier according to claim 1 , wherein at least one of the elastic units comprise a spring element.

16. A method of operating a carrier to receive and align multiple electronic components comprising the steps of:

receiving an assigned one of the multiple electronic components in each of receptacles of the carrier;

providing a first plate of the carrier comprising a plurality of first abutting sections, wherein the first abutting sections form one of boundaries of the respective assigned receptacles;

providing a second plate of the carrier comprising a plurality of second abutting sections, wherein the second abutting sections form another of the boundaries of the respective assigned receptacles;

sliding the first plate and the second plate relative to each other to clamp the electronic components in the receptacles; and

coupling the first plate and the second plate elastically to each other by at least one plate connecting elastic unit.

17. The method of claim 16 further comprising the steps of

placing the carrier in a post processing machine; and

subjecting the electronic components to a post-processing operation of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier.

18. The method according to claims 16 further comprising the step of:

elastically clamping the electronic components by the clamping mechanism exclusively on side sections of the electronic components.

19. The method according to claim 16 further comprising the step of:

providing the carrier with an identifying feature for definite identification of the carrier.