Stacked semiconductor chips with thermal management
A method of assembling a semiconductor chip device is provided that includes placing an interposer on a first semiconductor chip. The interposer includes a first surface seated on the first semiconductor chip and a second surface adapted to thermally contact a heat spreader. The second surface includes a first aperture. A second semiconductor chip is placed in the first aperture.
1. A method of assembling a semiconductor chip device, comprising:
placing an interposer on a first semiconductor chip, the interposer including a lower surface seated on the first semiconductor chip and an upper surface adapted to thermally contact a heat spreader, the upper surface including a first aperture defining a seating surface facing away from the lower surface; and
placing a second semiconductor chip in the first aperture.
2. The method of claim 1 , comprising electrically coupling the second semiconductor chip to the first semiconductor chip.
3. The method of claim 2 , wherein the interposer comprises a second aperture contiguous with the first aperture and leading to the first semiconductor chip, the method comprising electrically coupling second semiconductor chip to the first semiconductor chip by plural interconnect structures positioned in the second aperture.
4. The method of claim 1 , comprising placing a heat spreader in thermal contact with the interposer and the second semiconductor chip.
5. The apparatus of claim 4 , comprising positioning a thermal interface material between the second semiconductor chip and the heat spreader.
6. An apparatus, comprising:
a first semiconductor chip;
an interposer including a lower surface seated on the first semiconductor chip and an upper surface adapted to thermally contact a heat spreader, the upper surface including a first aperture defining a seating surface facing away from the lower surface; and
a second semiconductor chip positioned in the first aperture.
7. The apparatus of claim 6 , wherein the second semiconductor chip is electrically coupled to the first semiconductor chip.
8. The apparatus of claim 7 , wherein the interposer comprises a second aperture contiguous with the first aperture and leading to the first semiconductor chip, the second semiconductor chip being electrically coupled to the first semiconductor chip by plural interconnect structures positioned in the second aperture.
9. The apparatus of claim 6 , comprising a heat spreader in thermal contact with the interposer and the second semiconductor chip.
10. The apparatus of claim 6 , comprising a thermal interface material positioned between the second semiconductor chip and the heat spreader.
11. The apparatus of claim 6 , wherein the interposer comprises a substantially planar substrate.
12. The method of claim 1 , comprising stacking a third semiconductor chip on the second semiconductor chip.
13. The method of claim 1 , comprising mounting the first semiconductor chip on a circuit board.
14. The apparatus of claim 6 , comprising a third semiconductor chip stacked on the second semiconductor chip.
15. The apparatus of claim 6 , comprising a circuit board, the first semiconductor chip being mounted on the circuit board.
16. A method of assembling a semiconductor chip device, comprising:
placing an interposer on a first semiconductor chip, the interposer including a lower surface seated on the first semiconductor chip and an upper surface adapted to thermally contact a heat spreader, the upper surface including a first aperture, the first aperture defining a thinned portion of the interposer having a seating surface; and
placing a second semiconductor chip in the first aperture on the seating surface.
17. The method of claim 16 , wherein the interposer includes a second aperture extending through the thinned portion.