Mounting plate for a wire sawing device, wire sawing device comprising the same, and wire sawing process carried out by the device

1. A wire sawing device, comprising an extruded ceramic mounting plate, the mounting plate comprising at least one groove on a face thereof; and a plurality of channels provided substantially parallel to each other and running between two opposite sides of the mounting plate,

at least one layer of wires stretched out between at least two wire guide cylinders, the layer of wires being held in place by disposed in grooves provided on the surface of the wire guide cylinders and being adapted to move while bearing against at least one piece to be sawed that is fastened to at least one support table;

a displacement device adapted to provide relative forward movement between the at least one piece to be sawed and the layer of wires;

a fastening device for fastening said at least one piece to be sawed to a carriage adapted to cooperate with a guide rail of said support table, wherein the fastening device comprises the mounting plate to which the at least one piece to be sawed is bonded; and

an anchoring device for anchoring the mounting plate directly on the carriage.

2. The wire sawing device of claim 1 , wherein the anchoring device comprises at least one groove formed in the mounting plate and at least one skid configured to slide in the groove, wherein the groove and the skid have complementary profiles.

3. The wire sawing device of claim 2 , wherein the skid comprises at least one threaded hole designed to receive an anchoring screw going through the carriage.

4. The wire sawing device of claim 2 , wherein the mounting plate comprises at least one channel formed in the mounting plate and extending between two opposite sides of the mounting plate in a direction perpendicular to wires in the at least one layer of wires.

5. The wire sawing device of claim 4 , wherein the at least one channel is located close to a bonding face of the mounting plate to which the at least one piece to be sawed is bonded, so that the at least one layer of wires penetrate into said mounting plate down to the at least one channel after having gone through the at least one piece to be sawed.

6. The wire sawing device of claim 4 , in which the channel is connected with at least one fluid delivery.

7. A process of wire sawing at least one piece, comprising sawing the at least one piece using a wire sawing device that comprises a mounting plate that is formed by extrusion of a ceramic material and at least one groove formed on a face of the mounting plate; and

a plurality of channels that are substantially parallel to each other and extending between two opposite sides of the mounting plate.

8. The process according to of claim 7 , wherein the wire sawing the at least one piece is performed by use of at least one layer of wires stretched out between at least two wire guide cylinders, wherein the at least one layer of wires is disposed in grooves formed on the surface of the wire guide cylinders, and

wherein sawing the at least one piece further comprises creating relative motion between the at least one layer of wires and the at least one piece while bearing the at least one piece, which is fastened to at least one support table and bonded to the mounting plate, against the at least one layer of wires to cause the wires of the layer of wires form sawing slots in the at least one piece.

9. The process of claim 8 , further comprising circulating a cooling fluid through the plurality of channels when the wires in the layer of wires reach a depth in the at least one piece.

10. The process of claim 8 , further comprising flowing a washing or rinsing liquid in the plurality of channels when the wires of the layer of wires penetrate at least one channel of the plurality of channels formed in the mounting plate to cause the flowing of washing or rinsing liquid to flow into the sawing slots.

11. The process of claim 8 , further comprising flowing a heating fluid in the plurality of channels to provide heat to the mounting plate to facilitate the detachment of the slices from the mounting plate.

12. The wire sawing device according to of claim 1 , wherein the plurality of channels are formed in the bulk of the mounting plate.

13. The process of claim 7 , wherein the plurality of channels are formed in the mounting plate.