SEAMLESS MOLD MANUFACTURING METHOD
A seamless mold manufacturing method of the invention is a seamless mold manufacturing method having the steps of forming a thermal reaction type resist layer on a sleeve-shaped mold, and exposing using a laser and developing the thermal reaction type resist layer and thereby forming a fine mold pattern, and is characterized in that the thermal reaction type resist layer is comprised of a thermal reaction type resist having a property of reacting in predetermined light intensity or more in a light intensity distribution in a spot diameter of the laser.
1 - 25 . (canceled)
26 . A seamless mold manufacturing method comprising:
forming a thermal reaction type resist layer on a sleeve-shaped mold; and
forming a fine mold pattern on the thermal reaction type resist layer using a laser,
wherein the thermal reaction type resist layer is comprised of a thermal reaction type resist material having a property of reacting in predetermined light intensity or more in a light intensity distribution in a spot diameter of the laser.
27 . A seamless mold manufacturing method comprising:
forming a thermal reaction type resist layer on a sleeve-shaped mold; and
forming a fine mold pattern on the thermal reaction type resist layer using a laser,
wherein the thermal reaction type resist layer is comprised of a thermal reaction type resist material having a temperature distribution including a region where the resist reacts at a predetermined temperature or more in a spot diameter of the laser.
28 . The seamless mold manufacturing method according to claim 26 or 27 , further comprising:
forming an etching layer on the sleeve-shaped mold before forming the thermal reaction type resist layer on the sleeve-shaped mold;
etching the etching layer using the fine mold pattern as a mask; and removing the fine mold pattern.
29 . The seamless mold manufacturing method according to claim 26 , wherein the thermal reaction type resist is an organic resist or an inorganic resist.
30 . The seamless mold manufacturing method according to claim 26 , wherein the thermal reaction type resist is comprised of an imperfect oxide of an element selected from the group consisting of transition metals and group-XII to group-XV elements, and a boiling point of a primary fluoride of the element is 200° C. or more.
31 . The seamless mold manufacturing method according to claim 30 , wherein the transition metals are elements selected from the group consisting of Ti, Cr, Mn, Fe, Co, Ni, Cu, Zr, Nb, Rh, Ag, Hf, Ta and Au.
32 . The seamless mold manufacturing method according to claim 30 or 31 , wherein the group-XII to group-XV elements are elements selected from the group consisting of Al, Zn, Ga, In, Sn, Sb, Pb and Bi.
33 . The seamless mold manufacturing method according to claim 30 , wherein the transition metals are elements selected from the group consisting of Ti, Cr, Mn, Co, Cu, Nb, Ag, Ta and Au, and the group-XII to group-XV elements are elements selected from the group consisting of Sn, Pb and Bi.
34 . The seamless mold manufacturing method according to claim 28 , wherein the etching layer is comprised of a material selected from the group consisting of Si, Ta, and oxides, nitrides and carbides of Si and Ta.
35 . The seamless mold manufacturing method according to claim 26 , wherein a film thickness of the thermal reaction type resist layer has a fluctuation range of ±20 nm or less in a circumference of the sleeve in the film thickness.
36 . The seamless mold manufacturing method according to claim 26 , wherein the thermal reaction type resist layer is comprised of at least two layers.
37 . The seamless mold manufacturing method according to claim 28 , further comprising:
forming a heat absorption layer above the etching layer.
38 . The seamless mold manufacturing method according to claim 37 , wherein forming the heat absorption layer on or under the etching layer is before forming the thermal reaction type resist layer on the etching layer.
39 . The seamless mold manufacturing method according to claim 28 , further comprising:
forming a heat insulating layer on the sleeve-shaped mold before forming the etching layer on the sleeve-shaped mold.
40 . The seamless mold manufacturing method according to claim 26 , wherein a method of forming any one of the thermal reaction type resist layer, the etching layer and the heat absorption layer is foamed by a sputtering method, a deposition method or a CVD method.
41 . The seamless mold manufacturing method according to claim 26 , wherein a beam shape of the laser is an elliptical shape in exposure using the laser.
42 . The seamless mold manufacturing method according to claim 28 , wherein in etching the etching layer, a dry etching apparatus is used in which a counter electrode is arranged in a position opposed to the sleeve-shaped mold surface in a vacuum chamber.
43 . A dry etching apparatus as described in claim 42 , wherein a counter electrode is arranged in a position opposed to the sleeve-shaped mold surface in a vacuum chamber.
44 . The dry etching apparatus according to claim 43 , wherein a shape of the counter electrode is a shape selected from a cylindrical shape, a parallel flat-plate shape, and an arc shape.
45 . The dry etching apparatus according to claim 43 , wherein the dry etching apparatus has a function of rotating the sleeve-shaped mold on the center axis.
46 . A seamless mold, wherein the mold is manufactured by the seamless mold manufacturing method according to claim 26 , and a fine shape is formed on a surface of the mold.
47 . A manufacturing method of a continuous film having a fine concavo-convex pattern on a surface of the film without a seam, wherein the film is manufactured using the seamless mold according to claim 46 .
48 . A film having a fine concavo-convex pattern on a surface of the film, wherein the film is manufactured by the manufacturing method according to claim 47 .
49 . A seamless mold, wherein a size of a fine shape of a surface of the mold is 1 μm or less.
50 . A manufacturing method of a continuous film having a fine shape pattern of 1 μm or less on a surface of the film without a seam, wherein the seamless mold according to claim 49 is used.
51 . A film having a fine shape pattern, wherein the film is fabricated using the manufacturing method according to claim 50 .